Title:
WORKPIECE CHUCK
Document Type and Number:
WIPO Patent Application WO1999034412
Kind Code:
A3
Abstract:
A workpiece chuck (10) includes an upper assembly (26) on which can be mounted a flat workpiece such as a semiconductor wafer. A lower assembly (30) is mountable to a base (48) that supports the chuck (10). A non-constraining attachment means such as vacuum, springs or resilient washers applied to the chuck (10) holds the upper assembly (26) to the lower assembly (30), the lower assembly (30) to the base (48) and can hold the wafer to the top surface (12) of the upper assembly (26). A heater (16) and a heat sink (14) can be included in the lower assembly (30) to allow for temperature cycle testing of the wafer. By holding the chuck (10) together by non-constraining means, the chuck layers can move continuously relative to each other under expansion forces caused by temperature effects. Mechanical stresses on the chuck (10) and resulting deformation of the chuck (10) and workpiece over temperature are substantially eliminated.
Inventors:
GETCHEL PAUL A
COLE KENNETH M SR
LYDEN HENRY A
COLE KENNETH M SR
LYDEN HENRY A
Application Number:
PCT/US1998/023727
Publication Date:
December 29, 1999
Filing Date:
November 09, 1998
Export Citation:
Assignee:
TEMPTRONIC CORP (US)
International Classes:
H01L21/66; B25B11/00; F28F7/00; H01L21/68; H01L21/683; H01L; (IPC1-7): F28F7/00
Foreign References:
| US5610529A | 1997-03-11 | |||
| US5578532A | 1996-11-26 | |||
| US5738165A | 1998-04-14 | |||
| US5281794A | 1994-01-25 | |||
| US5567267A | 1996-10-22 | |||
| US4781244A | 1988-11-01 | |||
| JPS58173392A | 1983-10-12 |
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