Title:
WORKPIECE PROCESSING SHEET
Document Type and Number:
WIPO Patent Application WO/2019/203021
Kind Code:
A1
Abstract:
A workpiece processing sheet 1 provided with at least a base material 2 and an adhesive agent layer 3 stacked on a first surface side of the base material 2, wherein: the base material 2 on a second surface thereof has an arithmetic-mean coarseness (Ra) of not less than 0.01 μm and not more than 0.4 μm; the base material 2 has on the second surface thereof a maximum height coarseness (Rz) of not less than 0.01 μm and not more than 2.5 μm; and the base material 2 has a light transmittance of not less than 40% with respect to wavelength of 532 nm. The workpiece processing sheet 1 has excellent laser marking property and resistance to laser light.
Inventors:
MORITA YUKI (JP)
YAMASHITA SHIGEYUKI (JP)
YAMASHITA SHIGEYUKI (JP)
Application Number:
PCT/JP2019/015091
Publication Date:
October 24, 2019
Filing Date:
April 05, 2019
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
H01L21/301; B23K26/00; C09J7/20; C09J7/38; C09J201/00
Domestic Patent References:
| WO2015178346A1 | 2015-11-26 | |||
| WO2016088677A1 | 2016-06-09 |
Foreign References:
| JP2012015236A | 2012-01-19 | |||
| JP2012169441A | 2012-09-06 | |||
| JP2010073897A | 2010-04-02 | |||
| JP2006140348A | 2006-06-01 | |||
| JP2014189563A | 2014-10-06 |
Other References:
R A, R Z, RMAX (R Z J I S, 22 March 2011 (2011-03-22), Retrieved from the Internet [retrieved on 20190619]
28 April 2016 (2016-04-28), Retrieved from the Internet [retrieved on 20190619]
30 March 2010 (2010-03-30), Retrieved from the Internet [retrieved on 20190619]
28 April 2016 (2016-04-28), Retrieved from the Internet
30 March 2010 (2010-03-30), Retrieved from the Internet
Attorney, Agent or Firm:
HAYAKAWA Yuzi et al. (JP)
Download PDF: