| Document |
Document Title |
|
JP3387080B2 |
To obtain a cement dispersant having the ability to highly disperse cement with sustained dispersibility by using, as the main component, a polymer compound prepared by reaction of a melaminesulfonic acid-formaldehyde condensate with a c...
|
|
JP2003048936A |
To provide a polyhydric phenol capable of giving cured products which have high fundamental performance such as physical properties and heat resistance and have high flame retardancy as well. This polyhydric phenol is obtained by reactio...
|
|
JP2003012747A |
To obtain a new curable resin having excellent heat resistance and mechanical characteristics of cured material and improved flame retardance.This curable resin is characterized by comprising a dihydronaphthoxazine ring containing a subs...
|
|
JP2002338648A |
To provide a method for producing a heat-curing resin having a benzoxazine ring which does not enlarge a molecular weight to bring about an insoluble matter during the synthetic reaction and needs neither an apparatus nor a complicated p...
|
|
JP2002302590A |
To provide both a phenol resin laminate having excellent tracking resistance and flame retardance and a method for producing a fiber substrate copper-clad laminate having such performances.This phenol resin composition for the laminate i...
|
|
JP3327039B2 |
|
|
JP3327038B2 |
|
|
JP2002256046A |
To provide a method for producing a polyol compound capable of producing a rigid polyurethane foam excellent in flame retardancy, heat resistance, moldability, an insulating property and dimensional stability, and to obtain a polyurethan...
|
|
JP3320895B2 |
A process for producing fibres by spinning a resin by a centrifugal spinning process comprises supplying a resin solution having a viscosity from 50 to 200 Pa.s to a whirler plate and ensuring that the resin solution is under a sufficien...
|
|
JP2002527587A |
Phenol/aldehyde resins particularly phenol/formaldehyde resins are manufactured by replacing a proportion of the phenol content by a mixture of at least two different natural materials having a phenolic content. The resulting resins whic...
|
|
JP3317481B2 |
|
|
JP2002226536A |
To provide a thermosetting resin composition which has excellent flame retardancy without deteriorating adhesion and other characteristics, and to provide a laminate which uses the thermosetting resin composition and is used for circuit ...
|
|
JP2002524630A |
Mannich polyols having a viscosity of from 300 to 3,500 cps (0.3 to 3.5 Pa*s) at 25° C. are prepared by admixing a phenol, an alkanolamines, and formaldehyde mixed in molar ratios of from 1:1:1 to 1:2.2:2.2 resulting in an initiator whi...
|
|
JP2002212252A |
To provide a triazine modified phenolic resin composition having good adhesion to copper when the composition is cured.The manufacturing method of the triazine modified phenolic resin composition comprises addition reacting and condensat...
|
|
JP2002212253A |
To provide a triazine modified phenolic resin composition giving good tracking resistance of to the cured product.The manufacturing method of the triazine modified phenolic resin composition comprises addition reacting and condensation r...
|
|
JP2002212270A |
To provide a curing agent for epoxy resins which has a low melt viscosity, excellent low stress properties, low hygroscopicity and an epoxy resin composition with excellent moldability, and a semiconductor sealing composition which use t...
|
|
JP2002522600A5 |
|
|
JP2002161188A |
To provide a thermosetting resin composition having dihydrobenzoxazine ring in which moldability and setting property are improved without lowering various properties such as mechanical property, and its hardened matter.The thermosetting...
|
|
JP2002145974A |
To provide a laminate for a printed wiring board capable of forming a microcircuit required when a higher density of the printed wiring board is promoted and satisfying the flame retardance UL94-V without containing a halogen and an anti...
|
|
JP2002145975A |
To provide a paper substrate silver-clad laminate having excellent heat and moisture resistances, punchability and flame retardance.This resin composition is obtained by reacting a reactional product prepared by reacting a mixture of a p...
|
|
JP3277810B2 |
To obtain a phenol resin excellent in heat resistance, moisture absorption resistance, and thermosetting properties by selecting a phenol resin comprising repeating units formed by bonding a xylylene component, a phenylmethine component,...
|
|
JP2002075357A |
To provide a lithium ion secondary battery having a large charge- discharge capacity.The negative electrode of this lithium ion secondary battery consists of a carbon material obtained through a heat treatment of two resin materials; (a)...
|
|
JP3256034B2 |
PURPOSE: To obtain an amino cocondensation resin excellent in resistances to water and boiling water, weatherability, and adhesive properties by producing a specific deriv. of a cocondensate of an amino compd., a phenol, and an aldehyde ...
|
|
JP2002037862A |
To provide a curing composition composed of a glycidyl compound, an amine curing agent, and a new low-viscosity curing accelerator.This curing composition is composed of a) an epoxy resin, b) the amine curing agent and c) the curing acce...
|
|
JP2002503264A |
An improved oxazolidine-based hardener to be used with a resorcinol resin or a tannin resin as the adhesive for the bonding of wood articles. Preferably, an oxazolidine is combined with a base such as NaOH and a powdered absorbent such a...
