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WO/2022/091532A1 |
The present invention provides technology that enables accurate measuring of the polishing state of a substrate. A polishing device 100 comprises: a sensor head 40 having a light projector for projecting incident light, a light collect...
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WO/2022/094606A1 |
An abrasive article comprising a nonwoven substrate material impregnated with a first and second formulation. The first and second formulations have broad-spectrum antimicrobial effectiveness against one or more microbial organisms. The ...
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WO/2022/090304A1 |
The invention relates to a method for controlling and/or monitoring a workpiece machining process. In the workpiece machining process, a tool having a working surface is brought into contact with a surface of a workpiece to be machined. ...
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WO/2022/090229A1 |
The invention relates to a method for producing a grinding disc device (10) for a grinding tool. According to the method, a grinding support (14) with an abrasive grinding surface (Fs) and a connection surface (Fv) opposite the grinding ...
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WO/2022/087944A1 |
Provided is a surface cleaning apparatus for machining a stainless-steel storage drum, comprising an upper treatment box body (1), a bottom support column (4), and a treatment structure; said treatment structure comprises a longitudinal ...
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WO/2022/091069A1 |
The present disclosure relates to polyurethane comprising a reaction product of a reactive mixture including a polyester polyol, a diol chain extender, a diisocyanate; and a reactive, tertiary amine. The present disclosure further provid...
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WO/2022/085810A1 |
The present invention relates to a carbide insert deburring device using brushes for deburring and surface-cleaning a molded product taken out of a molding press apparatus, comprising: a brush module configured to remove burrs on a cutti...
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WO/2022/086908A1 |
A sanding block produced by co-extrusion of a substantially softer polymeric material and a substantially harder polymeric material is described. The substantially hollow interior of the co-extruded body of the sanding block may be seale...
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WO/2022/083141A1 |
A processing device for raised burr defects of a flat wire in a conveying state, comprising: grinding mechanisms (28-31), arranged near a front surface to be ground, a rear surface to be ground, an upper surface to be ground, and a lower...
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WO/2022/084289A1 |
The invention relates to increasing a concentration of particles (92) in a circumferentially enclosed stream (90) of a fluid mixed with the particles in a target area (90ct) of a cross-section (90c) of the stream transverse to a flow dir...
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WO/2022/086067A1 |
Disclosed are a pillar anchor for an automobile and a method for manufacturing same. The pillar anchor for an automobile according to an embodiment of the present invention comprises a pair of plates which include a first anchor plate an...
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WO/2022/082810A1 |
A sanding device for processing a computer case, comprising a base (1). Damping mechanisms (2) are fixedly connected to the lower surface of the base (1); a first motor (3) is fixedly connected to the middle of the upper surface of the b...
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WO/2022/082996A1 |
a high efficiency-type crystal grinding and polishing device, comprising a support rack (1), an annular guide rail being arranged on the support rack (1); a plurality of annular and uniformly distributed mobile frames (4) are arranged on...
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WO/2022/083960A1 |
The invention relates to a material collection device for a hand-held power tool, with a material collection container (112a) for collecting materials removed during operation of the hand-held power tool, wherein at least one opening (12...
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WO/2022/085512A1 |
A problem addressed is to provide an antibacterial agent-compounded silica dispersion that has an antibacterial property, a slight decrease in polishing rate even when used as a component of an abrasive composition, and a good surface st...
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WO/2022/082417A1 |
A precision grinding and polishing device for stainless steel. The device comprises a support (1), an external spike grinding column (7) and a second electric motor (9), wherein a telescopic arm (2) is fixed to a right side of the suppor...
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WO/2022/085159A1 |
This curve generator comprises two cup-type grindstones having different roughness, a retaining mechanism for retaining a workpiece to be processed by the grindstones, a measurement mechanism for measuring the shape of the grindstones at...
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WO/2022/085139A1 |
Provided is a cutlery sharpener for sharpening the blade edge of cutlery, wherein the blade edge can be effectively sharpened regardless of the user's proficiency level, etc. The cutlery sharpener for sharpening the blade edge of cutlery...
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WO/2022/086830A1 |
The invention provides a UV-curable resin for forming a chemical-mechanical polishing pad comprising: (a) one or more acrylate blocked isocyanates; (b) one or more acrylate monomers; and (c) a photoinitiator. The invention also provides ...
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WO/2022/086462A1 |
This invention is related to an adapter (1) which is capable of honing on CNC machines without the need for an external honing machine with an aim to obtain low surface smoothness, used in machinery factories and all facilities that incl...
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WO/2022/086672A1 |
An apparatus and method for sequential application of cleaning fluids for improved maintenance of chemical mechanical polishing (CMP) systems is disclosed. A method includes transferring a first substrate to a first polishing station of ...
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WO/2022/078641A1 |
The present invention relates to a grinding tool for grinding a workpiece, the tool comprising a member (1) which is made from a material comprising between 90 et 99.5% by weight of W and between 0.5 and 10% by weight of one or more elem...
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WO/2022/081409A1 |
Embodiments herein generally relate to chemical mechanical polishing (CMP) systems used in the manufacturing of electronic devices. In one embodiment, a substrate carrier for polishing a surface of a substrate includes a retaining ring c...
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WO/2022/077579A1 |
The present invention relates to the technical field of computer accessory machining devices. Disclosed is a computer case grinding apparatus, comprising a bottom plate. Two sides of the bottom plate are fixedly connected to mounting cyl...
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WO/2022/079974A1 |
Provided is a defect grinding system and a defect grinding method capable of suppressing the occurrence of grinding failures such as excess grinding or insufficient grinding, while automating an operation to grind a defect on the surface...
