Login| Sign Up| Help| Contact|

Patent Searching and Data


Matches 1,001 - 1,050 out of 147,457

Document Document Title
WO/2020/067536A1
This blast machining device comprises: a nozzle for jetting an abrasive material together with compressed air; a retention part that retains the abrasive material in the interior thereof; a roller that is cylindrical in shape, has a groo...  
WO/2020/066873A1
Provided is a method that is for polishing a silicon wafer by a polishing device using a carrier holding the silicon wafer, and that can reduce wear on the carrier. In this polishing method, a polishing liquid used in the polishing devic...  
WO/2020/065723A1
A slurry for polishing a carbon-containing silicon oxide, the slurry containing abrasive grains and a liquid medium, wherein the abrasive grains contain a first particle and a second particle in contact with the first particle, the secon...  
WO/2020/062581A1
A high-pressure gas-liquid grinding device comprises a horizontal working table (1), a first motor (2) vertically fixed below the horizontal working table (1), a high-pressure sealed chamber (3) provided on an upper portion of the horizo...  
WO/2020/064282A1
The invention relates to a method for polishing a semiconductor wafer in that at least one side of the semiconductor wafer is pressed against a polishing pad secured to a rotating polishing disc in the presence of a polishing agent. The ...  
WO/2020/065688A1
A grinding unit (100) comprises a rotating head (10) provided with abrasive oscillating blocks (B) mounted on tool supports (11) connected to a rotating casing (12), for working on flat surfaces, rotating cam means (131), (132), (133), c...  
WO/2020/068345A1
During chemical mechanical polishing of a substrate, a signal value that depends on a thickness of a layer in a measurement spot on a substrate undergoing polishing is determined by a first in-situ monitoring system. An image of at least...  
WO/2020/067914A1
A method of compensating for a contribution of conductivity of the semiconductor wafer to a measured trace by an in-situ electromagnetic induction monitoring system includes storing or generating a modified reference trace. The modifi...  
WO/2020/066998A1
This polishing liquid is used for polishing of a siliceous substrate that has a surface roughness Ra of from 0.01 μm to 0.2 μm (inclusive). This polishing liquid contains ceria abrasive grains, silica abrasive grains and water. The ave...  
WO/2020/067057A1
The present invention provides: a polishing composition which enables the achievement of high polishing rate and high surface quality with respect to polishing of a gallium oxide substrate; and a polishing method and a production method ...  
WO/2020/058922A1
The tool (1, 2) for the processing of ceramic articles comprises: a cutting disk (3) movable in rotation around an axis of rotation (A) for the cut of at least one ceramic article (4); and at least one abrasive body (5) locked together i...  
WO/2020/057330A1
A polishing and loading/unloading component module, comprising a loading/unloading module and two polishing modules; the loading/unloading module is at the middle, and the two polishing modules are located at two sides thereof, the loadi...  
WO/2020/058876A1
A system for grit blasting an annular junction portion (2) of a pipeline (3) extending along a longitudinal axis (A) on board a laying vessel, comprises: at least one carriage (10a; 10b; 110a; 210a) configured to advance along an annular...  
WO/2020/060550A1
A method of cleaning a component includes providing the component following the operation of the component in a high temperature environment, the component including a thermal barrier coating (TBC), cleaning the TBC of the component usin...  
WO/2020/056818A1
Disclosed is a polishing loading and unloading component module containing a movable loading and unloading module. The polishing loading and unloading component module comprises one loading and unloading module and two polishing modules,...  
WO/2020/056538A1
Disclosed is an automatic grinder, comprising a grinder body (1) and a sample pressing device (2) arranged on the grinder body (1), a grinding disc (3) and a water spraying device (4), wherein when the grinding disc (3) rotates, a sample...  
WO/2020/060962A1
A translatable, ultra-high pressure liquid jet system (100) includes a translatable frame (200) configured to maintain mechanical contact with a rail (124). The liquid jet system includes a liquid jet processing head (408) affixed to the...  
WO/2020/058216A1
The invention relates to a method for dressing a honing tool (9) comprising honing strips (1), wherein at least one honing strip (1) is dressed by means of an electroerosive method. The invention further relates to a machining unit, in p...  
WO/2020/056891A1
Disclosed is a curved glass convex surface polishing machine, comprising a polishing device and a driving device. The driving device comprises a driving mechanism and an attachment platform (113) provided on the driving mechanism. The dr...  
WO/2020/056817A1
A flexible module for polishing, loading and unloading a component, comprising a loading and unloading module and two polishing modules. The loading and unloading module is in the middle, and the two polishing modules are located on two ...  
WO/2020/055594A1
Embodiments of the present disclosure generally provide methods, polishing systems with computer readable medium having the methods stored thereon, to facilitate consistent tensioning of a polishing article disposed on a web-based polish...  
WO/2020/052974A1
The invention relates to a hand-held cutting grinder, comprising a cutting disk (11), a motor housing including a drive unit, and an arm (16) having a support arm (17) and an arm cover (18). A stop element (41) is provided for the spindl...  
WO/2020/054631A1
The present description discloses a tool. The tool may be provided with: a motor; a power transmission mechanism connected to the motor; a housing which houses the motor and the power transmission mechanism; a tip tool holding part which...  
WO/2020/055901A1
A smart coolant pump for a robotic or computer-controlled machine. The smart pump uses a servo motor rather than a conventional industrial motor such as an induction motor. The smart pump has inherent torque and speed sensing, and a cont...  
WO/2020/054823A1
A polishing pad is provided that can polish a curved surface to be polished on an object to be polished and remove waviness on the curved surface to be polished by way of a polishing surface following curved surfaces having various degre...  
