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WO/2023/198902A1 |
The invention relates to a district heating pipe section (10) with a central metal tube (12), a corrosion protection layer, a thermal insulation layer (16) of a polymer foam, and a jacket layer (18) protecting the thermal insulation laye...
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WO/2023/194431A1 |
The present invention relates to a finishing profile member (21) intended to cover an edge surface of a panel (20), comprising: - a reinforcement (23) comprising a web (24), a first flank (26.1) and a second flank (26.2), a first fold (2...
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WO/2023/196290A1 |
Embodiments relate to a compressible conductive foam having high heat conductivity and high electrical conductivity by having a graphite layer surround a core material, and having a metal layer surround the graphite layer. The metal laye...
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WO/2023/195467A1 |
[Problem] To inexpensively manufacture a lightweight and highly rigid resin metal composite panel that, as a laminated panel for building materials and floor and wall materials of vehicles and ships, excels in corrosion resistance and ex...
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WO/2023/196942A1 |
The invention features a flexible laminate including a first plastic layer, a polyurethane adhesive composition, and a metal layer bonded to the plastic layer through the polyurethane adhesive composition, the polyurethane adhesive compo...
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WO/2023/193412A1 |
A sound absorption and bearing integrated structure (3) and a preparation method therefor. The sound absorption and bearing integrated structure (3) comprises first connection nodes (21) and perforated hollow rods connected to the first ...
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WO/2023/195439A1 |
The present invention addresses the problem of providing an electronic component having excellent high-temperature durability. The problem is resolved by an electronic component having a metal portion and having a coating on all or a por...
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WO/2023/195440A1 |
The present invention addresses the problem of providing an electronic component having excellent high-temperature durability. The problem is resolved by an electronic component having a metal portion and having a coating on all or a por...
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WO/2023/194226A1 |
The present disclosure relates to an assembly for a transportation system, the assembly comprising a plurality of magnetic wall modules (100a, 100b) coupled to each other, wherein each module is adapted to conducting current in order to ...
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WO/2023/188745A1 |
With respect to a steel sheet being configured to be formed into a complicated shape that makes the press forming difficult, the purpose of the present invention is to provide a steel sheet and a method for producing the same, the steel ...
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WO/2023/190863A1 |
An insulative sheet according to the present invention comprises a thermosetting resin and a inorganic filler, wherein: the inorganic filler contains boron nitride aggregates; the content of the boron nitride aggregates is not less than ...
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WO/2023/189126A1 |
Provided are: a resin composition able to yield a cured product having excellent resistance to wet heat; a cured product obtained by curing the resin composition; a layered product that includes the cured product; a method for producing ...
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WO/2023/189566A1 |
Provided is a metal foil with a carrier that makes it possible to suppress the occurrence of breakage or cracking of the metal foil during handling. This metal foil with a carrier comprises a carrier, a release layer, and a metal foil in...
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WO/2023/190118A1 |
The purpose of the present invention is to provide: a resin composition that is suitable for use in the production of an insulating layer of a printed wiring board, the resin composition having a high dielectric constant, a low dielectri...
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WO/2023/190979A1 |
Disclosed is a surface-treated steel plate having excellent weldability and corrosion resistance after electropainting. A surface-treated steel plate according to the present disclosure is characterized by including a plated steel plate ...
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WO/2023/187624A1 |
The present invention relates to an adhesive-equipped metal substrate and a laminate that have low dielectric characteristics in a high-frequency range and can adequately ensure the strength of adhesion between a resin film and a metal l...
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WO/2023/189949A1 |
One purpose of the present disclosure is to provide: a multifunctional vinyl aromatic copolymer which enables the achievement of a prepreg that has excellent dielectric characteristics and excellent heat resistance, while having fewer vo...
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WO/2023/189030A1 |
The present invention provides a thermosetting resin composition which is capable of suppressing the generation of a void space between a sheet and an adherend that has a roughened surface even if pressing is performed with a low pressur...
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WO/2023/190601A1 |
The purpose of the present invention is to achieve both excellent dielectric properties and long-term durability. A composition comprising (A) a curable hydrocarbon-based resin, (B) a phenol-based antioxidant, (C) a thioether-based antio...
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WO/2023/190971A1 |
Disclosed is a surface-treated steel sheet that has excellent weldability and corrosion-resistance. A surface-treated steel sheet of the present disclose is characterized by comprising a steel sheet having a Zn-containing plated layer, a...
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WO/2023/190061A1 |
Provided are: a resin composition including a polyimide precursor containing a repeating unit represented by formula (1) and a radical polymerizable compound, wherein ΔSP calculated by the following formula (S) is more than -3.5 MPa1/2 ...
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WO/2023/190477A1 |
This multilayer structure has: a resin-made support body; a metal layer stacked on an upper surface side of the support body; a glass layer stacked on the metal layer; and a adhesive layer stacked on a lower surface of the support body, ...
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WO/2023/189794A1 |
This metal-clad laminated board 100 has a structure that (a metal layer 10A)/(an adhesive layer 20A)/(an inorganic filler-containing fluororesin layer 30)/(an adhesive layer 20B)/(a metal layer 10B) are laminated in this order. The metal...
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WO/2023/191011A1 |
An embodiment of the present invention relates to: a film which comprises a layer A and a layer B, which is on at least one surface of layer A, wherein the dielectric loss tangent of the film is not more than 0.010, and the ratio of the ...
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WO/2023/189298A1 |
Provided is a resin composition that has exceptional heat resistance and enables bonding of a copper foil and a glass substrate using a lamination method. This resin composition contains: two or more polymers selected from the group cons...
