Title:
WORD LINE LEAD-OUT STRUCTURE AND PREPARATION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2021/238696
Kind Code:
A1
Abstract:
The present application relates to a word line lead-out structure and a preparation method therefor. The preparation method comprises: forming, on a substrate, a word line which extends in an X-axis direction; forming a contact hole which covers the word line in a Y-axis direction, with the X-axis direction being perpendicular to the Y-axis direction; and forming a metal wire which covers the contact hole, with the contact hole being located between the word line and the metal wire and being separately in contact with the word line and the metal wire, wherein the contact area of the contact hole and the metal wire is greater than the contact area of the contact hole and the word line.
Inventors:
LIU CHIHCHENG (CN)
Application Number:
PCT/CN2021/094069
Publication Date:
December 02, 2021
Filing Date:
May 17, 2021
Export Citation:
Assignee:
CHANGXIN MEMORY TECH INC (CN)
International Classes:
H01L23/528; H01L21/768; H01L27/105
Foreign References:
| CN110021599A | 2019-07-16 | |||
| CN1401139A | 2003-03-05 | |||
| CN110931489A | 2020-03-27 | |||
| US20160027796A1 | 2016-01-28 | |||
| JP2002231906A | 2002-08-16 | |||
| CN202010468064A | 2020-05-28 |
Attorney, Agent or Firm:
ADVANCE CHINA IP LAW OFFICE (CN)
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