WO/2020/054616A1
Provided is an electric work machine in which it is possible to limit the risk of contact between a control unit and wiring provided inside a motor housing. In the electric work machine (1A), a motor (6) and a control unit (13) are house...  
WO/2020/052819A1
The invention relates to a cutting device having a housing (28). In this case, a driven disc-shaped cutting tool (10), mounted in the housing (28), for cutting a workpiece (12) is provided. Arranged on a circumferential side of the cutti...  
WO/2020/051943A1
A grinding system for eliminating crack sources of an inner tapered bore of a motor rotating shaft and a grinding method therefor; the grinding system comprises a movable device (1), a pneumatic gun (2), and a clamping device; the movabl...  
WO/2020/052497A1
Disclosed is a rechargeable angle grinder, comprising a housing (1), wherein the housing (1) has a driving shaft (6) provided therein for transferring power; a locking button (7) is movably embedded in the housing (1); the housing (1) ha...  
WO/2020/055849A1
A wet abrasive blasting system includes a vessel having multiple outlets for dispensing slurry. A first sprayer of the system is operatively associated with a first blast control switch, and a second sprayer is operatively associated wit...  
WO/2020/055571A1
Methods for polishing semiconductor substrates that involve adjusting the finish polishing sequence based on the pad-to-pad variance of the polishing pad are disclosed.  
WO/2020/054811A1
Provided is a wafer mirror surface chamfering method by which corner burrs at the boundaries between main surfaces and chamfered surfaces of the wafer can be reduced. The present invention is a wafer mirror surface chamfering method by w...  
WO/2020/051729A1
A ceramic sphere abrasive, a preparation method therefor, and use thereof. The ceramic sphere abrasive comprises the following components in mass percentages: 6-30% of grinding agent; 0.5-5% of dispersant; 15-40% of suspending agent; 10-...  
WO/2020/052797A1
The invention relates to a slide-grinding body having two sections that come to a point and emanate from a base cross-section, wherein the geometry of the base cross-section (4) has curved flanks, the base cross-section is the largest at...  
WO/2020/055538A1
Embodiments described herein relate to rotary unions for use in wafer cleaning processes. The rotary union includes a process media and a supporting media that interact in a gap between a nozzle and rotary element. By regulating the supp...  
WO/2020/048731A1
The invention relates to an edge-removing tool for sheet metal, comprising a head with a rotating cutting tool, wherein the head has at least one guide for an edge. The head preferably comprises a sleeve comprising the guide, and the too...  
WO/2020/048311A1
A chemical-mechanical planarization device, comprising a polishing module, a cleaning module and a wafer transfer module, wherein the polishing module comprises two rows of polishing unit arrays (100), each row of polishing unit arrays c...  
WO/2020/048874A1
A polishing device held on a robot arm (1), having a support plate (9), a polishing disc (10) held thereon, a drive moving the support plate (9) in a plane, and a metering device (8) for feeding a polishing agent to the working side of t...  
WO/2020/051485A1
Apparatus, assemblies, and/or systems related to material removal are disclosed, such as saws, grinders, polishers, and/or more general material preparation and/or testing machines, for example. A material removal system may include a ma...  
WO/2020/027754A3
The invention particularly relates to the discrete channel grooving system (10), which reduces costs by using fewer discs and allows channel engraving at the desired length and depth in the desired area of the glass. The discrete groovin...  
WO/2020/049395A1
The invention relates to an abrasive article 1 for abrading at least one workpiece, the abrasive article with: a carrier body 2, at least one abrasive layer 3 with a main surface and a predefined thickness, the at least one abrasive laye...  
WO/2019/245491A3
Invention is a hand held grinding machine consisting of electrical engine body (1), grinding disk (11) by means of hard particles blasted onto surfaces used for both cleaning of and making it rough as used in surface processing technolog...  
WO/2020/048886A1
The invention relates to a grinding device, comprising a support element (3) and a preferably flexible grinding means (5) held thereon, which has a carrier resting against the support element (3), and a grinding layer designed in such a ...  
WO/2020/049052A2
The present invention relates to a device for lens processing, comprising at least one receiving device for at least one transport box, at least one measuring device, and at least one processing device. According to the invention, it is ...  
WO/2020/047942A1
Disclosed is a chemical mechanical planarization apparatus, comprising a polishing module, a cleaning unit (200) and a wafer transmission module, wherein the polishing module includes two columns of polishing unit arrays (100), and each ...  
WO/2020/049033A1
The present invention relates to a method for treating surfaces by means of an abrasive material in order preferably to obtain a roughened surface, wherein at least a water-soluble abrasive material is used as the abrasive material. In a...  
WO/2020/050932A1
Methods and formulations for manufacturing polishing articles used in polishing processes are provided. In one implementation, a UV curable resin precursor composition is provided. The UV curable resin precursor comprises a precursor for...  
WO/2020/049887A1
The objective of the present invention is to prevent blow back, to an operator side, of sparks and the like generated when material to be cut is being cut using a metalworking stationary cutting machine. A dust collecting box 2 which can...  
WO/2020/028855A9
An abrasive article can include a wear detection sensor embedded within the abrasive body or extending along an exterior surface of the abrasive body. The wear detection sensor can include at least one conductive lead and be designed to ...  
WO/2020/048748A1
The invention relates to a machining system for machining spectacle lenses and to a method for machining spectacle lenses. The machining system has a plurality of machining stations, in particular a milling station, a turning station, a ...  

Matches 1,001 - 1,050 out of 147,457