Title:
WORKPIECE CUTTING METHOD AND WORKING FLUID
Document Type and Number:
WIPO Patent Application WO/2015/151408
Kind Code:
A1
Abstract:
Provided is a workpiece cutting method for cutting a workpiece by forming a wire column with a wire that travels in the axial direction and that is wound in a helical shape between a plurality of wire guides, and supplying a working fluid containing abrasive particles to a contact section of the workpiece and the wire while pressing the workpiece onto the wire column, wherein the used abrasive particles are processed with a mixed solution of sulfuric acid and a hydrogen peroxide solution, and the processed abrasive particles are reused for cutting the workpiece. Thus, a workpiece can be cut with minimal contamination of a wafer from metal impurities when reusing abrasive particles when cutting the workpiece using a wire saw device.
Inventors:
KANBAYASHI KEIICHI (JP)
Application Number:
PCT/JP2015/001214
Publication Date:
October 08, 2015
Filing Date:
March 06, 2015
Export Citation:
Assignee:
SHINETSU HANDOTAI KK (JP)
International Classes:
B24B27/06; B24B57/02; B28D5/04; H01L21/304
Foreign References:
JP2011016185A | 2011-01-27 | |||
JP2004117354A | 2004-04-15 | |||
JP2007207679A | 2007-08-16 | |||
JPH09254145A | 1997-09-30 | |||
JP2009220269A | 2009-10-01 | |||
JP2005057054A | 2005-03-03 | |||
JP2005153035A | 2005-06-16 |
Attorney, Agent or Firm:
YOSHIMIYA, Mikio (JP)
Good Miya Mikio (JP)
Good Miya Mikio (JP)
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