Title:
WOODEN BOARD
Document Type and Number:
WIPO Patent Application WO/2013/183174
Kind Code:
A1
Abstract:
Provided is a wooden board that has high dust adhesive properties for suppressing refloating of house dust or other dust, and from which the attached dust can be removed by general cleaning. The wooden board is provided with a plate-shaped wooden base and one or more functional layers formed on the surface of the wooden base. The layer forming the surface of the functional layer is a coating film of a coating material containing a resin coating material used as a base and a silicone oil that has a chain structure formed by siloxane bonds and has functional groups to be bonded with the resin coating material used as the base at at least two ends of the structure including the chain structure.
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Inventors:
ASADA TEPPEI (JP)
TSUKAMOTO SEISUKE (JP)
SUZUKI SHINICHI (JP)
TSUKAMOTO SEISUKE (JP)
SUZUKI SHINICHI (JP)
Application Number:
PCT/JP2012/074509
Publication Date:
December 12, 2013
Filing Date:
September 25, 2012
Export Citation:
Assignee:
PANASONIC CORP (JP)
International Classes:
B32B21/08; B27D5/00; B27M1/00; B27M3/00; C09D7/65; C09D201/00
Foreign References:
| JP2010053239A | 2010-03-11 | |||
| JP2002030268A | 2002-01-31 | |||
| JP2003211586A | 2003-07-29 |
Attorney, Agent or Firm:
NISHIZAWA TOSHIO (JP)
Toshio Nishizawa (JP)
Toshio Nishizawa (JP)
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