Title:
WIRING SUBSTRATE, ARRAY SUBSTRATE, AND LIGHT EMITTING MODULE
Document Type and Number:
WIPO Patent Application WO/2022/160220
Kind Code:
A1
Abstract:
Provided in the present disclosure are a wiring substrate, an array substrate, and a light emitting module, relating to the technical field of display. The wiring substrate comprises a base substrate, a first metal wiring layer, and an insulating material layer stacked in sequence, the first metal wiring layer being provided with a plurality of drive leads extending along a first direction, and the insulating material layer being provided with a plurality of through holes exposing the drive leads. By means of adjusting the position of the drive leads and the position of the through holes, the present wiring substrate can be suitable for different microchips, and can thus be used for the preparation of different array substrates.
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Inventors:
LIU CHUNJIAN (CN)
XU ZOUMING (CN)
WANG FEIFEI (CN)
ZENG QIN (CN)
WU XINTAO (CN)
TIAN JIAN (CN)
LEI JIE (CN)
WANG JIE (CN)
ZHAN YUFEI (CN)
XU ZOUMING (CN)
WANG FEIFEI (CN)
ZENG QIN (CN)
WU XINTAO (CN)
TIAN JIAN (CN)
LEI JIE (CN)
WANG JIE (CN)
ZHAN YUFEI (CN)
Application Number:
PCT/CN2021/074260
Publication Date:
August 04, 2022
Filing Date:
January 28, 2021
Export Citation:
Assignee:
BOE TECHNOLOGY GROUP CO LTD (CN)
HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO LTD (CN)
HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO LTD (CN)
International Classes:
G02F1/13357; H05K3/34; G02F1/1362
Foreign References:
| CN104427775A | 2015-03-18 | |||
| CN212136426U | 2020-12-11 | |||
| CN112219458A | 2021-01-12 | |||
| JP2007250882A | 2007-09-27 | |||
| JP2006165196A | 2006-06-22 |
Attorney, Agent or Firm:
BEIJING INTELLEGAL INTELLECTUAL PROPERTY AGENT LTD. (CN)
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