Title:
WORK CUTTING METHOD AND WIRE SAW
Document Type and Number:
WIPO Patent Application WO/2010/010656
Kind Code:
A1
Abstract:
Provided are a work cutting method and a wire saw, wherein the work cutting method gives reciprocating motion in the axial direction to a wire wound on a plurality of grooved rollers, places a backing plate in contact with the work to be cut, holds the work by a work holder with a work plate therebetween to hold the backing plate, presses down relatively on the work held by the holder while slurry is fed from a nozzle to the wire, and pushes against and feeds in the work to be cut by the wire in reciprocating motion, and cuts the work into a wafer shape, and the work cutting method cuts the work at a distance between the bottom surface of the work holder and the top edge of the work of at least 40 mm. Therefore, the slurry sprayed from the work is rebounded by the lower surface of the work holder and the forceful falling to the work and the wire can be suppressed. As a result, a work cutting method and a wire saw which can lessen the warping of the wafer being cut are provided.
Inventors:
KITAGAWA, Koji (Shin-Etsu Handotai Co. Ltd., 150, Aza Ohira, Oaza Odakura, Nishigo-mura, Nishishirakawa-gu, Fukushima 61, 〒9618061, JP)
Application Number:
JP2009/002768
Publication Date:
January 28, 2010
Filing Date:
June 18, 2009
Export Citation:
Assignee:
Shin-Etsu Handotai Co.,Ltd. (6-2 Ohtemachi 2-chome, Chiyoda-ku Tokyo, 04, 〒1000004, JP)
信越半導体株式会社 (〒04 東京都千代田区大手町二丁目６番２号 Tokyo, 〒1000004, JP)
信越半導体株式会社 (〒04 東京都千代田区大手町二丁目６番２号 Tokyo, 〒1000004, JP)
International Classes:
B24B27/06; H01L21/304; B24B27/06; H01L21/02
Attorney, Agent or Firm:
YOSHIMIYA, Mikio (1st Shitaya Bldg. 8F, 6-11 Ueno 7-chome, Taito-k, Tokyo 05, 〒1100005, JP)
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