Title:
WLCSP-BASED MINIATURE THERMOPILE INFRARED SENSOR AND PREPARATION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2023/241151
Kind Code:
A1
Abstract:
Provided in the present invention are a WLCSP-based miniature thermopile infrared sensor and a preparation method therefor. By means of combining a wafer-level chip technique with a wafer-level optical technique, a semiconductor infrared lens can be integrated with a thermopile infrared sensor, and the performance of the thermopile infrared sensor can be improved by means of vacuum bonding or airtight bonding; moreover, by means of a signal processing circuit, a TSV conductive column and a solder ball, a signal of the thermopile infrared sensor can be led out from the back. In the present invention, an on-chip integrated infrared lens can be realized, thereby improving the use convenience; an on-chip integrated signal processing circuit can be realized, thereby improving the level of integration of a device; moreover, the volume of a thermopile infrared sensor is reduced from two aspects, i.e., the infrared lens and a signal wire; and by means of a bare chip packaging technique, the size of a packaged miniature thermopile infrared sensor and the size of a thermopile infrared sensor chip are kept consistent, such that the thermopile infrared sensor can be suitable for application scenarios with very high sensor volume requirements, such as smart wearing.
Inventors:
XU DEHUI (CN)
Application Number:
PCT/CN2023/082770
Publication Date:
December 21, 2023
Filing Date:
March 21, 2023
Export Citation:
Assignee:
SHANGHAI SUNSHINE TECH CO LTD (CN)
International Classes:
B81B7/00; H10N10/00; B81B7/02; G01J1/02; H10N10/17; H10N19/00
Foreign References:
| CN115101654A | 2022-09-23 | |||
| JP2007171174A | 2007-07-05 | |||
| JP2007227676A | 2007-09-06 | |||
| CN105190892A | 2015-12-23 | |||
| CN104157719A | 2014-11-19 | |||
| CN113363331A | 2021-09-07 |
Attorney, Agent or Firm:
SHANGHAI ZHONGXIANG HEYI INTELLECTUAL PROPERTY AGENCY CO., LTD (CN)
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