Title:
WIRING SUBSTRATE, COMPONENT MOUNTING WIRING SUBSTRATE, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING WIRING SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2019/044857
Kind Code:
A1
Abstract:
According to an embodiment of the present disclosure, provided is a wiring substrate that includes: a substrate; an insulating layer on the substrate; a height adjustment unit provided within the insulating layer; a first electrically conductive part provided on the insulating layer; and a second electrically conductive part adjacent to the electrically conductive part, provided on the insulating layer and the height adjustment unit, wherein the height from the substrate top surface to the top surface of the first electrically conductive part and the height from the top surface of the substrate to the top surface of the second electrically conductive part approximately match. In the wiring substrate, the height adjustment unit can also be a dummy via part that is adjacent to a via part placed on a lower part wiring, and is provided within the insulating layer. Also, in the wiring substrate, the first electrically conductive part and the second electrically conductive part configure an Nth wiring layer among multi-layer wiring layers made by laminating first to Nth (where N is an integer of 2 or more) wiring layers in this order, and the height adjustment unit, at the lower part in the lamination direction of the second electrically conductive part, may be provided at least on a portion of the electrically conductive parts configuring the respective first to N–1th wiring layers.
Inventors:
TAKAHASHI NAOHIRO (JP)
SAKAKI MASASHI (JP)
OHTA KEIGO (JP)
MAWATARI HIROSHI (JP)
TAWARAYA SEIJI (JP)
SAKAKI MASASHI (JP)
OHTA KEIGO (JP)
MAWATARI HIROSHI (JP)
TAWARAYA SEIJI (JP)
Application Number:
PCT/JP2018/031835
Publication Date:
March 07, 2019
Filing Date:
August 28, 2018
Export Citation:
Assignee:
DAINIPPON PRINTING CO LTD (JP)
International Classes:
H05K3/18; H01L23/12; H05K1/18; H05K3/46
Foreign References:
| JP2001093935A | 2001-04-06 | |||
| US20140167254A1 | 2014-06-19 | |||
| JP2011228632A | 2011-11-10 | |||
| JP2008160042A | 2008-07-10 | |||
| JP2002368383A | 2002-12-20 |
Attorney, Agent or Firm:
TAKAHASHI, HAYASHI AND PARTNER PATENT ATTORNEYS, INC. (JP)
Download PDF: