Title:
WORKPIECE CUTTING METHOD
Document Type and Number:
WIPO Patent Application WO/2018/216600
Kind Code:
A1
Abstract:
This workpiece cutting method comprises: a first step for attaching an expandable sheet to the front or back surface of a workpiece; a second step for, after the first step, forming a modified region by irradiating the workpiece with a laser beam along planned cutting lines, dividing at least a part of the workpiece into a plurality of chips by expanding the expandable sheet, and forming gaps which are disposed between the plurality of chips and which each extend to a side surface, of the workpiece, intersecting the front and back surfaces; a third step for, after the second step, filling the gaps with a resin from an outer edge section including the side surface of the workpiece; a fourth step for, after the third step, curing and shrinking the resin; and a fifth step for, after the fourth step, taking the chips out from the expandable sheet.
More Like This:
Inventors:
KUCHIKI MIKIHARU (JP)
KINDA HIDEFUMI (JP)
KURITA DAISUKE (JP)
SAKAMOTO TAKESHI (JP)
OGIWARA TAKAFUMI (JP)
KONDOH YUTA (JP)
UCHIYAMA NAOKI (JP)
KINDA HIDEFUMI (JP)
KURITA DAISUKE (JP)
SAKAMOTO TAKESHI (JP)
OGIWARA TAKAFUMI (JP)
KONDOH YUTA (JP)
UCHIYAMA NAOKI (JP)
Application Number:
PCT/JP2018/019171
Publication Date:
November 29, 2018
Filing Date:
May 17, 2018
Export Citation:
Assignee:
KYORITSU CHEMICAL & CO LTD (JP)
HAMAMATSU PHOTONICS KK (JP)
HAMAMATSU PHOTONICS KK (JP)
International Classes:
H01L21/301; B23K26/16; B23K26/53
Foreign References:
| JPH02127004A | 1990-05-15 | |||
| JP2009088341A | 2009-04-23 | |||
| JP2013222936A | 2013-10-28 | |||
| JP2007165855A | 2007-06-28 | |||
| JP2016001677A | 2016-01-07 | |||
| JP2014063813A | 2014-04-10 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
Download PDF: