Title:
WIRING SUBSTRATE AND INKJET HEAD
Document Type and Number:
WIPO Patent Application WO/2015/080033
Kind Code:
A1
Abstract:
The present invention improves the flatness of a surface on which wiring is formed. A wiring substrate (6) on which a wiring surface (600), on which lower wiring (6g) for transmitting electricity is formed, is arranged facing another member, wherein the wiring surface on the substrate main body has a wiring area (A1) in which the lower wiring is formed, and a non-wiring area (A2) in which no lower wiring is formed and an inlet (6i) is provided so as to face an opening in the other member, and the non-wiring area and wiring area have substantially equivalent positions relative to the other member.
Inventors:
TSUKANO JUN (JP)
Application Number:
PCT/JP2014/080863
Publication Date:
June 04, 2015
Filing Date:
November 21, 2014
Export Citation:
Assignee:
KONICA MINOLTA INC (JP)
International Classes:
B41J2/14; B41J2/16; H05K1/02
Foreign References:
| JP2011115972A | 2011-06-16 | |||
| JPH02206193A | 1990-08-15 | |||
| JPS59224194A | 1984-12-17 | |||
| JPS6429866U | 1989-02-22 | |||
| JP2012179785A | 2012-09-20 | |||
| JP2010147119A | 2010-07-01 | |||
| JP2009126146A | 2009-06-11 | |||
| JP2012179889A | 2012-09-20 |
Attorney, Agent or Firm:
KOYO INTERNATIONAL PATENT FIRM (JP)
Patent business corporation Mitsuaki international patent firm (JP)
Patent business corporation Mitsuaki international patent firm (JP)
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