Title:
WORKPIECE HANDLING SHEET AND DEVICE MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2022/201765
Kind Code:
A1
Abstract:
Provided is a workpiece handling sheet 1 comprising: a substrate 12; and an boundary surface ablation layer 11 which is laminated on one surface of the substrate 12 and which can hold small workpieces and perform boundary surface ablation by irradiation with a laser beam, wherein the boundary surface ablation layer 11 contains an activation energy ray-curable component, a photoinitiator and a UV absorbing agent. This workpiece handling sheet allows for proper handling even of very small workpieces.
Inventors:
FURUNO KENTA (JP)
FUKUMOTO AKIO (JP)
WAKAYAMA YOJI (JP)
FURUKAWA YOSHIKI (JP)
FUKUMOTO AKIO (JP)
WAKAYAMA YOJI (JP)
FURUKAWA YOSHIKI (JP)
Application Number:
PCT/JP2022/000963
Publication Date:
September 29, 2022
Filing Date:
January 13, 2022
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
B32B27/00; B32B27/16; B32B27/18; C09J7/38; C09J11/06; C09J133/14; F21S2/00; G09F9/00; H01L21/301
Domestic Patent References:
| WO2019207920A1 | 2019-10-31 |
Foreign References:
| JP2020188261A | 2020-11-19 | |||
| JP2014515883A | 2014-07-03 | |||
| JP2010251359A | 2010-11-04 |
Attorney, Agent or Firm:
HAYAKAWA Yuzi et al. (JP)
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