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WO/2024/077886A1 |
The present invention provides a modified bismaleimide prepolymer, which is prepared by reacting a bismaleimide compound, a double-bond-containing organic silicone resin and a hydrocarbon resin, wherein the ratio of the mass of the bisma...
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WO/2024/079925A1 |
The present invention relates to a resin composition comprising a maleimide resin that is compatible even when main skeletons are different from each other. The objective of the present invention is to provide: a curable resin compositio...
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WO/2024/079923A1 |
The purpose of the present invention is to provide a bismaleimide compound-containing resin composition that can be patterned with light, has a glass transition temperature of 200°C or higher, and has a low dielectric dissipation factor...
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WO/2024/079926A1 |
The purpose of the present invention is to provide a bismaleimide compound-containing resin composition that has excellent compatibility, that can be cured by means of light, and that requires less heating time and an additional heating ...
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WO/2024/079924A1 |
Provided are a resin composition that does not inhibit a photocuring reaction in an exposure step and that can provide excellent alkali developability in a development step, and a resin sheet, a multilayer printed wiring board, and a sem...
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WO/2024/075746A1 |
Disclosed is a method for producing a resin composition. The method for producing a resin composition includes: a step of obtaining a polyimide resin by reacting tetracarboxylic dianhydride and a polyamine in an organic solvent; and a st...
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WO/2024/075744A1 |
Disclosed is a method for producing a resin composition. This method for producing a resin composition comprises: a step in which a polyimide resin is obtained by causing a reaction between a tetracarboxylic acid dianhydride and a polyam...
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WO/2024/070840A1 |
An alkyl silyl peroxide which is at least one compound selected from the group consisting of compounds represented by general formula (1) and compounds represented by general formula (2). The alkyl silyl peroxide is a novel polymerizatio...
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WO/2024/070798A1 |
Provided is an aliphatic polycarbonate resin having an ether structure in a main chain thereof, and having a structure in which a repeating unit represented by formula (Ia), a repeating unit represented by formula (Ib), a repeating unit ...
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WO/2024/070841A1 |
Provided are hollow particles which suppress reductions in pressure resistance under high temperatures. The present invention pertains to hollow particles comprising a shell, which includes a resin, and a hollow portion surrounded by the...
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WO/2024/071047A1 |
Provided is a vinyl resin that has excellent solubility against solvents, that provides a cured product having excellent heat resistance, thermal degradation stability, thermal conductivity, low permittivity, low dielectric loss tangent,...
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WO/2024/053662A1 |
Provided are: a light absorption filter containing a resin, a specific dye, and a compound that generates a radical via irradiation with ultraviolet rays, wherein a polymer constituting the resin contains a cross-linkable group; a light ...
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WO/2024/048055A1 |
Provided is a resin composition having excellent solder heat resistance and low dielectric properties. The resin composition contains (A) a polyphenylene ether resin having a functional group containing a carbon-carbon double bond at an ...
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WO/2024/034463A1 |
Provided is a resin composition that not only exhibits high adhesiveness against less rough surfaces and has excellent dielectric properties, but also can stably sustain the high adhesiveness even after a heat load is applied thereto. Th...
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WO/2024/029602A1 |
The present invention provides: a cured molded product having excellent moldability and reliability, and having high thermal conductivity, low water absorption, low thermal expansion, high heat resistance, and flame retardancy; in additi...
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WO/2024/024730A1 |
There is a demand for the development of phenylene ether resins having superior dielectric properties. The present invention provides a phenylene ether resin composition having a number average molecular weight (Mn) of 800-3,000 and cont...
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WO/2024/024331A1 |
The present invention provides a resin composition which is in a liquid state at 25°C and contains (A) an epoxy resin and (B) methacrylic acid anhydride, wherein the epoxy resin (A) contains (A-1) an epoxy resin that is in a liquid stat...
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WO/2024/019088A1 |
A maleimide resin according to the present invention is formed by reacting a tetracarboxylic acid dianhydride (a1), an amine (a2), and maleic anhydride (a3), the amine (a2) including a dimer diamine and a secondary amine that is not a di...
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WO/2024/019084A1 |
Provided is a polymaleimide resin obtained by reacting a tetracarboxylic dianhydride (a1), a diamine (a2), a triamine (a3), and a maleic anhydride (a4), wherein the diamine (a2) contains a dimer diamine.
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WO/2024/009810A1 |
A novel organopolysiloxane represented by average formula (1) can be cured rapidly by the irradiation with ultraviolet ray and can be cured satisfactorily even in a shaded part which ultraviolet ray cannot reach when a dual-curable organ...
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WO/2024/004976A1 |
A polycarbodiimide compound that is a reaction product of a polycarbodiimide (a) having isocyanate groups at both ends, obtained by polymerizing at least one selected from aliphatic diisocyanates and alicyclic diisocyanates, and a polyme...
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WO/2024/005050A1 |
The present invention provides a material which is capable of forming a surface layer on the surfaces of articles such as interior building materials, household electrical appliances, precision machinery and electronic devices, the surfa...
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WO/2024/005021A1 |
The present invention addresses the problem of providing: a composition capable of forming a film which exhibits excellent thermal cycle properties; a transfer film; a method for producing a laminate; a laminate; and a method for produci...
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WO/2024/004618A1 |
Provided is a resin material having high heat resistance and adhesion while having a low relative permittivity and dielectric loss tangent. The present invention provides a polyfunctional vinyl resin represented by general formula (1)....
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WO/2023/248783A1 |
Provided is a toner seal member which exhibits excellent performance. A toner seal member (10) comprises a foam layer (20) and a coating layer (30), the coating layer (30) being exposed. The coating layer (30) is based on polyol, isocy...