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WO/2023/189250A1 |
This conductive film comprises: a substrate 1; a first resin layer 10 provided on the substrate 1; a second resin layer 20 which is provided on the first resin layer 10 and has a trench 25 open in a surface on the opposite side to the fi...
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WO/2023/190612A1 |
The present invention pertains to a laminate comprising a substrate, an underlayer, and a metal layer in the stated order, wherein the metal layer includes a plurality of portions that are at least partially discontinuous with each other...
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WO/2023/189297A1 |
The present invention provides a resin composition which enables the bonding of a copper foil and a glass substrate by a lamination method, while having excellent dimensional stability. This resin composition contains a polyimide resin t...
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WO/2023/188598A1 |
The present invention addresses the problem of providing a polypropylene film that has excellent withstand voltage characteristics and reliability in high-temperature environments, and is suitable for a capacitor or the like used under h...
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WO/2023/190602A1 |
This composition comprises: (A) a curable hydrocarbon resin; (C) a promoter which is a metal compound or a semimetal compound; and (D) a chelating agent having one or two oxygen atoms in one molecule, the composition being characterized ...
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WO/2023/190662A1 |
This laminate (1) comprises: a metal substrate (2) including one surface (21) and another surface (22) in the thickness direction, and also including a side surface (23) linking the peripheral edge of the one surface (21) and the periphe...
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WO/2023/190860A1 |
This surface-treated copper foil has one surface (A) and the other surface (B), wherein the surface (A) satisfies the following requirements (I) and (II). • Requirement (I): on the surface of the surface-treated copper foil, the mirr...
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WO/2023/189839A1 |
Provided is a metal foil with a carrier, such metal foil capable of suppressing unintended releasing of a metal layer, caused by the penetration of chemicals from an end. A copper foil with a carrier is provided with: a carrier including...
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WO/2023/188678A1 |
The present invention pertains to a laminate using a circuit pattern having a thickness of at least 0.8 mm, and proposes a production method that is for the laminate and that is capable of preventing defects from occurring in an insulati...
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WO/2023/190687A1 |
The present invention provides a polyimide precursor composition for flexible wiring boards, the polyimide precursor composition containing a polyimide precursor that has a repeating unit represented by general formula (I). A polyimide f...
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WO/2023/189795A1 |
The present invention contains (A) fluororesin powder and (B) an inorganic filler and further contains one of or both of: (X) one or more oligomers selected from the group consisting of aliphatic or semi-aromatic hydrocarbon-based oligom...
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WO/2023/187010A1 |
The invention relates to a composite material and to a method for producing said composite material, comprising a carrier layer made of an aluminum wrought alloy and an outer solder layer which is provided on one or both faces of the car...
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WO/2023/190833A1 |
Provided is a surface-treated copper foil in which circuit workability is excellent and transmission loss and generation of foreign matter are less likely to occur. When the optical roughness of the surface (20a) of a surface treatment l...
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WO/2023/189132A1 |
Provided are a conductive resin composition-metal laminate and an organ model that can be used for medical procedure training that uses an energy device, and make it possible to affix, at a certain strength or greater, a counter electrod...
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WO/2023/189609A1 |
A resin composition containing a thermosetting resin, an inorganic filler, a copolymer, and an inorganic ion scavenger, wherein the copolymer has a (meth)acrylic monomer unit A having an anionic group, a (meth)acrylic monomer unit B havi...
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WO/2023/190660A1 |
A method for manufacturing a laminate (1) comprises a step for preparing a metal substrate (2), and a step for using sputtering to form an inorganic insulation layer (3) on one surface (21) of the metal substrate (2) in the thickness dir...
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WO/2023/189565A1 |
Provided is a carrier-attached metal foil in which the occurrence of fractures or cracks in the metal foil during handling thereof can be suppressed. The carrier-attached metal foil comprises a carrier, a release layer, and a metal foil ...
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WO/2023/191010A1 |
Provided are a film and a laminate using the film, the film comprising a layer A and a layer B, which is on at least one surface of layer A, the elastic modulus of layer A at 160°C being 100-2,500 MPa, and the difference LA-LB between t...
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WO/2023/190749A1 |
The present invention provides a polyimide precursor composition for flexible wiring boards, the polyimide precursor composition containing a polyimide precursor that has a repeating unit represented by general formula (I). A polyimide f...
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WO/2023/190944A1 |
A clad plate having: a first layer that comprises a stainless steel; a second layer that is bonded to the first layer, and comprises pure aluminum or an aluminum alloy; and a first oxide layer that is present between the first layer and ...
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WO/2023/189719A1 |
Provided is a laminate in which a first substrate, a silane coupling agent layer, and a second substrate are laminated in this order, wherein: [B1] ≥ [A1] is satisfied when A1 is the number of circular floats having a diameter of 0.5 m...
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WO/2023/190442A1 |
The purpose of the present invention is to provide a roll-bonded body that achieves both high peel strength and high resistance to bonding and bending. The present invention relates to a roll-bonded body comprising an aluminum layer an...
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WO/2023/189610A1 |
A resin composition containing a thermosetting resin, an inorganic filler, a copolymer, and an inorganic ion scavenger, wherein the copolymer has a (meth)acrylic monomer unit A having an anionic group, a (meth)acrylic monomer unit B havi...
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WO/2023/190845A1 |
Provided are a copper foil having high adhesion to a coating film, and a light-shielding material having, in addition to excellent light shielding properties, high adhesion to a black coating film and a substrate. A copper foil (1) has, ...
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WO/2023/189256A1 |
The present invention relates to a conductive film provided with a film-like base material and a conductive layer provided on one major surface side of the base material. The conductive layer comprises a first metal layer including a fir...
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