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Patent Searching and Data


Matches 901 - 950 out of 147,180

Document Document Title
WO/2020/070598A1
The disclosure provides abrasive rotary tools with enhanced adhesion of an abrasive layer. Exemplary abrasive rotary tools include a securing element configured to secure an abrasive layer to an abrasive rotary tool. The securing element...  
WO/2020/072839A1
Disclosed herein are an apparatus and system for separating reusable abrasive media from non-reusable media. The system for separating reusable abrasive media from non-reusable media having a housing defining an enclosure and being confi...  
WO/2020/070893A1
The present invention pertains to a machining tool for holding a burnishing shaft used in a burnishing device for burnishing the inner lateral surfaces of grooves formed outward from the inner circumferential surface of a cylindrical wor...  
WO/2020/071458A1
An examination device is provided with: a stage which supports a wafer in which a plurality of columns of modification region are formed in a semiconductor substrate; a light source which outputs light transmitted through the semiconduct...  
WO/2020/066786A1
In an embodiment, provided is a polishing liquid composition capable of improving the abrasion rate of a silicon oxide film. In an embodiment, the present disclosure pertains to a polishing liquid composition that is for a silicon oxide ...  
WO/2020/064974A1
The invention relates to an abrasive wateqet cutting system (2) including: an abrasive watcrjct cutting head (14) comprising: a nozzle (16) adapted for guiding an abrasive wateqet (6) intended to cut a metallic workpiece (4); an abrasive...  
WO/2020/064444A1
The invention relates to a method for surface processing of a component through flow grinding, comprising the following steps: (a) providing a blank (1), (b) overflowing of at least one surface of the blank (1) with a flowable carrier ma...  
WO/2020/064635A1
In a method for smoothing a surface region (1) of a plastic component, in particular an additively manufactured plastic component, the surface region (1) to be smoothed is remelted in an edge layer with energetic radiation. During proces...  
WO/2020/066151A1
A saw wire 2 has a wavy form. The form has a shape composed of a first wave component 4, a second wave component 6, and a third wave component 8. The wavelength WL1 of the first wave component 4 is different from the wavelength WL2 of th...  
WO/2020/065687A1
A multi-spindle operating head comprises a central structure (10) rotating orthogonally to a work plane and supporting a plurality of electro spindles distributed on a circumference with the same angular distance, the rotation axis of ea...  
WO/2020/065689A1
An operating head with electro spindles comprises a central structure (10) rotating orthogonally to a work plane, able to support a plurality of electro spindles distributed on a circumference with the same angular distance, the axis of ...  
WO/2020/065049A1
The invention concerns a semi-finished lens (10) comprising a first optical surface (12) comprising a surface design associated with a first reference system and a second optical surface (14) to be manufactured, the first and second opti...  
WO/2020/068271A1
A method and apparatus for a separable assembly in a platen assembly is provided. The two components of the separable assembly couple together through the first coupling member and the second coupling member, and the coupling is magnetic...  
WO/2020/068629A1
A method of forming a carrier wafer includes the steps of: lapping a first surface and a second surface of the carrier wafer such that the carrier wafer is substantially flat, the carrier wafer comprising a glass, glass-ceramic or cerami...  
WO/2020/067401A1
The purpose of the present invention is to provide: a polishing pad which is capable of reducing the occurrence of scratches; and a method for producing a polished article. A polishing pad which is provided with a polyurethane sheet as a...  
WO/2020/066671A1
Provided are: a polishing pad useful for removing undulations in a curved resin-coated surface at a high polishing rate; and a polishing method using the polishing pad. A polishing pad (10) according to an aspect of the present invention...  
WO/2020/062701A1
A float polishing device and method for a small-size complex surface part. A rotating shaft (1) in the float polishing device is connected to a motor by means of a disc-type elastic spring coupling (6), and a floating device (4) and a pa...  
WO/2020/067536A1
This blast machining device comprises: a nozzle for jetting an abrasive material together with compressed air; a retention part that retains the abrasive material in the interior thereof; a roller that is cylindrical in shape, has a groo...  
WO/2020/066873A1
Provided is a method that is for polishing a silicon wafer by a polishing device using a carrier holding the silicon wafer, and that can reduce wear on the carrier. In this polishing method, a polishing liquid used in the polishing devic...  
WO/2020/065723A1
A slurry for polishing a carbon-containing silicon oxide, the slurry containing abrasive grains and a liquid medium, wherein the abrasive grains contain a first particle and a second particle in contact with the first particle, the secon...  
WO/2020/062581A1
A high-pressure gas-liquid grinding device comprises a horizontal working table (1), a first motor (2) vertically fixed below the horizontal working table (1), a high-pressure sealed chamber (3) provided on an upper portion of the horizo...  
WO/2020/064282A1
The invention relates to a method for polishing a semiconductor wafer in that at least one side of the semiconductor wafer is pressed against a polishing pad secured to a rotating polishing disc in the presence of a polishing agent. The ...  
WO/2020/065688A1
A grinding unit (100) comprises a rotating head (10) provided with abrasive oscillating blocks (B) mounted on tool supports (11) connected to a rotating casing (12), for working on flat surfaces, rotating cam means (131), (132), (133), c...  
WO/2020/068345A1
During chemical mechanical polishing of a substrate, a signal value that depends on a thickness of a layer in a measurement spot on a substrate undergoing polishing is determined by a first in-situ monitoring system. An image of at least...  
WO/2020/067914A1
A method of compensating for a contribution of conductivity of the semiconductor wafer to a measured trace by an in-situ electromagnetic induction monitoring system includes storing or generating a modified reference trace. The modifi...  
