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WO/2024/074951A1 |
The present invention relates to a method for machining small rotary cutting tools (10) by a grinding machine, comprising: a) mounting a workpiece (10a) in a spindle (20) of the grinding machine; b) machining a calibration portion (CP) o...
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WO/2024/068884A1 |
This method for selecting in an automated manner a polishing process for an edged lens fitted in a frame comprises: determining (10) in an automated manner whether the lens is embedded in the frame; if the lens is embedded in the frame, ...
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WO/2024/045493A1 |
A shape-controlled flexible polishing method for a microarray mold. The following solution is used: a magnet is mounted below a microarray mold (3), so that a prepared magnetic abrasive is attached to the surface of the microarray mold (...
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WO/2024/036569A1 |
A polishing system (100), a fluid reuse system (500) and a method of polishing a substrate. The polishing system comprises a catch basin (200), a vacuum device (400), and a polishing fluid recycling module (501) for recycling polishing f...
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WO/2024/024178A1 |
This management device 20 comprises a control unit 22 that manages a plurality of wafer processing devices 1. The control unit 22 selects a wafer processing device 1 to be assigned to processing of a prescribed type of wafer from among t...
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WO/2024/018854A1 |
A substrate processing method comprising: preparing a substrate having a first main surface and a second main surface opposite to the first main surface and having waviness in each of the first main surface and the second main surface; i...
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WO/2024/018562A1 |
The purpose of the present invention is to provide a system and a program for enabling workpiece processing precision to be maintained even if a grinding material is worn down. A system comprising at least one computer device, the syst...
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WO/2024/007231A1 |
The present application relates to the technical field of turret machining, and discloses end face tooth polishing equipment for a turret. The equipment comprises a frame; the frame is provided with a workbench; a mounting base for mount...
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WO/2024/001121A1 |
The present invention relates to the technical field of ultra-precision polishing, and particularly relates to a semiconductor wafer magnetically-controlled grinding and polishing integrated disc and a use method therefor. The semiconduc...
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WO/2024/000759A1 |
A multi-field auxiliary abrasive flushing and polishing method and device. The device comprises an abrasive pool, a heating device, an ultrasonic device, a peristaltic pump and a clamping table. The clamping table is mounted at the botto...
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WO/2023/248088A1 |
An abrasive article evaluation system is presented that includes a detector that detects a nonvisual abrasive wear cue and an efficiency indication generator that, based on the abrasive wear cue, generates an indication of wear for the a...
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WO/2023/248086A1 |
An abrasive article evaluation system includes a detector that detects an abrasive wear cue. The system also includes an efficiency indication generator that, based on the abrasive wear cue, generates an indication of wear for the abrasi...
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WO/2023/248087A1 |
An abrasive article evaluation system is presented that includes a camera that images an abrasive article. The system includes an efficiency indication generator that, based on the image, generates an indication of abrasive efficacy for ...
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WO/2023/241412A2 |
The invention relates to a polishing apparatus, a polishing method and a sealing system. The sealing and polishing apparatus comprises a thrust system; a plurality of sealing systems, wherein each sealing system comprises a piston and a ...
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WO/2023/241408A1 |
A surface finishing method for a micro internal flow channel, a micro internal flow channel workpiece, and a finishing medium. The bore of the micro internal flow channel is less than or equal to 3 mm, and the length-to-diameter ratio of...
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WO/2023/240260A1 |
A chemical mechanical polishing (CMP) slurry can comprise a plurality of particles distributed in a carrier, wherein at least a portion of the particles of the plurality of particles can have a body including a core comprising zirconia a...
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WO/2023/231316A1 |
A super-finishing method for a cemented carbide coating of a surface of revolution, comprises the following steps: spraying an outer spherical surface of a surface of revolution part with a cemented carbide coating by means of a spraying...
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WO/2023/228579A1 |
The present invention addresses the problem of providing a polishing device and a polishing method with which a workpiece surface is modified in consideration of a distribution of irregularities on the workpiece surface, and with which m...
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WO/2023/229009A1 |
An aspect of the present disclosure provides a grinding liquid composition that can reduce residue of silica on a substrate surface after grinding is performed, while maintaining a grinding rate. One aspect of the present disclosure pe...
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WO/2023/193079A1 |
The present patent of invention relates to a new type of decorative coating consisting of an assembly comprising as its main element a sheet of natural translucent rock (LR) intercalated with polarised films (PP) which, when exposed to a...
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WO/2023/184634A1 |
The present invention relates to the field of optical thin films, mainly aims at a nodular defect for reducing an optical thin film damage threshold, and particularly relates to a method for improving a thin film laser damage threshold b...
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WO/2023/192128A1 |
A method of polishing a surface of a polycrystalline sintered ceramic body, the method comprising the steps of: a) providing a sintered ceramic body comprising a polycrystalline material and having a density of from about 99.5% to about ...
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WO/2023/190299A1 |
A boron nitride plate surface treatment method according to an embodiment comprises a first polishing step and a second polishing step. In the first polishing step, a surface of a boron nitride plate is polished using a first polishing m...
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WO/2023/146487A1 |
The present invention relates to an ability of processing that can be directed in all directions, by transferring the rotational movement of the shaft (5) to a cord with a steel flexible cut shaft end (10.1) thereof, by means of a change...
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WO/2023/139834A1 |
A chuck device (2) is configured to hold a wafer (W) during planarization of the wafer employing anodization. The chuck device includes a chuck cover (22), a suction section (23), and an energization section (24). The suction section (23...
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WO/2023/127601A1 |
The present invention predicts the occurrence of a waviness anomaly. This waviness prediction device comprises: a data input unit for receiving input of waviness data which is obtained by measuring the waviness of a polishing target surf...
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WO/2023/123207A1 |
The present invention aims to provide a process method for improving the surface smoothness of a combustion turbine blade profile surface, and is capable of improving the smoothness of a blade profile surface without destroying traces fo...
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WO/2023/115886A1 |
Provided are a method and device for processing a special-shaped curved glass contour. The method comprises the following steps: A: obtaining a theoretical track L; B: respectively calculating a transformation matrix Tt m between a tool ...
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WO/2023/103242A1 |
A plate polishing method, wherein a multi-section intelligent swing polishing machine is used for polishing; the multi-section intelligent polishing machine comprises a rack (1); a conveying device (2) and a plurality of fixed supports (...
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WO/2023/087206A1 |
A method for calibrating a crankshaft (10) to be processed is disclosed. The method comprises: causing a positioner (40) to rotate to at least three different angles, wherein the positioner (40) is configured to support the crankshaft (1...
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WO/2023/067214A1 |
The present invention relates to an electrolytic medium for electropolishing and electropolishing method with said medium, the electrolytic medium comprising solid electrolyte particles comprising: solid particles able to retain liquid, ...
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WO/2023/055274A1 |
A method and a device for induced formation of solid lubricant comprises providing (S10) of an article (10) to be processed. The article is exposed (S20) to a process fluid (34) comprising a solvent, impact media (20) and additives of so...
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WO/2023/041891A1 |
A method of manufacturing a moulded article is disclosed. The method comprises forming a body comprising a polymer material. The method further comprises polishing a portion of the body with a polishing element to smooth at least one imp...
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WO/2023/030774A1 |
A method for grinding a semiconductor wafer, wherein the semiconductor wafer is machined in a material-removing manner by means of a grinding tool containing grinding teeth having a height h while supplying a cooling medium into a contac...
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WO/2023/026948A1 |
Provided are: a surface processing method for a GaN substrate, which is capable of performing surface processing on the GaN substrate in a short period of time; and a manufacturing method for a GaN substrate. This surface processing meth...
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WO/2023/027140A1 |
The purpose of the present invention is to provide a magnetic disk substrate and a method for manufacturing same, and a magnetic disk all of which make it possible to maintain high flatness, despite being thin, after a long-term use, be ...
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WO/2023/011979A1 |
The invention relates to a polishing tool (100) for polishing a spectacle lens (L) in a surface machining process, which comprises a tool body (110) for being rotatably supported about a rotational axis (RA1). The tool body (110) compris...
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WO/2023/010621A1 |
A seamless splicing process for a ceramic basin and a countertop, which relates to the technical field of countertop splicing. S1: First, an operator places a ceramic basin on a workbench, and fixes the ceramic basin on the workbench by ...
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WO/2023/004860A1 |
Disclosed in the present invention is an aluminum alloy die casting mold surface deburring treatment device, comprising a grinding kettle, a bottom frame, and a motor. Four bottom frames are mounted at the bottom of the grinding kettle; ...
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WO/2023/004907A1 |
A preparation method for a substrate having a sanding surface. The preparation method comprises: providing a flattening mill, which comprises a first rack and a second rack, wherein the first rack comprises a first working roll and a thi...
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WO/2023/005257A1 |
A floating non-contact ultrasonic reinforced flexible sub-aperture polishing apparatus and a polishing method therefor. The polishing apparatus comprises a flexible tool (101), a horn (102), an ultrasonic transducer (103), an electricall...
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WO/2023/000414A1 |
Disclosed are a method and a device for curvature-adaptive cluster magnetorheological polishing of a free curved surface. The polishing method comprises the following steps: placing a workpiece to be processed in a rotating platform asse...
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WO/2023/277103A1 |
A production method according to the present disclosure comprises: a grinding step in which a group 13 element nitride crystal is contained in an opening of a plate-like carrier, and at least one main surface of the crystal is ground; an...
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WO/2022/261998A1 |
The present invention relates to an ultra-smooth planarization polishing method and apparatus. The apparatus comprises a base, a Z-axis driving mechanism, a revolution driving mechanism, an autorotation driving mechanism, a dynamic magne...
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WO/2022/260128A1 |
The present invention proposes a substrate processing system, and a substrate processing method that can prevent deformation and contamination of a surface on the reverse side from a surface to be processed which is the object of process...
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WO/2022/222280A1 |
A rotary ultrasonic grinding machine tool, comprising a rotary ultrasonic grinding spindle (1), an ultrasonic power transmission device (2), a spindle clamping and lifting device (3), and a part clamping and feeding device (4), wherein t...
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WO/2022/221003A1 |
A method of manufacturing is provided, including forming a metal frame of a head-mounted computing device shaped as a pair of eyeglasses. Forming the metal frame may include additively manufacturing the metal frame of the head-mounted co...
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WO/2022/205656A1 |
A polishing device and polishing process for an indium phosphide substrate, which device and process belong to the technical field of indium phosphide polishing. The polishing device comprises an electrolytic cell, and also comprises an ...
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WO/2022/199184A1 |
A sole grinding method and apparatus using block poses. The method comprises the following steps: A. acquiring a lower edge boundary trajectory of a sole; B. obtaining a final sole grinding trajectory (1); C. dividing the sole grinding t...
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WO/2022/196786A1 |
Provided are a method for manufacturing a GaAs wafer having excellent OF orientation stability even for a GaAs wafer having an off angle, and a GaAs wafer group. A method for manufacturing a GaAs wafer, including: a polishing step for pe...
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