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Patent Searching and Data


Title:
WORKPIECE CUTTING METHOD AND WIRE SAW
Document Type and Number:
WIPO Patent Application WO/2013/051183
Kind Code:
A1
Abstract:
The present invention is a workpiece cutting method having a wire wound around a plurality of grooved rollers and moving reciprocatingly in the axial direction, the wire supplying a slurry whilst a workpiece is pushed downward relative to the wire, the workpiece pressing against the wire and being cut into so as to cut the workpiece into a wafer shape. This workpiece cutting method includes the steps of: preparing a grooved roller so that the distance between the position of the bottom portion of the plurality of grooves in the grooved roller and the rotational axis of the grooved roller becomes gradually shorter from the wire-supplying end to the wire-recovery end; and cutting a workpiece so that the wire at the wire-supplying end is pressed against the workpiece before the wire at the wire-recovery end. In this way, when a workpiece is cut with a wire saw, the start of cutting into the workpiece is locally thin at the wire-recovery end at which the pitch is particularly narrow, and TTV deterioration can be suppressed.

Inventors:
ITOI YUKIO (JP)
Application Number:
PCT/JP2012/005419
Publication Date:
April 11, 2013
Filing Date:
August 29, 2012
Export Citation:
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Assignee:
SHINETSU HANDOTAI KK (JP)
ITOI YUKIO (JP)
International Classes:
B28D5/04; B24B27/06; H01L21/304
Foreign References:
EP2347845A12011-07-27
JPS588558U1983-01-20
JP2010110865A2010-05-20
JP2008100298A2008-05-01
JP2000005999A2000-01-11
Attorney, Agent or Firm:
YOSHIMIYA, Mikio (JP)
Good Miya Mikio (JP)
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Claims: