WIRING SUBSTRATE AND METHOD FOR MANUFACTURING SAME

WIPO Patent Application WO/2019/074111

A1

A wiring substrate comprises: a stretchable base material; wiring positioned on one surface side of the base material, the wiring having a meandering shape section that includes a plurality of peak sections and valley sections in which the peak sections and valley sections in the normal direction of the first surface of the base material are aligned along a first direction that is one in-plane direction of the first surface of the base material; and a stretching control mechanism that controls stretching of the base material. The base material has, when viewed along the normal direction of the first surface of the base material: a component region that includes a component-fixing region overlapping the electronic components mounted on the wiring substrate, and a component-surrounding region positioned around the component-fixing region; and a wiring region adjacent to the component region. The stretching control mechanism is positioned in the component-surrounding region and includes at least a stretching control part that widens to the border between the component-surrounding region and the component-fixing region.

OKIMOTO NAOKO (JP)
OGAWA KENICHI (JP)
SOMEYA TAKAO (JP)

PCT/JP2018/038175

April 18, 2019

October 12, 2018

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DAINIPPON PRINTING CO LTD (JP)
UNIV TOKYO (JP)

H05K1/02; H01B7/06; H05K1/03; H05K3/00

US20140299362A1	2014-10-09
KR20140058239A	2014-05-14
US20120052268A1	2012-03-01
JP2016509375A	2016-03-24
US20140218872A1	2014-08-07
KR20090092982A	2009-09-02
JP2013187308A	2013-09-19
JP2007281406A	2007-10-25

See also references of EP 3697179A4

NAGAI Hiroshi et al. (JP)

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