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Title:
WRAPPING WIRE WITH C-SHAPED CROSS-SECTION, AND CABLE WRAPPING STRUCTURE AND METHOD USING THE SAME
Document Type and Number:
WIPO Patent Application WO/2012/086007
Kind Code:
A1
Abstract:
Provided are wrapping wire with a C-shaped cross-section, and a cable wrapping structure and method using the same. The wrapping wire, which is spirally wound around the outer circumference of a main cable (1) and has a substantially C-shaped cross-section, is wound so as to form a first layer wherein the open side of the C-shaped cross-section faces outward of the radial direction of the main cable (1), wrapping wires (2) are caused to be adjacent to one another and are spirally wound, and a second layer wherein the open side of the C-shaped cross-section faces inward of the radial direction of the main cable (1), wrapping wires (3) are caused to be adjacent to one another and are spirally wound on the first layer. The wrapping wires (2,3) are configured such that inside surfaces (4a,5a) of arm portions of the C-shaped cross-section are obliquely formed with respect to the radial direction of the main cable (1), and interlock together in the axial direction of the main cable (1), in a half-pitch displaced state. The problem encountered when using wrapping wire with a Z-shaped cross-section can be completely overcome, enabling easy production and cost reduction of the wrapping wire itself, and structural simplification, size reduction and cost reduction of a wrapping machine.

Inventors:
KUSANAGI Tsuyoshi (Kobata Bldg. 4th Floor, 6-23, Kyomachi-bori 1-chome, Nishi-ku, Osaka-sh, Osaka 03, 〒5500003, JP)
Application Number:
JP2010/072963
Publication Date:
June 28, 2012
Filing Date:
December 21, 2010
Export Citation:
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Assignee:
SOLANA TECHNO CORPORATION (Kobata Bldg, 4th Floor 6-23, Kyomachi-bori 1-chome, Nishi-ku, Osaka-sh, Osaka 03, 〒5500003, JP)
有限会社ソラーナテクノ (〒03 大阪府大阪市西区京町堀1丁目6-23 小畑ビル4F Osaka, 〒5500003, JP)
International Classes:
E01D11/02; D07B1/06; E01D19/08; E01D19/16
Attorney, Agent or Firm:
BAN Toshimitsu (Honest International Patents, Shinko Bldg.1-9, Nishishinjuku 8-chom, Shinjuku-ku Tokyo 23, 〒1600023, JP)
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Claims:



 
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