Title:
WIRING SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2021/038951
Kind Code:
A1
Abstract:
A wiring substrate 10 according to the present disclosure is provided with: a dielectric substrate 20; and a first wiring line 60 and a second wiring line 70, into each of which a differential signal is inputted. The dielectric substrate 20 is configured by stacking a plurality of insulating layers; a first pad 61 and a second pad 71, said pads being connected to an element 11, are arranged on a first insulating layer 21 that is positioned at an end in the stacking direction among the plurality of insulating layers; the first wiring line 60 is provided with a first through conductor 62 and a first planar conductor 63; and the second wiring line 70 is provided with a second through conductor which penetrates through the insulating layers in an element connection part 30, while extending in the stacking direction, and a second planar conductor 73 which extends in a direction that is perpendicular to the stacking direction along the first insulating layer 21 in the element connection part 30, or alternatively along an insulating layer that is closer to the first insulating layer 21 than the first planar conductor 63 in the element connection part 30.
Inventors:
KOBAYASHI HIROKI (JP)
Application Number:
PCT/JP2020/016784
Publication Date:
March 04, 2021
Filing Date:
April 16, 2020
Export Citation:
Assignee:
NGK SPARK PLUG CO (JP)
International Classes:
H01P3/02; H01L23/12; H05K3/46
Foreign References:
| JP2015088642A | 2015-05-07 | |||
| JP2008186918A | 2008-08-14 | |||
| JP2007142307A | 2007-06-07 | |||
| JP2013225544A | 2013-10-31 | |||
| JP2011138845A | 2011-07-14 |
Attorney, Agent or Firm:
AKATSUKI UNION PATENT FIRM (JP)
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