WO/2020/066998A1
This polishing liquid is used for polishing of a siliceous substrate that has a surface roughness Ra of from 0.01 μm to 0.2 μm (inclusive). This polishing liquid contains ceria abrasive grains, silica abrasive grains and water. The ave...  
WO/2020/067057A1
The present invention provides: a polishing composition which enables the achievement of high polishing rate and high surface quality with respect to polishing of a gallium oxide substrate; and a polishing method and a production method ...  
WO/2020/058922A1
The tool (1, 2) for the processing of ceramic articles comprises: a cutting disk (3) movable in rotation around an axis of rotation (A) for the cut of at least one ceramic article (4); and at least one abrasive body (5) locked together i...  
WO/2020/057330A1
A polishing and loading/unloading component module, comprising a loading/unloading module and two polishing modules; the loading/unloading module is at the middle, and the two polishing modules are located at two sides thereof, the loadi...  
WO/2020/058876A1
A system for grit blasting an annular junction portion (2) of a pipeline (3) extending along a longitudinal axis (A) on board a laying vessel, comprises: at least one carriage (10a; 10b; 110a; 210a) configured to advance along an annular...  
WO/2020/060550A1
A method of cleaning a component includes providing the component following the operation of the component in a high temperature environment, the component including a thermal barrier coating (TBC), cleaning the TBC of the component usin...  
WO/2020/056818A1
Disclosed is a polishing loading and unloading component module containing a movable loading and unloading module. The polishing loading and unloading component module comprises one loading and unloading module and two polishing modules,...  
WO/2020/056538A1
Disclosed is an automatic grinder, comprising a grinder body (1) and a sample pressing device (2) arranged on the grinder body (1), a grinding disc (3) and a water spraying device (4), wherein when the grinding disc (3) rotates, a sample...  
WO/2020/060962A1
A translatable, ultra-high pressure liquid jet system (100) includes a translatable frame (200) configured to maintain mechanical contact with a rail (124). The liquid jet system includes a liquid jet processing head (408) affixed to the...  
WO/2020/058216A1
The invention relates to a method for dressing a honing tool (9) comprising honing strips (1), wherein at least one honing strip (1) is dressed by means of an electroerosive method. The invention further relates to a machining unit, in p...  
WO/2020/056891A1
Disclosed is a curved glass convex surface polishing machine, comprising a polishing device and a driving device. The driving device comprises a driving mechanism and an attachment platform (113) provided on the driving mechanism. The dr...  
WO/2020/056817A1
A flexible module for polishing, loading and unloading a component, comprising a loading and unloading module and two polishing modules. The loading and unloading module is in the middle, and the two polishing modules are located on two ...  
WO/2020/055594A1
Embodiments of the present disclosure generally provide methods, polishing systems with computer readable medium having the methods stored thereon, to facilitate consistent tensioning of a polishing article disposed on a web-based polish...  
WO/2020/052974A1
The invention relates to a hand-held cutting grinder, comprising a cutting disk (11), a motor housing including a drive unit, and an arm (16) having a support arm (17) and an arm cover (18). A stop element (41) is provided for the spindl...  
WO/2020/054631A1
The present description discloses a tool. The tool may be provided with: a motor; a power transmission mechanism connected to the motor; a housing which houses the motor and the power transmission mechanism; a tip tool holding part which...  
WO/2020/055901A1
A smart coolant pump for a robotic or computer-controlled machine. The smart pump uses a servo motor rather than a conventional industrial motor such as an induction motor. The smart pump has inherent torque and speed sensing, and a cont...  
WO/2020/054823A1
A polishing pad is provided that can polish a curved surface to be polished on an object to be polished and remove waviness on the curved surface to be polished by way of a polishing surface following curved surfaces having various degre...  
WO/2020/054616A1
Provided is an electric work machine in which it is possible to limit the risk of contact between a control unit and wiring provided inside a motor housing. In the electric work machine (1A), a motor (6) and a control unit (13) are house...  
WO/2020/052819A1
The invention relates to a cutting device having a housing (28). In this case, a driven disc-shaped cutting tool (10), mounted in the housing (28), for cutting a workpiece (12) is provided. Arranged on a circumferential side of the cutti...  
WO/2020/051943A1
A grinding system for eliminating crack sources of an inner tapered bore of a motor rotating shaft and a grinding method therefor; the grinding system comprises a movable device (1), a pneumatic gun (2), and a clamping device; the movabl...  
WO/2020/052497A1
Disclosed is a rechargeable angle grinder, comprising a housing (1), wherein the housing (1) has a driving shaft (6) provided therein for transferring power; a locking button (7) is movably embedded in the housing (1); the housing (1) ha...  
WO/2020/055849A1
A wet abrasive blasting system includes a vessel having multiple outlets for dispensing slurry. A first sprayer of the system is operatively associated with a first blast control switch, and a second sprayer is operatively associated wit...  
WO/2020/055571A1
Methods for polishing semiconductor substrates that involve adjusting the finish polishing sequence based on the pad-to-pad variance of the polishing pad are disclosed.  
WO/2020/054811A1
Provided is a wafer mirror surface chamfering method by which corner burrs at the boundaries between main surfaces and chamfered surfaces of the wafer can be reduced. The present invention is a wafer mirror surface chamfering method by w...  
WO/2020/051729A1
A ceramic sphere abrasive, a preparation method therefor, and use thereof. The ceramic sphere abrasive comprises the following components in mass percentages: 6-30% of grinding agent; 0.5-5% of dispersant; 15-40% of suspending agent; 10-...  

Matches 901 - 950 out of 147,180