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Matches 301 - 350 out of 47,191

Document Document Title
WO/2023/120740A1
A resin composition containing an epoxy resin, a curing agent, and a curing promoter, the glass transition temperature of a cured product being 150°C or higher, the curing promoter containing no functional group reacting with epoxy groups.  
WO/2023/119106A1
The present invention relates to a bonding resin useful for example in the manufacture of laminates, mineral wool insulation and wood products such as plywood, oriented strandboard (OSB), laminated veneer lumber (LVL), medium density fib...  
WO/2023/120542A1
This adhesive composition contains: a pyridinium salt represented by general formula (1); a cationic polymerizable compound; and a polymerization initiator, wherein the polymerization initiator contains an onium salt. An adhesive film fo...  
WO/2023/117112A1
The invention relates to a compound material, especially a recyclable composite material which consists of at least two material layers (1, 2) bonded by a layer (2) of adhesive. For an easy and clean separation of the two material layers...  
WO/2023/119854A1
[Problem] The purpose of the present invention is to provide a two-part curable resin composition that has excellent room temperature curability and is capable of suppressing coloring of the cured product. [Solution] A two-part curable r...  
WO/2023/120739A1
An epoxy resin composition according to the present invention contains an epoxy resin, a curing agent, an inorganic filler and a silicone compound; and the silicone compound is configured so as to satisfy the relational expression (visco...  
WO/2023/120355A1
Provided are: an alkali-soluble resin which, even under low-temperature curing conditions, can give cured objects having excellent solvent resistance and which is suitable for use in various applications including color filters; and a ph...  
WO/2023/112703A1
The present invention addresses the problem of providing a liquid composition capable of forming a hard coat layer having excellent toughness. A liquid composition according to the present invention includes a polymer obtained by perform...  
WO/2023/114040A1
Provided is a dual-cure epoxy and cyclic carbonate-containing urethane compound comprising an oxidized cyclic carbonate containing allyl-functional-carbamate which comprises a reaction product of a cyclic carbonate containing allyl-funct...  
WO/2023/109165A1
The present invention belongs to the field of underfill materials for chips, and relates to a high-Tg reworkable underfill material capable of realizing rapid filling at room temperature, and a preparation method therefor and the use the...  
WO/2023/108764A1
An epoxy resin adhesive layer material for road and bridge materials, and a preparation method therefor. The material comprises the following components in parts by weight: 70-100 parts of an epoxy resin, 5-20 parts of a reactive diluent...  
WO/2023/111715A1
Compositions, such as adhesive compositions, are described comprising a cleavable crosslinker. The composition further comprise an epoxy resin and/or at least one other free-radically polymerizable monomer, oligomer, polymer, or combinat...  
WO/2023/110981A1
The present invention relates to an epoxy resin composition useful as thermoset for paint, coatings or adhesives comprising a polyepoxide derived from poly(limonene carbonate), a polymer produced from biomass (free from bisphenol A and a...  
WO/2023/112982A1
The purpose of the present invention is to provide a curable resin composition for electronic devices that, in the form of an article cured therefrom, has exceptional heat resistance and minimal outgassing while having a low dielectric c...  
WO/2023/114041A1
Provided is a dual-cure epoxy and cyclic carbonate-containing urethane compound comprising an oxidized cyclic carbonate containing allyl-functional-carbamate which comprises a reaction product of a cyclic carbonate containing allyl-funct...  
WO/2023/110524A1
The present invention relates to new cationic polymers, a synthesis process for preparing them from urea diamine condensates and polyepoxide derivatives, notably bisepoxide derivatives, and to the use of said new cationic polymers for su...  
WO/2023/108111A2
Provided herein are branched BAE/BTE -containing polymers useful as vehicles for the delivery of therapeutic agents, such as nucleic acids. The polymers form stable compositions and are suitable for the delivery of therapeutic agents via...  
WO/2023/100828A1
The present invention provides a novel curable composition that makes it possible to obtain a cured product even by using a monoepoxy compound alone. More specifically, the present invention provides a curable composition containing a vi...  
WO/2023/099831A1
The present invention relates to a method for manufacturing a lightweight epoxy resin core, to a lightweight epoxy resin obtained by the method of the invention, and to the uses thereof for producing cores for hollow parts intended, in p...  
WO/2023/100736A1
A substrate laminate (10) has a first substrate (11), a second substrate (12), and a cured object layer (13) that adheres the first substrate (11) and the second substrate (12) together. The cured object layer (13) is formed of a cured o...  
WO/2023/100631A1
Provided is a phenoxy resin that has excellent flexibility, and is capable of suppressing warping caused by curing shrinkage and of obtaining a cured product having a self-repair function. A phenoxy resin including a structure represente...  
WO/2023/099435A1
The present invention relates to a curable epoxy resin composition comprising at least one epoxy resin, at least one epoxy resin curing agent, in particular selected from polyamines, and at least one silane selected from the group consis...  
WO/2023/099254A1
A liquid for inkjet printing comprising resin particles, the resin particles are obtainable by reaction between a polyamine crosslinker comprising at least two primary or secondary amines and a quaternary ammonium group and a compound co...  
WO/2023/100119A1
The present invention provides a single-component epoxy adhesive composition and a preparation method thereof. The single-component epoxy adhesive composition comprises, based on the total weight thereof as 100 wt%: 42-67 wt% of an epoxy...  
WO/2023/100722A1
Provided is an epoxy resin from which a cured product exhibiting excellent dielectric characteristics and also having favorable mechanical characteristics is obtained. The epoxy resin is characterized by having a structure represented by...  