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WO/2022/080159A1 |
A carrier measurement device (1) comprises a rotating table (23), a table drive motor (24), an upper thickness sensor (41), a lower thickness sensor (42), and a sliding part (13). The rotating table (23) includes a carrier storage part (...
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WO/2022/077614A1 |
A method for improving surface evenness of electroplated platinum and a polishing device used by the method. The method comprises the following steps: S1. performing drilling wave crest polishing; S2. performing visual inspection and det...
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WO/2022/077653A1 |
The present invention relates to the technical field of electromechanical machining, in particular to an electromechanical machining cutting device. Said device comprises a mounting side plate, the mounting side plate being connected to ...
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WO/2022/077659A1 |
A polishing device for machining an inner wall of a stainless steel pipe. The polishing device comprises a bottom plate base (19) and racks (2), wherein the two racks (2) are mounted on the bottom plate base (19); a screw driving assembl...
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WO/2022/080921A1 |
One embodiment of the present invention provides a method for processing a wafer, the method comprising the steps of: preparing a wafer having a notch portion formed on one side thereof; aligning the wafer by analyzing image information ...
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WO/2022/077788A1 |
A belt and disc sander. The belt and disc sander is provided with a base assembly (1), a motor assembly (2), an abrasive disc device (3), and an abrasive belt support assembly (4); the motor assembly (2) is provided with a motor (21); th...
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WO/2022/077656A1 |
The present invention relates to the field of stainless steel pipe machining, and specifically to a surface polishing apparatus for a stainless steel pipe, comprising a top plate and a bottom plate base. A second support frame and a firs...
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WO/2022/077924A1 |
A lapping control method, comprising the following steps: acquiring a target resistance value, set by a user, of a metal layer of a lapped object; determining a target output value of an eddy current sensor according to the target resist...
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WO/2022/081398A1 |
An apparatus for chemical mechanical polishing (CMP) of a substrate is described herein. The apparatus includes an extension disposed between a retaining ring and a chucking membrane. The extension is disposed radially outward from the e...
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WO/2022/077655A1 |
A metal pipe section deburring device for electromechanical machining comprising an operation platform (2). A conveying device (3) is provided on the operation platform (2). A grinding frame (4) is provided in positions on the operation ...
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WO/2022/074738A1 |
A polishing system 1 includes a plurality of polishing devices 11 arranged aligned in a y-axis direction, and a holder 13 that holds a rectangular cell 9 so that the cell contacts each polishing surface of a polishing device 11. The poli...
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WO/2022/075251A1 |
The present invention provides a polishing system that is able to polish just a portion of a region forming one flat surface of the surface of an object to be polished, and that can polish a small quantity of objects to be polished. A po...
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WO/2022/074601A1 |
An abrasive article comprises abrasive particles adhered to a substrate by a binder material. The binder material comprises an at least partially cured resole phenolic resin and an organic polymeric rheology modifier. The amount of the a...
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WO/2022/074835A1 |
One aspect provides a method for adjusting the polishing speed of a silicon substrate and the surface quality of the polished silicon substrate. In one aspect, this method is for adjusting the polishing speed of a silicon substrate and...
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WO/2022/074831A1 |
One aspect provides a polishing liquid composition which is for a silicon substrate and with which improvements in the polishing speed and storage stability of a concentrate can both be achieved. In one aspect, the present disclosure p...
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WO/2022/075365A1 |
A nozzle (160) is connected to a mixing unit (150), and ejects mixed gas (30). The nozzle (160) includes, in this order, a large diameter portion (170), a contracting diameter portion (180), and a slit portion (190). The large diameter p...
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WO/2022/075625A1 |
The present invention provides an abrasive comprising α-alumina particles having a polyhedral crystal structure, wherein the α-alumina particles have an average diameter (D50) of 300 nm to 10 μm and a bulk density of 0.2-0.5 g/mL, a [...
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WO/2022/074474A1 |
A method of making a coated abrasive article comprises sequential steps: disposing a curable composition on a major surface of a backing b) adhering abrasive particles to the curable composition; c) at least partially curing the free-rad...
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WO/2022/075179A1 |
One embodiment of the present invention provides a polishing liquid composition for silicon oxide films, said polishing liquid composition being capable of achieving a good balance between improvement of the polishing rate of a silicon o...
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WO/2022/075413A1 |
One embodiment of the present invention provides a polishing liquid composition which is capable of reducing scratches and waves in a substrate surface after polishing, while ensuring an adequate polishing rate. One embodiment of the p...
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WO/2022/076554A1 |
A floor sander comprising a drive motor, a horizontal rotating drum having a top and a bottom driven by the drive motor and a housing covering the top of the rotating drum, wherein the rotating drum supports and drives sandpaper continuo...
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WO/2022/076222A1 |
The disclosure relates to methods for compensating for crystal structures differential material removal rates in sub-aperture figuring. A computing machine receives an input related to a substrate crystal structure. The computing machine...
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WO/2022/069534A1 |
The invention relates to a device (100) and a method for coating a surface, in particular a surface of a plate-shaped workpiece (W). The device and the method can be used, for example, in the field of the furniture and component industry.
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WO/2022/071190A1 |
A roller grinding device (100) comprises: a first panel (1) having a workpiece driving surface (1a); a second panel (2) having a grinding surface (2a) facing the workpiece driving surface (1a) in a direction intersecting the workpiece dr...
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WO/2022/071120A1 |
The purpose of the present invention is to provide a cerium oxide and a polishing agent with which a silicon nitride film can be polished at a high speed. Provided is cerium oxide that satisfies one or more of (A) to (D) when the CO2 des...
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