Title:
WIRING SUBSTRATE AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO2017010063
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a wiring substrate that, when a light-transmissive section is formed therein, inhibits the occurrence of a crack in a base material, has high light transmittance, and allows formation of micro wiring, as well as a method for manufacturing the same. A wiring substrate according to the present invention is provided with: a base material having light transmittance; a laminate formed by laminating a metal layer and a resin layer on at least one side of the base material; and a light-transmissive section in the form of an opening provided in a part of the laminate. The wiring substrate is characterized in that at least a part of the lateral surface defining the light-transmissive section is formed of the resin layer and that, in the vicinity of the front surface of the base material, a part of the metal layer is disposed so as to neighbor the resin layer constituting the at least part of the lateral surface defining the light-transmissive section and to surround that resin layer.
Inventors:
TSUCHIDA TETSUYUKI
Application Number:
PCT/JP2016/003218
Publication Date:
January 19, 2017
Filing Date:
July 06, 2016
Export Citation:
Assignee:
TOPPAN PRINTING CO LTD (JP)
International Classes:
H01L27/14; H01L23/12; H01L23/15; H05K1/02
Foreign References:
| JP2010165939A | 2010-07-29 | |||
| JP2005158948A | 2005-06-16 | |||
| JP2012169489A | 2012-09-06 | |||
| JP2004309532A | 2004-11-04 |
Attorney, Agent or Firm:
OGASAWARA PATENT OFFICE (JP)
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