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Title:
WORKPIECE PROCESSING SHEET
Document Type and Number:
WIPO Patent Application WO/2019/203021
Kind Code:
A1
Abstract:
A workpiece processing sheet 1 provided with at least a base material 2 and an adhesive agent layer 3 stacked on a first surface side of the base material 2, wherein: the base material 2 on a second surface thereof has an arithmetic-mean coarseness (Ra) of not less than 0.01 μm and not more than 0.4 μm; the base material 2 has on the second surface thereof a maximum height coarseness (Rz) of not less than 0.01 μm and not more than 2.5 μm; and the base material 2 has a light transmittance of not less than 40% with respect to wavelength of 532 nm. The workpiece processing sheet 1 has excellent laser marking property and resistance to laser light.

Inventors:
MORITA Yuki (23-23 Honcho, Itabashi-k, Tokyo 01, 〒1730001, JP)
YAMASHITA Shigeyuki (23-23 Honcho, Itabashi-k, Tokyo 01, 〒1730001, JP)
Application Number:
JP2019/015091
Publication Date:
October 24, 2019
Filing Date:
April 05, 2019
Export Citation:
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Assignee:
LINTEC CORPORATION (23-23, Honcho Itabashi-k, Tokyo 01, 〒1730001, JP)
International Classes:
H01L21/301; B23K26/00; C09J7/20; C09J7/38; C09J201/00
Attorney, Agent or Firm:
HAYAKAWA Yuzi et al. (Sansui Patent Firm, 4th Floor Akasaka Wing Bldg., 6-6-15, Akasaka, Minato-k, Tokyo 52, 〒1070052, JP)
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