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Patent Searching and Data


Title:
WORKPIECE CUTTING METHOD AND WIRE SAW
Document Type and Number:
WIPO Patent Application WO/2019/146287
Kind Code:
A1
Abstract:
The present invention is a workpiece cutting method that uses a wire saw (1) for cutting a workpiece (W) simultaneously in a plurality of locations aligned in the axial direction by way of forming a wire row (12) by winding a fixed abrasive grain wire (2) on a plurality of grooved rollers (3, 3') and feeding the workpiece (W), held with a workpiece holding means (15) via a connecting member mounted to the workpiece (W), to be cut by the wire row (12) while the fixed abrasive grain wire (2) moves back and forth in the axial direction, said workpiece cutting method being characterized in that a wire abrasion member (21) made of metal and separately provided between the workpiece (W) and the workpiece holding means (15) is fed to and cut by the wire row (12) after the workpiece (W) is cut and before the workpiece (W) is extracted from the wire row (12), and the fixed abrasive grain wire (2) is abraded. Thus, provided are a workpiece cutting method and a wire saw (1) with which saw marks by the wire catching on the workpiece (W) when extracting the cut workpiece (W) from the wire row (12) and wire breaks do not occur.

Inventors:
KOBAYASHI Kenji (Shin-Etsu Handotai Co. Ltd., 150, Aza Ohira, Oaza Odakura, Nishigo-mura, Nishishirakawa-gu, Fukushima 61, 〒9618061, JP)
Application Number:
JP2018/045390
Publication Date:
August 01, 2019
Filing Date:
December 11, 2018
Export Citation:
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Assignee:
SHIN-ETSU HANDOTAI CO., LTD. (2-1 Ohtemachi 2-chome, Chiyoda-ku Tokyo, 04, 〒1000004, JP)
International Classes:
B24B27/06; B28D5/04; B28D7/04; H01L21/304
Foreign References:
JP2013094881A2013-05-20
JP2006181701A2006-07-13
JP2006123055A2006-05-18
JP2017080849A2017-05-18
JPH10217094A1998-08-18
JP2002254327A2002-09-10
JP2015185830A2015-10-22
JP2011031386A2011-02-17
Attorney, Agent or Firm:
YOSHIMIYA Mikio et al. (1st Shitaya Bldg. 8F, 6-11 Ueno 7-chome, Taito-k, Tokyo 05, 〒1100005, JP)
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