WO/2023/100572A1
Provided are an epoxy resin composition that exhibits excellent low dielectric characteristics, a polyhydric hydroxy resin and/or an epoxy resin that provides the epoxy resin composition, and a method for producing those. The polyhydri...  
WO/2023/094361A1
The present invention relates to epoxy resin compositions that comprise at least one liquid epoxy resin EF, at least one amine curing agent AM, 1.0-6.0% by weight relative to the total weight of the epoxy resin composition of at least on...  
WO/2023/094257A1
A polymer is obtainable by a method comprising the following steps: a) reacting a-i) at least one compound being selected from the group consisting of polyhydroxy-functionalized compounds, polyepoxy-functionalized compounds, polythiol-fu...  
WO/2023/092575A1
Disclosed are an organic dibasic acid modified epoxy acrylate prepolymer and a photo-thermal dual-curing conductive adhesive prepared from the modified epoxy acrylate prepolymer. The modified epoxy acrylate prepolymer is prepared in part...  
WO/2023/095601A1
Provided is a latent curing agent that includes: porous particles supporting an aluminum chelate compound; and, on the surface of the porous particles, a coating containing a polyolefin resin and a silane coupling agent having isocyanate...  
WO/2023/095461A1
The present invention provides a composition for forming a protective film, the composition being capable of forming a protective film that has excellent resistance to a wet etching liquid for semiconductors such as a basic hydrogen pero...  
WO/2023/095615A1
According to the present invention, an epoxy resin composition that is capable of combining flexibility, toughness, and adhesiveness and that can be dismantled easily by heating, a cured product thereof, and a laminate can be provided. T...  
WO/2023/088977A1
The invention relates to a composition (C) comprising (A) 70 to 95 parts by weight of an epoxide resin having a viscosity of between 1 and 150 kPa.s at a temperature of between 20°C and 25°C, and (B) 5 to 30 parts by weight, per 100 pa...  
WO/2023/090317A1
The present invention provides a curable resin composition that yields a cured product having reduced surface gloss, and a sealing material that includes the same. The present invention also provides a cured product that is obtained by c...  
WO/2023/090026A1
The present invention provides a microcapsule type curable resin composition which is applied to a screw member so as to reduce the generation of dust when the screw member is screwed into a base material, while additionally having excel...  
WO/2023/090389A1
[Problem] The purpose of the present invention is to provide: a curing agent that can suppress change in viscosity of a one-part type curable resin composition and that does not affect physical properties of a cured product; and a method...  
WO/2023/089998A1
Provided are a curable composition which has high compatibility even when containing a hydrocarbon resin (hydrocarbon plasticizer) having extremely low polarity and a cured product of which has a low dielectric loss tangent, a cured prod...  
WO/2023/089122A1
A curable epoxy resin adhesive, the adhesive comprising an epoxy resin component and a curing agent component, wherein the epoxy resin component and the curing agent component are in a separated form, and wherein providing a mixture of t...  
WO/2023/089878A1
[Problem] To provide an epoxy resin composition that has excellent injection properties and thermal conductivity for a cured product and can be used to produce a semiconductor device that has high operation reliability. [Solution] An epo...  
WO/2023/089997A1
Provided are: a curable composition having long fluidity and exceptionally quick curability and having excellent thermal resistance and toughness in a cured product thereof; a cured product comprising said curable composition; a fiber re...  
WO/2023/090347A1
A purpose of the present invention is to provide a curable resin composition having excellent heat resistance, thermal conductivity, and adhesiveness, and low linear expansion. Another purpose of the present invention is to provide a cur...  
WO/2023/089863A1
[Problem] To provide a low-viscosity electroconductive adhesive that can be suitably used in a jet dispenser, can maintain a constant discharge shape and a constant discharge rate, can be discharged continuously due to being unlikely to ...  
WO/2023/089521A1
The subject matter of the invention is a coating composition comprising: a. a modified resin composition comprising an epoxy resin, a modifier and a curing agent, in an amount of from 53 to 69 wt% based on the total weight of the composi...  
WO/2023/086555A2
An adhesive composition comprising a first part comprising an epoxy resin and a second part comprising a multifunctional amine package. The multifunctional amine package comprises bis(hexamethylene)triamine and a synergist. The amine con...  
WO/2023/086039A1
The present invention relates to a thermal latent curing agent comprising one or more polyoxazoline based polymers and one or more curing agents, wherein the curing agents are: (i) physically entrapped in a matrix of the polyoxazoline ba...  
WO/2023/085357A1
The present invention provides a thermosetting resin composition used to form a seal member (65) in a stator (4) having: a stator core (41) that has a plurality of teeth (7) and a plurality of slots (8) formed in an alternating manner in...  
WO/2023/085295A1
A composition for forming a resist underlayer film for use in EB or EUV lithography, the composition containing a film-forming component and a solvent, the film-forming component containing at least 20 mass% of a specific structure-conta...  
WO/2023/083782A1
The present invention relates to compositions comprising: A) 75-95 wt.% of at least one epoxide compound; B) 3-22 wt.% of a curing-agent composition consisting of B1) at least one compound having at least two hydrogen atoms which are rea...  
WO/2023/086337A1
A shellac-substitute is described herein in the form of an acid-functional polymer or an acid-functional polyester polymer. The acid-functional polyester polymer, among other uses, is suitable for stain-blocking with coating compositions...  
WO/2023/082322A1
A curable resin composition, and a composite material and a preparation method therefor. A curing reaction of the curable resin composition is not only a reaction of a curing agent and an epoxy functional group, but also a composite reac...  

Matches 301 - 350 out of 47,191