Title:
WIRING MODULE AND IMAGING DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/010173
Kind Code:
A1
Abstract:
The wiring module according to an embodiment of the present technology comprises a wiring board and a heat dissipation member. The wiring board has: a body part that has an obverse-surface layer to which an element package is connected, and a reverse-surface layer on the opposite side from the obverse-surface layer; and one or more heat dissipation vias that penetrate the body part from the obverse-surface layer toward the reverse-surface layer. The heat dissipation member is connected to the reverse-surface layer so as to thermally bond with the one or more heat dissipation vias.
Inventors:
YAMASHITA YUTARO (JP)
Application Number:
PCT/JP2020/025944
Publication Date:
January 21, 2021
Filing Date:
July 02, 2020
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01L23/36; H05K1/02; H05K3/46; H05K7/20
Domestic Patent References:
| WO2018216627A1 | 2018-11-29 |
Foreign References:
| JP2012182395A | 2012-09-20 | |||
| JPH08204072A | 1996-08-09 | |||
| JP2017184035A | 2017-10-05 |
Attorney, Agent or Firm:
OMORI, Junichi (JP)
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