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WO/2023/149521A1 |
Provided is a resin composition with which it is possible to obtain a cured product wherein the dielectric loss tangent can be kept low and increases in the melt viscosity can be suppressed. This resin composition contains (A) a silane c...
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WO/2023/149209A1 |
The object of the present invention is to provide a resin composition, etc., from which a cured product having excellent insulation reliability under high temperature and high humidity environments can be obtained, even in the case of a ...
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WO/2023/148996A1 |
Provided are a resin composition that enables fine pattern processing even on a rough-surfaced substrate made of a ceramic or the like, a resin composition film, and a semiconductor device in which these are used. A resin composition con...
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WO/2023/149493A1 |
The present invention provides an epoxy resin that has favorable melt-kneadability, has solvent solubility, and is for use in layering, molding, casting, adhesion, or the like. The present invention also provides an epoxy resin compositi...
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WO/2023/149210A1 |
Provided is an underfill material that enables filling time to be reduced and that makes it possible to obtain a cured product having excellent crack resistance. The underfill material contains, (A) an epoxy resin having two or more epox...
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WO/2023/145341A1 |
Provided is a curing agent composition for a thermosetting resin obtained by comprising a curing agent A, a curing agent B, and a curing agent C, the curing agent composition being characterized in that: the curing agent A is an aromatic...
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WO/2023/142101A1 |
The present invention relates to a three-component composition consisting of a polyol component (A) comprising a polyol P1a with an average molecular weight of 800 to 30'000 g/mol, a reaction product RP of at least one mono-functional ep...
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WO/2023/145580A1 |
The present invention provides: a diepoxy compound from which a cured product having a sufficiently low water absorption rate and excellent flexibility is obtained; a curable composition using said diepoxy compound; a cured product; and ...
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WO/2023/140644A1 |
The present invention provides: an epoxy resin having a novolak structure containing polyalkylene glycol ether epoxy; a method for manufacturing same; and a liquid resin composition for semiconductor device encapsulation, wherein the liq...
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WO/2023/139814A1 |
The present invention enables patterning to be performed without generating residues during development and provides a high elastic modulus and a low linear expansion coefficient. This resin composition contains a high molecular weight c...
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WO/2023/140256A1 |
Provided is a modified epoxy resin that is represented by formula (1) and includes a structural unit derived from an epoxy compound and a structural unit derived from an acid-terminated polyester, and in which the weight average molecula...
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WO/2023/139578A1 |
The technology concerns formulations for additive manufacturing comprising dual-cure materials and multifunctional curing agents.
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WO/2023/135890A1 |
The present invention provides an epoxy resin composition comprising the following components (A) to (D). (A): An epoxy resin. (B): An epoxy resin curing agent that contains a reaction composition (b) containing the reaction product of a...
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WO/2023/136017A1 |
Provided is a resin composition for a flexible device, the resin composition containing an epoxy resin and a phenoxy resin. The glass transition temperature of the cured product of the resin composition is 60°C or higher and the storage...
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WO/2023/134613A1 |
A hyaluronic acid derivative or a salt thereof, and a preparation method therefor and an application thereof. Hyaluronic acid is used as a matrix skeleton, and a methoxypolyethylene glycol epoxy derivative is used to modify hyaluronic ac...
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WO/2023/135460A1 |
Disclosed herein is a capped poly(phenylene ether) having an activated ester end group and a structure as further defined herein. The capped poly(phenylene ether) can be particularly useful in curable compositions, thermoset compositions...
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WO/2023/136620A1 |
The present invention relates to: a recyclable epoxy compound; a method for preparing same; an epoxy composite material comprising same; and a decomposition method thereof, wherein the epoxy compound does not use bisphenol A-type epoxy w...
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WO/2023/134036A1 |
The present invention relates to the field of high polymer materials, in particular relates to environment-friendly vinyl ester resin. The environment-friendly vinyl ester resin in the present invention is prepared by mixing the followin...
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WO/2023/136098A1 |
One purpose of the present invention is to provide a curable resin composition from which a cured product having high reliability can be obtained. Another purpose of the present invention is to provide a cured product of the aforesaid cu...
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WO/2023/137147A1 |
The present disclosure provides a nanotube dispersion that includes a dispersion medium, a polyetheralkanol amine dispersant and carbon nanotube material. The nanotube dispersion may be used in various applications, such as in the produc...
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WO/2023/132249A1 |
Provided is a resin composition for a lens, the resin composition containing: a cationic photopolymerization initiator (X), which contains a salt formed from an anion represented by general formula (1) and a cation; and an epoxy compound...
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WO/2023/132158A1 |
This resin composition for forming a temporary fixative contains an acrylic rubber having an epoxy group and a silicone compound having an amine group. When a film is formed by heating this composition for 5 minutes at 90°C and for 5 mi...
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WO/2023/132317A1 |
Provided is a curable resin composition which has very low CTE and is excellent in terms of heat resistance and crack resistance and of filling property and adhesiveness to copper platings. This curable resin composition comprises (A) ep...
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WO/2023/132360A1 |
The purpose of the present invention is to provide a thermosetting resin composition that has high impregnation property for an insulating sheet and excellent mechanical properties without causing cracks after curing. The present inventi...
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WO/2023/127402A1 |
Provided are: a photosensitive composition which can form a cured product that is finely patterned and exhibits excellent adhesion to a substrate even if heat treated at a low temperature; a cured product of said photosensitive compositi...
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WO/2023/128018A1 |
The present invention provides an epoxy foaming composition containing a carboxyl group for the manufacture of a ship structure, the composition comprising: a main material including a) a first epoxy resin, b) a second epoxy resin contai...
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WO/2023/128254A1 |
The present invention relates to an epoxy resin composition and pressure vessels manufactured using same and, more specifically, to an epoxy resin composition that is excellent in both elongation and glass transition temperature and is t...
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WO/2023/127709A1 |
Provided is an alicyclic epoxy resin composition that maintains excellent dielectric properties and exhibits a remarkably improved reaction rate with an active ester curing agent as compared with conventional compositions. More specifica...
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WO/2023/126369A1 |
The present invention relates to an alkoxylated cycloaliphatic epoxide according to the following formula (I) wherein each R1 and R2 is independently selected from H and Me; L is the residue of a polyol; each a is independently from 2 to...
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WO/2023/127401A1 |
Provided are: a photosensitive composition which can form a patterned cured product that even if heat treated at a low temperature, exhibits excellent organic solvent resistance, has a high degree of curing and has a rectangular cross-se...
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WO/2023/128069A1 |
The present invention relates to an epoxy resin composition that has a high refractive index and high adhesiveness, and an encapsulant comprising same, wherein the composition can be applied to various methods, such as an inkjet or a dis...
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WO/2023/126860A1 |
The present disclosure provides a curable adhesive composition precursor, comprising a first part (A) comprising (i) at least one first epoxy curing agent selected from diamines; (ii) at least one second epoxy curing agent selected from ...
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WO/2023/128067A1 |
The present invention relates to an epoxy resin composition that is stable at high temperatures, and an encapsulant comprising same, wherein the composition can be applied to various methods, such as an inkjet or a dispensing coating met...
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WO/2023/127800A1 |
An epoxy resin composition containing an epoxy resin (A) and a curing agent (B) having heteroatoms, the molecular weight α of the curing agent (B) having the heteroatoms being 200≤α≤1200, and the value of α/β, which is the ratio ...
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WO/2023/127797A1 |
Provided is a photopolymerizable resin composition from which a cured product having a mat tone can be obtained, even while having a compositional makeup suitable for ink-jet printing. The photocurable resin composition contains: a (meth...
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WO/2023/128068A1 |
The present invention relates to an epoxy resin composition that has a high refractive index and high adhesiveness, and an encapsulant comprising same, wherein the composition can be applied to various methods, such as an inkjet or a dis...
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WO/2023/127523A1 |
The present invention provides a resin composition which has substrate processing adequacy including embeddability into substrate relief patterns, heat cycle resistance and plating solution resistance, and which enables the achievement o...
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WO/2023/123845A1 |
The present invention provides an epoxy resin composition. A curing agent containing a disulfide bond is used in the composition for curing an epoxy resin to obtain the curing temperature of the composition; a slurry prepared from the ep...
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WO/2023/126312A1 |
Presently claimed invention is directed to a polymer (D) obtained by reacting a) at least one epoxide (E) having an average functionality of ≥ 3.0 and a number average molar weight in the range of from 250 to 25000 g/mol as determined ...
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WO/2023/127708A1 |
Provided is an alicyclic epoxy resin composition which can maintain excellent dielectric properties and which exhibits more significantly improved reaction speed with an active ester curing agent, as compared to the prior art. More speci...
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WO/2023/120946A1 |
Disclosed are an additive for an epoxy adhesive and a one-component epoxy adhesive composition comprising same. The additive for an epoxy adhesive may be obtained by reacting epoxy, maleinized polybutadiene and polyetheramine. In additio...
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WO/2023/117111A1 |
The invention relates to an especially recyclable composite material which consists of at least two material layers (1, 4) bonded by a layer (2) of adhesive. For an easy and clean separation of the two material layers the adhesive consis...
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WO/2023/120738A1 |
This sealing material composition comprises an epoxy resin, a curing agent, an inorganic filler material, and a silicone compound. In results of 1H NMR measurement carried out in CDCl3, when the chemical shift integral value of the silic...
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WO/2023/119850A1 |
The present invention provides an aqueous resin composition comprising an aqueous resin emulsion (α), a curing agent (β), a curing accelerator (γ), and a silane coupling agent (δ), in which: (α) contains a copolymer (X), a polyepoxy...
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WO/2023/117933A1 |
A process for preparing a reshapable thermoset resin material comprising curing epoxy resin wherein curing is carried out with (a) at least one imidazole compound and (b) at least one benzotriazole compound.
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WO/2023/121686A1 |
A coating composition for producing high performance heat-resistant coating materials for a variety of substrates including steel and metal and non-metal substrates as well as laminate structures and self-contained substrates. The coatin...
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WO/2023/120616A1 |
The present invention provides a composition for forming a resist underlayer film, the composition comprising a solvent and a polymer containing the structure represented by formula (A). (In formula (A), "*" represents a bond.)
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WO/2023/119107A1 |
The present invention relates to a bonding resin useful for example in the manufacture of laminates, mineral wool insulation and wood products such as plywood, oriented strandboard (OSB), laminated veneer lumber (LVL), medium density fib...
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WO/2023/118667A1 |
The present invention is directed to sulfur-bridged difuran polyesters comprising a dicarboxylate component and a diol component. The present invention is further directed to films, coatings, packaging materials or packages comprising sa...
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WO/2023/120683A1 |
One purpose of the present invention is to provide a sealing agent for liquid crystal display elements, the sealing agent being excellent in terms of storage stability, adhesive properties, and low liquid crystal contamination properties...
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