WORK POLISHING METHOD AND WORK POLISHING DEVICE

Title:

WORK POLISHING METHOD AND WORK POLISHING DEVICE

Document Type and Number:

WIPO Patent Application WO/2001/030538

Kind Code:

A1

Abstract:

A work polishing method for polishing a plurality of workpieces by feeding a polishing liquid to a polishing cloth and causing a relative motion between work and the polishing cloth while pressing the work against the polishing cloth, characterized in that the work of which polishing has been completed with the pressing nulled is released from the polishing cloth within 45 seconds. In the case of simultaneously polishing a plurality of workpiece, preferably, only those workpieces of which polishing has been completed with the pressing nulled are released from the polishing cloths, while the polishing of the other workpieces is continued and the pressing is successively nulled and they are released from the polishing cloths. Erosion of the work surface due to the polishing liquid can be prevented, and the amount of washing liquid used in the washing process can be reduced, and in order that particles may be efficiently removed in a short time, the polishing is such that after the completion thereof the polished work has almost no pits formed on its surface and has a reduced amount of adhering particles and almost no variations thereof.

Inventors:

KODAIRA MASAO (JP)
NAKAMURA MIKIO (JP)
KIDA TAKAHIRO (JP)

Application Number:

PCT/JP2000/007546

Publication Date:

May 03, 2001

Filing Date:

October 27, 2000

Export Citation:

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Assignee:

SHINETSU HANDOTAI KK (JP)
KODAIRA MASAO (JP)
NAKAMURA MIKIO (JP)
KIDA TAKAHIRO (JP)

International Classes:

B24B37/04; (IPC1-7): B24B37/04; B24B37/00; H01L21/304

Foreign References:

JPH07201786A	1995-08-04
US5924916A	1999-07-20

Other References: