Title:
WIRING SUBSTRATE, ELECTRONIC DEVICE PACKAGE, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/155053
Kind Code:
A1
Abstract:
A wiring substrate or the like which is equipped with an insulating substrate having a first surface containing an aluminum oxide sintered body and a mullite sintered body, and is also equipped with a metallized layer having a second surface section that contains a manganese compound and/or a molybdenum compound and is adjacent to the first surface section of the insulating substrate, wherein the first surface section of the insulating substrate and the second surface section of the metallized layer contain a manganese silicate phase and/or a magnesium silicate phase.
Inventors:
KIRIKIHIRA ISAMU (JP)
YAMAMOTO MAKOTO (JP)
YAMAMOTO MAKOTO (JP)
Application Number:
PCT/JP2018/002148
Publication Date:
August 30, 2018
Filing Date:
January 24, 2018
Export Citation:
Assignee:
KYOCERA CORP (JP)
International Classes:
H01L23/13; H01L23/02; H01L23/12; H05K1/03; H05K1/09; H05K3/38
Domestic Patent References:
| WO2014077136A1 | 2014-05-22 |
Other References:
See also references of EP 3588551A4
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