WORK HOLDING PANEL FOR POLISHING, AND DEVICE AND METHOD FOR POLISHING

Title:

WORK HOLDING PANEL FOR POLISHING, AND DEVICE AND METHOD FOR POLISHING

Document Type and Number:

WIPO Patent Application WO/2001/072471

Kind Code:

A1

Abstract:

A work holding panel for polishing (1) comprising a work holding panel main body (2) having a plurality of through holes (4) for holding at least a work by vacuum sucking and a rear plate (5) disposed on the rear side of the main body (2), characterized by comprising a temperature control means or a cooling means for the holding panel main body (2), whereby even when the number of polishing is increased when the work is polished, the thermal deformation of the work holding panel main body itself and the deformation of a resin film covered on a work holding surface can be suppressed without deteriorating the flatness of the work so as to provide the work having an excellent flatness; and a device and a method for polishing.

Inventors:

OKAMURA KOUICHI (JP)
TAMAI NOBORU (JP)
MORITA KOUZI (JP)
MASUMURA HISASHI (JP)

Application Number:

PCT/JP2001/002452

Publication Date:

October 04, 2001

Filing Date:

March 27, 2001

Export Citation:

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Assignee:

SHINETSU HANDOTAI KK (JP)
OKAMURA KOUICHI (JP)
TAMAI NOBORU (JP)
MORITA KOUZI (JP)
MASUMURA HISASHI (JP)

International Classes:

B24B37/12; B24B37/015; B24B37/27; B24B37/30; B24B49/14; H01L21/304; H01L21/683; (IPC1-7): B24B37/04

Foreign References:

US5762544A	1998-06-09
JPH0929591A	1997-02-04
JPH0938856A	1997-02-10
JPH07171759A	1995-07-11

Other References: