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Patent Searching and Data


Matches 501 - 550 out of 146,799

Document Document Title
WO/2020/161792A1
This guide rail machining apparatus has a machining apparatus body and a shape measurement device. The machining apparatus body has a machining tool that scrapes off at least part of a surface to be machined of a guide rail. The shape me...  
WO/2020/162875A1
A hand-held ejector tool for ejecting a pressurized stream of abrasive materials and a hopper assembly for use in the same is provided. The hand-held ejector tool includes a pressurized air source, a hopper assembly and a delivery condui...  
WO/2020/125860A4
The invention relates to an apparatus for switching high-pressure suspension, in particular for engaging or disengaging a solid-particle-laden fluid flow which is under high-pressure, said apparatus having a fluid reservoir (1), a high-p...  
WO/2020/160983A1
A honing tool (100) for processing an inner surface of a bore in a workpiece by the means of at least one honing operation comprises a tool body (110), which defines a tool axis (112); a first cutting group (160-1) attached to the tool b...  
WO/2020/162854A2
The invention is about an adjustable circle cutter which can eliminate cutting problems in current techniques, and which can allow cutting of materials in various fields such as hardboard, mdf, derivatives of wood, drywall, precast concr...  
WO/2020/161025A1
The invention relates to a machine tool (10), specifically a hand-held machine tool or semi-stationary machine tool, having a drivetrain (108), which comprises: a tool shaft (23) mounted rotatably on a drive carrier (80) by means of a be...  
WO/2020/162078A1
The purpose is to provide an epoch-making workpiece surface treatment apparatus that performs surface treatment on a workpiece while stably transporting the workpiece without obstructing the rotation of the workpiece or inclining or fall...  
WO/2020/160091A1
An automatic knife sharpening machine may include a vice to grip a blade of a knife and a pair of grind wheels to grind material from the blade. The machine may include a scanner to determine a profile of an edge of the blade, and a shar...  
WO/2020/155341A1
A power mechanism comprises a housing (1). The housing (1) comprises a grip portion and an installation portion. The grip portion has an accommodation space housing a capacitor (4) and a micro switch (5). The grip portion is also provide...  
WO/2020/158381A1
The present invention provides a method for manufacturing an electronic component, the method including securing a brittle substrate to a support and separating the brittle substrate from the support, and being such that it is possible t...  
WO/2020/156583A1
A device for recycling, separating and purifying oil mist during a minimum quantity lubricant grinding and machining process, comprising: a wind power separation mechanism and a filtering and recycling mechanism, wherein the wind separat...  
WO/2020/159845A1
A rotating saw head of a saw assembly has a first saw blade that is driven rotationally and linearly by a first linear-rotary motor, and a second saw blade that is driven rotationally and linearly by a second linear-rotary motor. The fir...  
WO/2020/157816A1
A hydraulic damper device (20) comprises: a first cylinder body (32) which is formed in a cylindrical shape and through the interior of which oil (Oi) flows; a second cylindrical body (60) which is provided to the interior of the first c...  
WO/2020/157622A1
A corner cutting apparatus (10) for flat plates suitable for processing the corners of a flat plate (18) of a flat glass or crystal glass, mirror glass, marble, granite type or similar stony materials, comprising a support structure or f...  
WO/2020/158631A1
Provided is a long-lived grinding wheel that can grind a very hard and brittle material with high efficiency. A segmented grinding wheel 14, which is a metal bond grinding wheel for a very hard and brittle material, is provided with po...  
WO/2020/159626A1
This application relates to a polishing system, polishing pad and related methods. A chemical-mechanical polishing system includes a rotatable head for mounting a wafer thereto, a polishing pad mounted to a rotatable platen, and a fluid ...  
WO/2020/155240A1
A fully-automatic grinding production line, comprising a feeding device (100), a plurality of grinders (200), a cleaning machine (300), and a discharging device (500) arranged according to a processing flow, and further comprising a firs...  
WO/2020/158305A1
One embodiment of the present invention provides a slurry supply device that supplies a slurry that includes an abrasive material to a nozzle. This slurry supply device comprises a tank, a roller, a drive device, a spraying part, and sup...  
WO/2020/128779A3
An abrasive wheel maker apparatus comprising: a wheel substrate (710) having a dispensing surface; an abrasive material dispenser (720) to dispose a binder precursor onto a circular section of the dispensing surface and to dispose a plur...  
WO/2020/158376A1
The present invention is a method for producing a silicon wafer, the method including a step for chamfering a silicon wafer that has a notch, a step for lapping the main surface or cutting both surfaces, an etching step, and a mirror sur...  
WO/2020/158245A1
Provided is an automated polishing system capable of polishing an article while avoiding sites where polishing is to be avoided. The automated polishing system includes a polishing machine 8 attached to the tip of a moveable arm 7a of a ...  
WO/2020/156889A1
The invention relates to a protection device for protecting the rotor blades (45) of a compressor against sparks and/or particles when machining the blade tips of at least one rotor (41-43) of the compressor using a machine tool (3). Acc...  
WO/2020/158161A1
After performing a centerless grinding step for grinding a sliding contact surface (10) of an inner ring (3) by relatively rotating the inner ring (3) in a prescribed direction with respect to a grindstone while pressing the grindstone a...  
WO/2020/160286A1
A multi-modal diamond abrasive package or slurry is disclosed for polishing hard substrates. The multi-modal diamond abrasive package or slurry generally includes a plurality of diamond abrasives. Each one of the diamond abrasives of the...  
WO/2020/157116A1
The present invention relates to a device (110) and a method for introducing an optical lens (112) into a turning apparatus (114). The device (110) comprises a carrier body (134) and a carrier element (136) for receiving the lens (112), ...  
WO/2020/152186A1
Described is a device for robot-assisted machining of surfaces. As per one exemplary embodiment, the device has the following: a support that can be mounted on a manipulator; a machining unit comprising a tool (for example, a grinding wh...  
WO/2020/152512A1
An electrospindle comprising a motor (2) for moving a tool and a mechanical transmission (3) for transmitting motion from the motor (2) to the tool, the electrospindle (1) comprising a gripping head (5) for the tool and for coupling the ...  
WO/2020/150932A1
Disclosed are a method and device for ground grinding, a robot (13) and a computer readable storage medium. The method comprises: obtaining information of an area to be ground; generating, according to the information of the area to be g...  
WO/2020/153001A1
The present invention adjusts a plurality of parameters of this substrate processing device so as to enhance a performance value of the substrate processing device. The present invention includes: a first artificial intelligence unit whi...  
WO/2020/152373A1
The invention relates to a method comprising the steps of: generating abrasion, preferably but not restrictively, by means of sandblasting, which produces mechanical roughing on the surface of a glass substrate; optionally applying a pri...  
WO/2020/153979A1
Embodiments of the present disclosure generally relate to polishing pads, and methods for manufacturing polishing pads, which may be used in a chemical mechanical polishing (CMP) process in the manufacture of semiconductor devices. The p...  
WO/2020/150931A1
A floor grinding robot comprises a grinding device (30), an elevation control device, and a movement control device. The elevation control device comprises an elevation information acquisition device (10) for acquiring elevation informat...  
WO/2020/128720A3
The present disclosure provides systems, devices, and methods for abrasive articles and manufacturing the same. A method includes receiving, at a shaped abrasive particle placement tool comprising cavities (1020), shaped abrasive particl...  
WO/2020/152511A1
An electrospindle comprising a motor (2) for moving a tool and a motor shaft (3) for transmitting motion from the motor (2) to the tool, the electrospindle (1) comprising a gripping head (5) of the tool and coupling of the latter to the ...  
WO/2020/153219A1
This processing device that processes a substrate is provided with: a substrate holding part having a substrate holding surface that suctions and holds the substrate; and an outer edge washing part that washes an outer edge part of the s...  
WO/2020/147922A1
The invention relates to a grinding disc (1) comprising a grinding layer (2) which is made of grinding grains (4) bonded together by a binder (3). Reinforcing fabrics (6, 8) are embedded into the grinding layer (2) at outer faces (5, 7) ...  
WO/2020/150072A1
A wafer processing device may include a wafer exchanger including two or more blades, each of the two or more blades may be configured to receive a wafer, the two or more blades may be rotatable about an axis on a single horizontal plane...  
WO/2020/149468A1
The present invention relates to a method for processing a sink top formed from an engineered stone material. A method for processing a top plate formed from an engineered stone material comprises (a) a step of polishing a sink top forme...  
WO/2020/149868A1
A power operated trimming tool including a head assembly affixed to a handle assembly. The head assembly includes a frame body supporting a feed roll, a blade, a blade support and a blade retainer plate. The frame body includes an interf...  
WO/2020/149816A1
A holder device for dispensable abrasive tape for manicure or pedicure files comprises a shaft (6) and a fastening means (7) for same. A roll (8) of dispensable abrasive tape with an adhesive layer is wound on the shaft.  
WO/2020/150562A1
Various embodiments of the present invention are generally directed to a buckle assembly for sharpening a cutting tool. A quick release buckle assembly is provided including: a male buckle component having a pair of resiliently flexible ...  
WO/2020/148390A1
The present invention relates to a polishing tool (10), comprising a holder (11), a sphere (12) received in the holder (11) and a polishing film (13) which completely or partially covers the free surface (12a) of the sphere (12).  
WO/2019/131886A9
The present invention is a polishing pad which comprises a polyurethane resin foam, and which has a polishing surface that is configured of the surface of the polyurethane resin foam. This polishing pad is configured such that the polyur...  
WO/2020/149470A1
The present invention pertains to a method for processing an MMA artificial marble top plate, the method comprising: (a) a step for polishing the MMA artificial marble top plate with a polish; (b) a step for coating the MMA artificial ma...  
WO/2020/149125A1
The present invention is a workpiece cutting method for simultaneously cutting a workpiece at multiple sites by winding a fixed abrasive grain wire on multiple grooved rollers to form a wire row and, while reciprocating the same, feeding...  
WO/2020/149804A1
The invention is an abrasive disc(10) that uses abrasive sector and abrasive processes. It is specialized that; contains fixing holes(11.2) to placed abrasive strips(12.1) on both sides, contains fixing holes(11.2) which has same or diff...  
WO/2020/146538A1
A guidewire for use in penetrating through complex and stenosed lesions. The distal tip of the guidewire has a roughened surface to increase frictional engagement with calcified and fibrous tissue to increase the penetration of the dista...  
WO/2020/143267A1
A multi-carrier disk wafer transfer device, transfer system, and transfer method. In the multi-carrier disk wafer transfer device, a drive control mechanism (100) can drive and control a circular track (200) to sequentially transfer each...  
WO/2020/143261A1
Disclosed are a supporting structure for chemical mechanical polishing equipment and the chemical mechanical polishing equipment. The supporting structure comprises a polishing head frame body (1), wherein the polishing head frame body (...  
WO/2020/144613A2
The subject of the invention is an abrasive blast machine for surfaces of large-scale workpieces comprising a housing (O) constituting a working chamber, a kinematic mechanism for moving the effector, an abrasive recirculation system, an...  

Matches 501 - 550 out of 146,799