Title:
ZEOLITE-CONTAINING POLYIMIDE RESIN COMPOSITE MATERIAL, PRECURSOR COMPOSITION FOR ZEOLITE-CONTAINING POLYIMIDE RESIN, FILM, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/245054
Kind Code:
A1
Abstract:
The present invention addresses the problem of inexpensively providing a polyimide resin composite material which has all of high unsusceptibility to deformations, e.g., warpage, high image clearness, and high transparency and is suitable for use as members for electronic devices, etc. The polyimide resin composite material is a zeolite-containing polyimide resin composite material comprising a polyimide resin and a zeolite which includes d6r and/or mtw units as composite building units (CBUs), and is for use in electronic material devices.
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Inventors:
YAMADA MIKI (JP)
OHNISHI RYOHJI (JP)
KATAGIRI NORIKO (JP)
OTSUBO SAIKA (JP)
SUGIYAMA JIRO (JP)
MATSUMOTO MIKA (JP)
ECHIGO YU (JP)
TAKEWAKI TAKAHIKO (JP)
OHNISHI RYOHJI (JP)
KATAGIRI NORIKO (JP)
OTSUBO SAIKA (JP)
SUGIYAMA JIRO (JP)
MATSUMOTO MIKA (JP)
ECHIGO YU (JP)
TAKEWAKI TAKAHIKO (JP)
Application Number:
PCT/JP2019/025009
Publication Date:
December 26, 2019
Filing Date:
June 24, 2019
Export Citation:
Assignee:
MITSUBISHI CHEM CORP (JP)
International Classes:
C08L79/08; C08K3/34
Foreign References:
| JP2008520432A | 2008-06-19 | |||
| JP2014509554A | 2014-04-21 | |||
| JP2018177999A | 2018-11-15 | |||
| JP2019073704A | 2019-05-16 | |||
| JPH06287327A | 1994-10-11 |
Attorney, Agent or Firm:
IP FIRM SHUWA (JP)
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