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WO/2023/243262A1 |
The present invention provides a vinyl group-containing prepolymer which has excellent dielectric characteristics. A vinyl group-containing prepolymer according to one embodiment of the present invention comprises: a first moiety that ...
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WO/2023/238840A1 |
Provided are: a copolymer that has high degradability by outside stimulation such as light and has a polyester structure and a polyether structure, preferably a polyester-polyether copolymer that has at least two radical polymerizable un...
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WO/2023/238835A1 |
The present invention pertains to: a silsesquioxane derivative which is represented by formula (1) and which, when being cured, can provide a cured product having an elastic modulus exceeding 4.0 GPa at 23°C; a method for producing the ...
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WO/2023/228050A1 |
Described herein is a composite adhesive composition. The composition comprises: a plurality of polymeric nanoparticles dispersed within a (meth)acrylate-based matrix; and the (meth)acrylate-based matrix is derived from a C1 to C12(meth)...
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WO/2023/219039A1 |
The present invention provides: a urethane (meth)acrylate which is obtained by reacting 75-90% by mass of a polyoxyalkylene derivative (A) represented by formula (1), 10-25% by mass of a polyisocyanate compound (B) represented by formula...
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WO/2023/216495A1 |
Provided are a dynamic antibacterial hydrogel based on a natural receptor ligand recognition effect, a preparation method and use, which belong to the field of biomedical materials. First, a modification material is used to modify the li...
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WO/2023/218876A1 |
The present invention provides: an alkali-soluble resin that can give highly solvent-resistant cured products even under low-temperature curing conditions and can be suitably used for various applications such as color filters; and a pho...
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WO/2023/210562A1 |
The present disclosure provides a curable polymer which enables the achievement of a resin that is effectively reduced in the dielectric loss tangent (Df) under high frequency conditions, while having a sufficiently high glass transition...
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WO/2023/210628A1 |
Provided is a phenoxy(meth)acrylate resin which can form cured objects having excellent flexibility and inhibited from having warpage due to cure shrinkage. The phenoxy(meth)acrylate resin comprises a structure represented by formula (1)...
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WO/2023/210338A1 |
The present disclosure provides a curable polymer able to yield a resin in which the dielectric loss tangent (Df) under high frequency conditions is effectively lowered and the glass transition temperature (Tg) is sufficiently high. This...
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WO/2023/199692A1 |
The present invention provides: a resin composition for prepregs, the resin composition enabling the achievement of a molded article that has both impact resistance and heat resistance in a highly balanced manner; a prepreg; and a molded...
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WO/2023/190392A1 |
Provided is a macro-polymerization initiator represented by general formula (1). General formula (1): (In general formula (1), P1 represents polyolefin. R1 represents any one of a hydrogen atom, an aliphatic group, an aromatic group, a...
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WO/2023/184785A1 |
The present application belongs to the technical field of concrete admixture preparation, and particularly relates to a crosslinked polycarboxylic acid water reducer and a preparation method therefor. The method comprises: (I) preparing ...
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WO/2023/190601A1 |
The purpose of the present invention is to achieve both excellent dielectric properties and long-term durability. A composition comprising (A) a curable hydrocarbon-based resin, (B) a phenol-based antioxidant, (C) a thioether-based antio...
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WO/2023/190725A1 |
This invention provides a curable composition comprising component (A), a fluoropolyether-group-containing acrylic compound containing (meth)acrylic groups, hydrolyzable silane groups, and fluoropolyether groups; component (B), a fluorop...
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WO/2023/190723A1 |
The present invention provides a curable composition which contains: a fluoropolyether group-containing acrylic compound that comprises a (meth)acryl group, a hydrolyzable silane group and a fluoropolyether group (component (A)); a fluor...
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WO/2023/189496A1 |
Provided is a rubber composition that contains a copolymer represented by general formula (1) and a filler. (In general formula (1): R1 to R4 are each independently a hydrogen atom, a halogen atom, an optionally substituted hydrocarbon g...
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WO/2023/190929A1 |
An active energy ray curable polyolefin resin (A) according to the present invention exhibits high detachment strength, water resistance, and adhesion force with respect to a polyolefin base material, and is characterized by having a car...
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WO/2023/190742A1 |
The present invention provides a curable composition comprising: component (A) that is a fluoropolyether group-containing acrylic compound containing a (meth)acrylic group, a hydrolyzable silane group, and a fluoropolyether group; compon...
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WO/2023/190037A1 |
This silicone skeleton-containing compound is represented by formula (1). (In the formula, each R1 independently represents a monovalent organic group, each R2 independently represents a divalent organic group, each R3 independently repr...
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WO/2023/190766A1 |
The present invention provides a curable composition comprising: component (A) which is a fluoropolyether group-containing acrylic compound including an acrylic group, a hydrolysable silane group, and a fluoropolyether group; component (...
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WO/2023/176172A1 |
Provided are: a polyimide resin precursor that yields a polyimide resin having a low dielectric loss tangent and excelling in a chemical resistance property; a production method for the polyimide resin precursor; a photosensitive resin c...
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WO/2023/171613A1 |
A photocurable composition according to the present invention contains a curable resin component, a photopolymerization initiator and an inorganic filler. The curable resin component contains a multifunctional curable compound which has ...
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WO/2023/169028A1 |
The present invention relates to the field of medicine. Specifically provided are a hemostatic sponge and a preparation method therefor. Components for preparing the hemostatic sponge comprise, by mass, 3-30 parts of a double bond-contai...
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WO/2023/171554A1 |
Provided are: a resin composition having excellent moisture absorption heat resistance while maintaining excellent low dielectric properties (Dk and/or Df); a cured product; a prepreg; a metal foil-clad laminate; a resin composite sheet;...
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