|
|
JP2001526329A |
The invention relates to the utilization of melamine resin fibers, an insulating material containing a) 5 to 95 wt. % melamine resin fibers and b) 5 to 95 wt. % poly(alkylene terephthalate) fibers, and to a method for the production ther...
|
|
JP3236382B2 |
PURPOSE: To obtain a phenolic resin having an excellent thermosetting property and excellent in heat resistance and moisture resistance by reacting a phenolic compound, a polycyclic aromatic aldehyde and a specific xylylene compound ix t...
|
|
JP2001335954A |
To provide a chromium-free metallic surface treating agent imparting excellent corrosion resistance, a coating adhesion and fingerprint resistance to a metallic material or the like.This metallic surface treating agent contains a polymer...
|
|
JP3231753B2 |
A curable moulding composition in the form of a flowable particulate solid substantially non self-adhesive at temperatures up to 60 DEG C, flowable under shear and self-adhesive at temperatures in the range 60-150 DEG C and hardenable at...
|
|
JP2001294646A |
To obtain an epoxy resin composition excellent in moldability, flame retardancy and solder crack resistance. This epoxy resin composition for sealing semiconductors is characterized in that the composition comprises (A) an epoxy resin re...
|
|
JP2001279246A |
To provide a new nitrogen-based flame retardant, and to obtain a flame-retardant polyamide resin composition which contains the new nitrogen- based flame retardant, has excellent flame retardancy, weather resistance and mechanical charac...
|
|
JP2001278934A |
To provide a thermosetting resin having an excellent flame retardance and a prepreg, a laminate for printed wiring board, a semiconductor-sealing material as a well as a molding material using the resin. In the resin syntbesized from a p...
|
|
JP2001261786A |
To provide the subject resin composition having a combination of high soldering resistance with high chemical resistances through reducing the use of any halogen-based flame retardant or without involving the use of such a flame-retardan...
|
|
JP2001261787A |
To provide an epoxy resin composition capable of giving excellent flame-retarding effect without being accompanied by lowering heat resistance and water resistance when used in electrical laminates in place of laminates containing haloge...
|
|
JP2001514982A |
The invention relates to a continuous process for preparing aminoplastics and/or phenolics, in which a precondensate solution is prepared in a first extruder (14), the precondensate solution is continuously fed, with addition of additive...
|
|
JP2001515109A |
An improved oxazolidine-based hardener to be used with a resorcinol resin or a tannin resin as the adhesive for the bonding of wood articles. Preferably, an oxazolidine is combined with particulate silica, and the resin is combined with ...
|
|
JP3207412B2 |
|
|
JP3207410B2 |
|
|
JP3207411B2 |
|
|
JP2001234029A |
To provide a thermosetting resin composition shortened in curing time and capable of maintaining the properties of the cured product thereof such as mechanical strength.This thermosetting resin composition essentially comprises (A) a nov...
|
|
JP2001234036A |
To provide a resin composition for semiconductor sealing excellent in flame retardance, flowability and moisture proof reliability and a semiconductor device using the above resin composition.This resin composition for semiconductor seal...
|
|
JP2001226464A |
To obtain an epoxy resin composition excellent in flame retardance, heat and moisture resistance and advantageously used for sealing semiconductors, laminated sheets, electrical insulation, etc.This curable resin composition comprises th...
|
|
JP2001214029A |
To obtain a flame retardant high-permittibity resin composition and a prepreg and a laminated sheet using the resin composition, especially a laminated sheet useful as a printed wiring board because the development of a high-permittivity...
|
|
JP2001213925A |
To provide a method for manufacturing a triazine-modified phenolic resin for a laminated board excellent in flame retardancy and inexpensive without deteriorating heat resistance.The method for manufacturing a triazine-modified phenolic ...
|
|
JP2001192500A |
To obtain a high thermal conductive polymer based boron nitride composition having low viscosity and a surface-treated boron nitride material used as filler in the composition and provide a method for producing the above composition. Hex...
|
|
JP3190055B2 |
|
|
JP2001187810A |
To provide a phenol-amino condensation resin excellent in heat resistance, water resistance, flame retardancy, mechanical strengths, curability, etc., and an epoxy resin composition using the resin. The phenol-amino condensation resin is...
|
|
JP2001139651A |
To provide a polyol compound which, when reacted with an isocyanate compound, can produce a rigid polyurethane foam excellent in flame retardance, heat resistance, moldability, heat insulation properties, dimensional stability, and adhes...
|
|
JP2001139650A |
To provide a new phosphorus-containing polymer having a phenolaldehyde structure. This new phosphorus-containing polymer comprises repeating units (a), repeating units (b) consisting of repeating units (b1) or repeating units (b2), and o...
|
|
JP2001131828A |
To produce a thermosetting/thermoplastic fiber, such as a melamine fiber having improved properties while maintaining noncombustibility, heat resistance and flame resistance. This thermosetting/thermoplastic fiber is obtained by modifyin...
|
