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Patent Searching and Data


Title:
WIRING SUBSTRATE AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2019/172123
Kind Code:
A1
Abstract:
This method for producing a wiring substrate comprises: a wiring line formation step wherein a wiring pattern is formed on a surface of a first insulating layer, said surface being on one side in the thickness direction; an electrodeposition step wherein the wiring pattern is covered by a second insulating layer by means of electrodeposition; and a magnetic layer arrangement step wherein a magnetic layer is arranged on surfaces of the first insulating layer and the second insulating layer, said surfaces being on one side in the thickness direction.

Inventors:
OKUMURA, Keisuke (1-2 Shimo-hozumi 1-chome, Ibaraki-sh, Osaka 80, 〒5678680, JP)
Application Number:
JP2019/008112
Publication Date:
September 12, 2019
Filing Date:
March 01, 2019
Export Citation:
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Assignee:
NITTO DENKO CORPORATION (1-2 Shimo-hozumi 1-chome, Ibaraki-shi Osaka, 80, 〒5678680, JP)
International Classes:
H01F41/04; H01F17/00; H01F17/04; H05K1/16
Foreign References:
JPS6392005A1988-04-22
JP2015082660A2015-04-27
JP2001044589A2001-02-16
JP2014192287A2014-10-06
US20180137975A12018-05-17
Attorney, Agent or Firm:
OKAMOTO, Hiroyuki et al. (Central Shin-Osaka Building 3rd Floor 5-36, Miyahara 4-chome, Yodogawa-ku, Osaka-sh, Osaka 03, 〒5320003, JP)
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