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Matches 1 - 50 out of 64,369

Document Document Title
WO/2021/200511A1
A compound represented by formula (1). (In the formula, R1 and R3 each independently represent a hydrogen atom or a methyl group, R2 represents a C1-10 alkyl group, a C1-10 alkoxy group, a halogen atom, a benzoyl group capable of having ...  
WO/2021/197842A1
The present invention relates to an aqueous coating composition, preferably an aqueous sanding surfacer or primer-surfacer, containing an aqueous epoxy resin dispersion (A), an aqueous amine-functional resin dispersion (B) and an aromati...  
WO/2021/201046A1
The present invention provides: a polyhydric hydroxy resin which enables the achievement of a cured product that is excellent in terms of heat resistance, low thermal expansion properties, moisture resistance and the like, and which is u...  
WO/2021/196510A1
The present invention provides a high thermal conductivity electrical insulation packaging material and a preparation method therefor. Specifically, the packaging material provided by the present invention is a mixture composed of an imi...  
WO/2021/198829A1
A filament article containing a curable composition is provided. The filament article has a first part containing an epoxy resin and a second part containing a polyamine having at least two secondary or primary amino groups. The first pa...  
WO/2021/200755A1
The present invention provides an aqueous dispersion enabling production of a film that has improved water resistance, tensile elasticity, and breaking point stress, and that exhibits suppressed reduction in breaking point distortion. Th...  
WO/2021/200028A1
A prepreg in which reinforcing fibers are impregnated with an epoxy resin composition containing an epoxy resin (A) and an epoxy resin curing agent (B) that includes a reaction product (X) of the following component (x1) and component (x...  
WO/2021/200757A1
Provided is a sheet adhesive for optical use which contains an (A) component and a (B) component, said sheet adhesive for optical use giving a cured product that exhibits a storage sheer modulus (G'0) of 2×107 Pa or less at 0°C. The sh...  
WO/2021/201060A1
[Problem] The purpose of the present invention is to provide an epoxy amine adduct which has favorable properties, a curing catalyst, a resin composition, a sealing material, an adhesive and a cured article. [Solution] The present invent...  
WO/2021/200220A1
The present invention addresses the problem of providing: a sealing agent for the one-drop fill method with which a sealing member having good adhesion strength with a substrate can be formed even when exposed to a high-temperature, high...  
WO/2021/200357A1
Disclosed is a resin composition which is for forming a partition wall on a substrate of a display device, has excellent weather resistance, and is relatively inexpensive, and with which a partition wall having both high reflectivity for...  
WO/2021/200758A1
Provided is a photocurable sheet adhesive that contains an (A) component, a (B) component, and a (C) component, wherein at least one epoxy resin constituting the (B) component gives a cured product that has a glass transition temperature...  
WO/2021/199450A1
[Problem] The purpose of the present invention is to provide: a curing catalyst that has good characteristics; a resin composition; a sealing material; an adhesive; and a cured product. [Solution] The present invention produces a curing ...  
WO/2021/200984A1
A composition for dip molding containing at least a carboxyl-group-containing nitrile rubber elastomer, an epoxy crosslinking agent that contains an epoxy compound having a parent skeleton that has three or more glycidyl ether groups per...  
WO/2021/201013A1
This sealant includes: a polymerizable compound; a polymerization initiator; and an inorganic filler, the polymerizable compound containing a compound with the specific gravity of 1.3-4.0.  
WO/2021/200812A1
Provided is a resin composition which is for an adhesive, has favorable adhesiveness to glass, is useful as a component of an adhesive having a favorable appearance after adhesion, and contains a polyhydroxyurethane resin. This polyhydro...  
WO/2021/200032A1
Polishing of a cured product is facilitated, and the surface of the cured product is planarized. A curable resin composition, the curable resin composition being characterized in that the 30-second viscosity obtained by measuring the cur...  
WO/2021/192822A1
Provided are a resin composition for semiconductor encapsulation with a sufficiently reduced specific permittivity, and a semiconductor device resin-sealed using the resin composition for semiconductor encapsulation. This resin compositi...  
WO/2021/191237A1
The present invention relates to compositions (self-thermally) curable on demand under the triggering action of UV-visible to near-infrared irradiation of moderate intensity, method of using same for accelerated photopolyaddition of cycl...  
WO/2021/192559A1
[Problem] To provide an epoxy resin composition attaining excellent flexibility and having low curing shrinkage. [Solution] The epoxy resin composition comprises the following (A) to (E) components. Component (A): a compound having two o...  
WO/2021/193173A1
The present invention provides: a composition for hard coat layer formation use, comprising a polyorganosilsesquioxane which contains a constituent unit having a group including an epoxy group in an amount of 50 mol% or more and has a we...  
WO/2021/193819A1
[Problem] To provide: a stereoisomer of an epoxy compound, the stereoisomer, when contained in a curable composition, enabling the composition to give cured objects having improved heat resistance and dielectric properties; a curable com...  
WO/2021/194381A1
The invention relates to a method for producing a fine crystalline form of calcium cis-2,3-epoxysuccinate which can be used as a seed crystal for producing a crystalline form of calcium cis-2,3-epoxysuccinate and a feedstock for producin...  
WO/2021/191282A1
The present invention relates to a resin composition, comprising (a) an epoxy resin; (b) a curing agent comprising the structure of formula C1; (c) an inorganic filler; wherein RC1 is (a) a siloxane group of formula C1a or (b) or both a ...  
WO/2021/193878A1
This novolac resin has a partial structure represented by -C(CF3)H-. This photosensitive resin composition contains the novolac resin and a photosensitizer. This epoxy resin has a partial structure represented by -C(CF3)H-. This curable ...  
