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WO/2022/004523A1 |
A method for manufacturing a coated tool according to the present disclosure, which is not a limiting example thereof, is a method for manufacturing a coated tool having a base and a coating layer located on the base. The method for manu...
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WO/2021/259652A1 |
The invention relates to a method for producing a green body for a machining segment (51) from a pulverulent or granular first matrix material (56) and first hard material particles (57), a lower face (61) of the machining segment being ...
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WO/2021/259424A1 |
The invention relates to a cleaning method for removing adhesive residues from surfaces, in particular after separating an adhesive connection between joining partners (26), wherein liquid carbon dioxide from a reservoir enters a jet app...
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WO/2021/258132A1 |
An apparatus for installation to a base structure and for use in finishing a workpiece, the apparatus comprising a main body which includes a mounting section, and an idler wheel support having an idler wheel operatively mounted thereon,...
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WO/2021/261291A1 |
A female screw is provided at the tip of a rotating shaft (8) of an ultrasonic processing apparatus (1). Meanwhile, a bar screw (6) having a hexagonal hole and a front mass (3) are produced as an integrated metal part. A Langevin type ul...
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WO/2021/262521A1 |
A carrier head includes a housing, a support assembly having a support plate flexibly connected to the housing so as to be vertically movable, a plurality of fluid-impermeable barriers projecting from a bottom of the support plate to def...
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WO/2021/260629A1 |
A polishing pad includes a textured polishing layer comprising a working surface and a second surface opposite the working surface. The textured polishing layer comprises a polymeric blend comprising thermoplastic urethane in an amount o...
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WO/2021/262450A1 |
A method of training a neural network includes obtaining two ground truth thickness profiles a test substrate, obtaining two thickness profiles for the test substrate as measured by an in-situ monitoring system while the test substrate i...
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WO/2021/263043A1 |
A polishing assembly includes a rotatable platen to support a polishing pad, a polishing liquid delivery arm having an enclosure open at a bottom thereof and one or more ports to deliver a polishing liquid and a cleaning fluid downwardly...
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WO/2021/262602A1 |
A conditioner disk for use on a polishing pad during chemical mechanical polishing process includes a backing plate having a lower surface and abrasive diamond particles secured to the lower surface of the backing plate, the abrasive dia...
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WO/2021/263202A1 |
A pad conditioner head cleaning tool has a first clamp configured to removably engage a first portion of a sponge against an outer surface of a disk-shaped pad conditioner head at a first location, a second clamp configured to removable ...
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WO/2021/259654A1 |
The invention relates to a method for producing a green body for a machining segment (51) from a pulverulent or granular first matrix material (56), first hard material particles (57) and second hard material particles (58), wherein the ...
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WO/2021/262947A1 |
In a substrate processing system, such as a chemical mechanical system, updated controller configuration data is obtained for a plurality of liquid flow controllers of the substrate processing system. Each of a plurality of liquid flow c...
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WO/2021/259628A1 |
The present invention relates to a power tool having a disk-shaped tool element. The tool element can be fastened to a drive shaft of the power tool by means of a fastening nut. The drive shaft is designed to transmit a torque of the dri...
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WO/2021/262755A1 |
A carrier head for holding a substrate in a polishing system has a housing including a carrier plate, a first flexible membrane secured to the housing, and a plurality of independently operable piezoelectric actuators secured to the carr...
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WO/2021/258503A1 |
A fluid ejection visualization stereoscopic and dynamic 3D detection device and detection method. The device comprises a shot peening system, a photography system, a sample stage system, a sample transport mechanism, and a scanning and a...
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WO/2021/262612A1 |
In a chemical mechanical polishing system, a platen shield cleaning assembly is installed on a rotatable platen in a gap between the rotatable platen and a platen shield. The assembly includes a sponge holder attached to the platen and a...
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WO/2021/259653A1 |
The invention relates to a method for producing a green body for a machining segment (51) from a pulverulent or granular first matrix material (56) and first hard material particles (57), the machining segment being connected with a bott...
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WO/2021/259655A1 |
The invention relates to a method for producing a machining segment (51) for a machining tool from a pulverulent or granular first matrix material (56), first hard material particles (57), arranged according to a defined first particle p...
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WO/2021/253463A1 |
A smart wooden floor producing apparatus, comprising a machine body (1), the machine body being provided with an upper polishing assembly (2), a lower polishing assembly (3) symmetrically positioned directly below the upper polishing ass...
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WO/2021/257979A1 |
Blasting abrasives comprise a plurality of particles. Blasting abrasives are classified into two basic types with many varieties of particles within these categories. Sharp, angular, and blocky abrasives and bead and/or rounded abrasives...
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WO/2021/256140A1 |
The present invention provides a shot peening apparatus capable of precisely managing the amount of shot supplied. A shot peening apparatus 1 which projects, by a projection impeller 5, shot T onto a workpiece W, comprises: a bucket el...
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WO/2021/253935A1 |
A housing assembly, a preparation method therefor and a mobile terminal, the housing assembly comprising a glass body, the glass body having a first surface, and the first surface having a haze of less than or equal to 90% and a surface ...
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WO/2021/253589A1 |
A processing and manufacturing method capable of customizing a high-precision potassium tantalate niobate (KTa1-xNbxO3, where 0
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WO/2021/254032A1 |
A ground leveling grinder comprises a main motor connection disc (1) having a round passage. A driving shaft (4) is arranged vertically at the middle section of the round passage. A hollow shaft sleeve (9) is sleeved outside the driving ...
