Title:
WORKPIECE THICKNESS MEASUREMENT DEVICE, MEASURE METHOD, AND WORKPIECE POLISHING DEVICE
Document Type and Number:
WIPO Patent Application WO/2015/105055
Kind Code:
A1
Abstract:
A workpiece thickness measurement device is provided with: a liquid immersion device that immerses at least one part of a workpiece in a liquid after polishing; and two or more measurement devices that are arranged to face each other and that are capable of measuring the distance to the surface of the workpiece that is immersed in the liquid. Also provided is a workpiece thickness measurement method comprising: a step in which at least one part of a workpiece is immersed in a liquid after polishing; and a step in which the thickness of the workpiece is measured while at least one part of the workpiece is immersed in the liquid, said workpiece being measured by two or more measurement devices that are arranged to face each other and that are capable of measuring the distance to the surface of the workpiece that is immersed in the liquid. Also provided is a workpiece polishing device comprising: a reception unit that receives information regarding the thickness of the workpiece, said thickness being measured by the abovementioned measurement device or the measurement method; and a calculation unit that corrects the switching of a polishing recipe or a polishing condition parameter on the basis of the information regarding the thickness of the workpiece.
Inventors:
FUKUHARA FUMIYA (JP)
Application Number:
PCT/JP2015/000080
Publication Date:
July 16, 2015
Filing Date:
January 09, 2015
Export Citation:
Assignee:
SUMCO CORP (JP)
International Classes:
B24B49/03; B23Q17/24; B24B37/04; H01L21/304
Foreign References:
| JPH0562952A | 1993-03-12 | |||
| JP2007199013A | 2007-08-09 | |||
| JP2012189507A | 2012-10-04 | |||
| JP2000009437A | 2000-01-14 | |||
| JPH03115911A | 1991-05-16 |
Attorney, Agent or Firm:
SUGIMURA, KENJI (JP)
Kenji Sugimura (JP)
Kenji Sugimura (JP)
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