WORKPIECE MACHINING DEVICE AND WORKPIECE MACHINING METHOD

WIPO Patent Application WO/2015/115043

A1

The present invention provides a workpiece machining device wherein a workpiece is inserted into and held in a holding hole of a carrier, an upper surface plate is moved downward to a predetermined position so that the carrier holding the workpiece is sandwiched by the upper surface plate and a lower surface plate, and both surfaces of the workpiece are machined simultaneously. The workpiece machining device is characterized by having a storage medium and a controller, wherein: the storage medium stores in advance a polishing load that is generated when the upper surface plate is moved downward to the predetermined position while the workpiece is held normally in the holding hole of the carrier; and the controller calculates a difference between the polishing load stored in the storage medium and a polishing load that is generated when the upper surface plate is moved downward to the predetermined position while the workpiece is held in the holding hole of the carrier, and determines that the workpiece is being held abnormally when the calculated difference exceeds a threshold. This makes it possible to quickly and accurately detect whether the workpiece is being held abnormally before machining of the workpiece, thereby preventing damage to the workpiece and the machining device.

YASUDA TAICHI (JP)
ENOMOTO TATSUO (JP)

PCT/JP2015/000170

August 06, 2015

January 16, 2015

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SHINETSU HANDOTAI KK (JP)

B24B37/34; B24B7/17; B24B37/08; H01L21/304

JPH02106269A	1990-04-18
JPH0425371A	1992-01-29
JP2013078826A	2013-05-02

YOSHIMIYA, Mikio (JP)
Good Miya Mikio (JP)

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