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WO/2021/255555A1 |
The present invention belongs to the field of machines suitable for industrial processing and, more particularly, to the field of dry surface finishing such as shot peening, shot blasting, descaling, roughening, etc.. These processes are...
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WO/2021/257136A1 |
Embodiments herein generally relate to polishing pads and method of forming polishing pads. In one embodiment, a polishing pad having a polishing surface that is configured to polish a surface of a substrate is provided. The polishing pa...
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WO/2021/256906A1 |
Provided are a plated steel sheet and a method for manufacturing same, the plated steel sheet comprising: a base steel sheet; a Zn-Mg-Al based plated layer provided on at least one surface of the base steel sheet; and an Fe-Al based supp...
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WO/2021/255770A1 |
Log saw blade 10 comprising a central portion 12 which develops radially from a central axis X, and a peripheral portion 13 which develops radially in continuity with said central portion 12 and provided with a cutting edge 14, with a fi...
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WO/2021/251871A1 |
A filter arrangement (200, 300, 400, 450) for a heavy duty dust extractor (100), the filter arrangement comprising a filter holder (180), an essential filter (150), a filter inlet (250), a filter outlet (260), a first air pressure sensor...
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WO/2021/248858A1 |
A PLC-based automatic grinding constant pressure control method, comprising: setting a required grinding rotating speed and a required grinding pressure for an object to be ground; generating a control instruction according to the requir...
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WO/2021/252537A1 |
Interpenetrating polymer networks (IPNs) for a forming polishing pad for a semiconductor fabrication operation are disclosed. Techniques for forming the polishing pads are provided. In an exemplary embodiment, a polishing pad includes an...
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WO/2021/250937A1 |
According to the present invention, the sum and the ratio of the torque of a sun gear and the torque of a internal gear are controlled to be within predetermined ranges.
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WO/2021/252540A1 |
A polishing pad for a semiconductor fabrication operation includes a polishing region and a window region, wherein both regions are made of an interpenetrating polymer network formed from a free-radically polymerized material and a catio...
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WO/2021/251890A1 |
A dust extractor (1) comprising − a dust cyclone container (3) with an air inlet (2) for connecting to a hose, the dust cyclone container (3) having a contaminated portion downstream the air inlet (2) and a clean portion downstream the...
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WO/2021/251032A1 |
This device (1) for polishing the outer periphery of a wafer comprises: a stage (11) for retaining a disc-shaped wafer (31) horizontally; a rotational drive part (12) for rotating the stage (11) about the center axis thereof as a rotatio...
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WO/2021/248367A1 |
Disclosed is an outer surface polishing device for high limit bulging rate ultra-thin wall titanium welded pipe production, comprising supports, a worktable, and a servomotor. The supports are fixedly connected on both sides of the botto...
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WO/2021/251108A1 |
Provided are a composition for chemical mechanical polishing and a method for polishing that, while allowing a semiconductor substrate that contains a polysilicon film and/or a silicon nitride film to be polished at a high speed, makes i...
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WO/2021/252363A1 |
During polishing of a stack of adjacent conductive layers on a substrate, an insitu eddy current monitoring system measures sequence of characterizing values. A polishing rate is repeatedly calculated from the sequence of characterizing ...
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WO/2021/250064A1 |
An abrasive product has a flexible abrasive area for abrading surfaces to be abraded and comprises: a fabric; a plurality of flexible loops protruding from the fabric towards the flexible abrasive area, wherein each loop is formed by a p...
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WO/2021/251242A1 |
According to the present invention, it is possible to autonomously replace a polishing tape. The present invention comprises: a stage on which a workpiece is mounted; a polishing head unit provided above the stage in the plumb vertical...
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WO/2021/243868A1 |
A magnesia rice milling grinding wheel and a preparation method therefor. The method comprises the following steps: step S1, mixing and stirring 60-80 parts by weight of silicon carbide, 10-18 parts by weight of activated magnesia, and 8...
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WO/2021/244024A1 |
A spindle structure, comprising: a body (1); a bearing (2), mounted in the body (1); a central spindle (3), inserted into the bearing (2) and capable of rotating with respect to the body (1); a locking member (4), sleeving the periphery ...
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WO/2021/245494A1 |
A multiphase abrasive particle precursor is disclosed. The precursor includes a first phase of a first material with a substantially constant first composition throughout the first phase. The precursor also includes a second phase, of a ...
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WO/2021/244023A1 |
An air bearing spindle and a machine tool. The air bearing spindle comprises: a machine body (1), provided with a spindle hole and an air flow passage; a spindle core (2), provided in the spindle hole in a penetrating manner, the spindle...
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WO/2021/245492A1 |
Various embodiments disclosed relate to an incomplete shaped abrasive particle, articles containing the same, and methods of manufacture.
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WO/2021/245074A1 |
The invention relates to a method for monitoring the resulting compressive residual stresses of components (18) in a shot-peening machining process. According to the invention, the method comprises the steps of: introducing (A) test spec...
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WO/2021/244693A1 |
A grinding device (1) for rolling bodies (2), in particular balls, comprises at least one grinding wheel (3, 4), which is designed for grinding rolling bodies (2) which are guided in at least one track (10) of the grinding wheel (3, 4). ...
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WO/2021/243960A1 |
Provided is a production line for an insulating support of a power supply rail, the production line comprising a workbench (1), supporting legs (2), an electric control cabinet (3), a PLC (4), a compression molding assembly (5), a water-...
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WO/2021/237906A1 |
The present invention provides an apparatus capable of achieving double-sided machining by one-time shot peening, comprising: a shot peening machining system; a workpiece clamping mechanism, used for clamping a workpiece, a first through...
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