Title:
WIRING STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2014/069662
Kind Code:
A1
Abstract:
Provided is a multilayer wiring structure which is provided with a substrate, lower layer Cu wiring, upper layer Cu wiring, and a via connection part. The lower layer Cu wiring is arranged on the substrate. The upper layer Cu wiring is arranged on an insulation layer which includes an inorganic material film positioned on the lower layer Cu wiring, and an organic resin material film positioned on the inorganic material film. The via connection part is arranged in a via connection hole which penetrates up to the insulation layer of the region where the lower layer Cu wiring and the upper layer Cu wiring overlap. Further, the via connection part includes a barrier conductive layer which is arranged on the lower layer Cu wiring that is exposed at the bottom of the via connection hole and on the inner wall of the via connection hole. Further, the value of the dielectric constant of the material configuring the inorganic material film is less than the value of the dielectric constant of the material configuring the inorganic material film.
Inventors:
KUDO HIROSHI (JP)
TAKANO TAKAMASA (JP)
TAKANO TAKAMASA (JP)
Application Number:
PCT/JP2013/079910
Publication Date:
May 08, 2014
Filing Date:
November 05, 2013
Export Citation:
Assignee:
DAINIPPON PRINTING CO LTD (JP)
International Classes:
H01L21/768; H01L21/312; H01L21/3205; H01L23/12; H01L23/32; H01L23/522; H01L23/532; H05K3/46
Domestic Patent References:
| WO2000044043A1 | 2000-07-27 |
Foreign References:
| JPH02125447A | 1990-05-14 | |||
| JP2000332107A | 2000-11-30 | |||
| JPH11168141A | 1999-06-22 | |||
| JPH11354635A | 1999-12-24 | |||
| JP2000216264A | 2000-08-04 |
Attorney, Agent or Firm:
Takahashi, Hayashi and Partner Patent Attorneys, Inc. (JP)
Patent business corporation Takahashi and wood and partners (JP)
Patent business corporation Takahashi and wood and partners (JP)
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