WO/2021/193437A1
A purpose of the present invention is to provide a curable resin composition having excellent adhesive properties, long term heat resistance, and reflow resistance. Another purpose of the present invention is to provide an adhesive agent...  
WO/2021/193028A1
The present disclosure provides a resin composition for molding, said resin composition easily increasing the thermal conductivity of a cured product thereof and suppressing thermal expansion, while preventing the cured product from havi...  
WO/2021/193303A1
An epoxy resin represented by formula (1), wherein, with respect to the sum of all the epoxy compounds in the epoxy resin which are represented by the formula where n is 1, the total content of the epoxy compound represented by formula (...  
WO/2021/193273A1
Provided are a phosphorus-containing phenoxy resin having excellent fire-resistance and solubility, a resin composition containing said phosphorus-containing phenoxy resin and a curing agent, a cured product thereof having excellent heat...  
WO/2021/193635A1
The present invention addresses the problem of providing an epoxy resin having exceptional storage stability and curability when a low-activity catalyst is used and at low temperature, and also having exceptional corrosion resistance and...  
WO/2021/190970A1
The present invention relates to a one-component thermosetting epoxy resin composition, comprising at least one epoxy resin A having on average more than one epoxide group per molecule, at least one latent hardener B for epoxy resins, at...  
WO/2021/193478A1
The present invention is provided with a composition for hard coating layer formation, a hard coating film including a hard coating layer formed of the composition for hard coating layer formation, an article and an image display device ...  
WO/2021/193952A1
This compound has a chain structure in which an aromatic ring group, an ether oxygen, a methylene group, an aromatic ring group, a methylene group, an ether oxygen, and an aromatic ring group are bonded in the listed order. To a carbon o...  
WO/2021/193166A1
The purpose of the present invention is to provide an epoxy resin composition for casting, which can yield a cured product having excellent resistance to thermal shock and which exhibits excellent impregnation properties in a coil or the...  
WO/2021/193233A1
The purpose of the present invention is to provide a curable resin composition with suppressed curing shrinkage. The present invention is a curable resin composition containing (A) an epoxy resin, (B) a latent curing agent, and (C) a c...  
WO/2021/187117A1
Provided is a resin composition for flux, the composition having good preservation stability and producing a cured product that has a high glass transition point. The resin composition for flux includes: an epoxy resin (A); an imidazole ...  
WO/2021/187180A1
The present invention provides: a phenoxy resin which exhibits excellent heat resistance, dielectric characteristics and folding resistance; a resin composition which contains this phenoxy resin and a curing agent; a cured product of thi...  
WO/2021/187235A1
An epoxy resin composition (A) containing an epoxy resin represented by formula (1) and an epoxy resin represented by formula (2). An epoxy resin composition (B) containing 0.01-1000 weight parts of a curing agent per 100 weight parts of...  
WO/2021/152460A3
The present disclosure relates to delivery and release compositions, systems, and methods of use thereof. In particular, the present disclosure relates to degradable polymeric systems including a first epoxy-containing monomer and a seco...  
WO/2021/185607A1
The invention relates to a curing composition on the basis of diaminomethylcyclohexane and 1,3-cyclo-hexane-bis(methylamine) for an epoxy resin compound for chemically fixing construction elements, toan epoxy resin compound and a multico...  
WO/2021/187240A1
The present disclosure provides a resin composition for sealing, which can be used to produce a sealing material, readily increases adhesion between a sealing material and nickel, and is unlikely to suffer from adverse effects caused the...  
WO/2021/182295A1
Provided is a curable epoxy composition which can form a cured product having improved heat resistance, by using an alicyclic epoxy compound. The curable epoxy composition includes: an alicyclic epoxy compound (A) having an alicyclic s...  
WO/2021/182207A1
Provided is a resin material that can effectively remove smears using de-smear treatment, reduce the dielectric loss tangent of a cured product, and increase the thermal dimensional stability of a cured product. The resin material acco...  
WO/2021/180553A1
The invention relates to a comb polymer having repeating units of at least one of the structures of formulae (I) to (IV) wherein R1 represents a polyoxyalkylene group and A represents an organic group, and wherein the comb polymer has en...  
WO/2021/180819A1
Curable polymeric compositions with improved barrier property to oxygen suitable to be used on flexible substrates containing a bisphenol F epoxy resin, at least an epoxy acrylate component and at least a rubber modified bisphenol and fu...  
WO/2021/181958A1
Provided is a (meth)acrylate resin which can be used for forming an ultrafine wiring pattern as a result of having a low viscosity and low polarity. Specifically, the present invention is a (meth)acrylate resin obtained by reacting an un...  
WO/2021/177316A1
A purpose of the present invention is to provide a curable resin composition which exhibits excellent visible light curability and adhesiveness, while having excellently low liquid crystal contamination possibility if used in a sealing a...  
WO/2021/178739A1
Aspects of the present disclosure relate to Schiff base oligomers and uses thereof. In at least one aspect, an oligomer is represented by Formula (I) wherein each instance of R4, R5, R6, R7, R8, R10, R11, R12, R13, and R14 is independent...  
WO/2021/177233A1
Provided are: an active ester from which a cured product exhibiting excellent flexibility and low dielectric characteristics can be obtained; a curable resin composition containing said active ester; a cured product obtained by using sai...  
WO/2021/174803A1
The present invention relates to an epoxy resin cured product, a composite material, and preparation methods. The epoxy resin cured product is prepared from raw materials comprising epoxy resin and a curing agent. Epoxy resin has a chemi...  

Matches 1 - 50 out of 64,369