Title:
WIRING SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2022/224473
Kind Code:
A1
Abstract:
A wiring substrate comprising a substrate, conductor wiring provided on the substrate, and an insulator located in at least a part of the periphery of the conductor wiring, wherein the insulator contains a magnetic material.
Inventors:
URASHIMA KOSUKE (JP)
YONEKURA MOTOKI (JP)
ARIFUKU MOTOHIRO (JP)
KOTAKE TOMOHIKO (JP)
MIZUSHIMA ETSUO (JP)
YONEKURA MOTOKI (JP)
ARIFUKU MOTOHIRO (JP)
KOTAKE TOMOHIKO (JP)
MIZUSHIMA ETSUO (JP)
Application Number:
PCT/JP2021/042015
Publication Date:
October 27, 2022
Filing Date:
November 16, 2021
Export Citation:
Assignee:
SHOWA DENKO MATERIALS CO LTD (JP)
International Classes:
H01L23/12; H05K1/02; H05K3/28; H05K9/00
Domestic Patent References:
| WO2014034103A1 | 2014-03-06 | |||
| WO2010053185A1 | 2010-05-14 |
Foreign References:
| JPH10242602A | 1998-09-11 | |||
| JPH0817656A | 1996-01-19 | |||
| JPH05160344A | 1993-06-25 | |||
| JP2000040893A | 2000-02-08 | |||
| JP2004056144A | 2004-02-19 | |||
| JPH05315732A | 1993-11-26 | |||
| JP2021016006A | 2021-02-12 | |||
| JP2002012667A | 2002-01-15 | |||
| JP2000319386A | 2000-11-21 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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