Title:
WIRING SUBSTRATE AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2019/172123
Kind Code:
A1
Abstract:
This method for producing a wiring substrate comprises: a wiring line formation step wherein a wiring pattern is formed on a surface of a first insulating layer, said surface being on one side in the thickness direction; an electrodeposition step wherein the wiring pattern is covered by a second insulating layer by means of electrodeposition; and a magnetic layer arrangement step wherein a magnetic layer is arranged on surfaces of the first insulating layer and the second insulating layer, said surfaces being on one side in the thickness direction.
Inventors:
OKUMURA KEISUKE (JP)
Application Number:
PCT/JP2019/008112
Publication Date:
September 12, 2019
Filing Date:
March 01, 2019
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
H01F41/04; H01F17/00; H01F17/04; H05K1/16
Foreign References:
| JPS6392005A | 1988-04-22 | |||
| JP2015082660A | 2015-04-27 | |||
| JP2001044589A | 2001-02-16 | |||
| JP2014192287A | 2014-10-06 | |||
| US20180137975A1 | 2018-05-17 |
Attorney, Agent or Firm:
OKAMOTO, Hiroyuki et al. (JP)
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