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Patent Searching and Data


Title:
WORKPIECE CUTTING METHOD AND WIRE SAW
Document Type and Number:
WIPO Patent Application WO/2019/142494
Kind Code:
A1
Abstract:
The present invention is a method for cutting a workpiece with a wire saw to cut a workpiece simultaneously in a plurality of locations aligned in the axial direction by way of: forming a wire row by winding a fixed abrasive grain wire, on which abrasive grain has been fixed to the surface thereof, onto a plurality of grooved rollers; and feeding the workpiece into the wire row while the fixed abrasive grain wire travels back and forth in the axial direction. The workpiece cutting method is characterized by supplying a workpiece cutting coolant to the wire row while cutting a workpiece with the fixed abrasive grain wire and supplying a workpiece extracting coolant, different from the workpiece cutting coolant and with a higher viscosity than the workpiece cutting coolant, to the wire row when extracting the workpiece from the wire row after cutting. Thus, it is possible to provide a workpiece cutting method and a wire saw with which occurrences of saw marks caused by the wire catching on the workpiece and occurrences of wire breaks can be controlled when extracting the workpiece from the wire row after cutting.

Inventors:
KITAGAWA Koji (Shin-Etsu Handotai Co. Ltd., 150, Aza Ohira, Oaza Odakura, Nishigo-mura, Nishishirakawa-gu, Fukushima 61, 〒9618061, JP)
TOYODA Shiro (Shin-Etsu Handotai Co. Ltd., 150, Aza Ohira, Oaza Odakura, Nishigo-mura, Nishishirakawa-gu, Fukushima 61, 〒9618061, JP)
Application Number:
JP2018/043315
Publication Date:
July 25, 2019
Filing Date:
November 26, 2018
Export Citation:
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Assignee:
SHIN-ETSU HANDOTAI CO., LTD. (2-1 Ohtemachi 2-chome, Chiyoda-ku Tokyo, 04, 〒1000004, JP)
International Classes:
B24B55/02; B24B27/06; B28D5/04; B28D7/02; H01L21/304
Attorney, Agent or Firm:
YOSHIMIYA Mikio et al. (1st Shitaya Bldg. 8F, 6-11 Ueno 7-chome, Taito-k, Tokyo 05, 〒1100005, JP)
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