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WO/2023/127523A1 |
The present invention provides a resin composition which has substrate processing adequacy including embeddability into substrate relief patterns, heat cycle resistance and plating solution resistance, and which enables the achievement o...
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WO/2023/117494A1 |
This invention deals with polypropylene imine polymers (PPI) and their derivatives bearing side chains originating from polycondensation or polyaddition reactions using alkylene oxides, and lactones and/or hydroxy carbon acids, their man...
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WO/2023/120304A1 |
This semiconductor resin material comprises a polyimide resin (A) containing repeating structural units derived from an aromatic tetracarboxylic acid component and an aliphatic diamine component.
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WO/2023/120234A1 |
Provided is a polymeric compound represented by formula (1) (in formula (1), R1, R2, R3 and R4 each independently represent a methyl group, an ethyl group, an isopropyl group, or a tertiary butyl group; X's each independently represent a...
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WO/2023/119128A1 |
A thermoplastic composition including 40 to 70 weight percent of a polycarbonate; 15 to 50 weight percent of a polycarbonate-polysiloxane copolymer; 4 to 8 weight percent of a polyetherimide-polysiloxane copolymer; 1 to 8 weight percent ...
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WO/2023/120549A1 |
The present invention addresses the problem of providing a porous polyimide film which can be suitably used as an electrical insulating film, a frequency-selective film, or the like in a flexible substrate (FPC) or the like. In a method ...
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WO/2023/120037A1 |
The present invention provides: a joined body production method that makes it possible to obtain a joined body having a high maximum separation resisting force between two substrates when the two substrates are joined; a joined body obta...
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WO/2023/120627A1 |
The purpose of the present invention is to provide: a curable resin composition in which film cracking does not readily occur at high temperatures in a nitrogen atmosphere even with a thick film; a cured film in which the curable resin c...
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WO/2023/120862A1 |
The present invention relates to a polyimide-based resin film, a substrate that is for a display device and uses the resin film, and an optical device, wherein the polyimide-based resin film has a thermal hysteresis gap of 100 μm to 500...
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WO/2023/120303A1 |
A light-emitting molded body including a polyimide resin (A) that includes repeating structural units represented by formula (1) and repeating structural units represented by formula (2) (R1 is a C6-22 divalent group including at least o...
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WO/2023/109704A1 |
Disclosed are an antibody synthetic bacterium-nano stimulator hybrid novel targeted drug delivery system, and an application thereof in the field of anti-tumor immunotherapy, and particularly disclosed are a pH response copolymer, a nano...
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WO/2023/110751A1 |
The present invention pertains to the use of a polyimide aerogel, wherein the polyimide aerogel comprises polyimide spheres having a diameter of 250 nm to 20 µm, as an insulating, sorption or filter material, as well as to methods for t...
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WO/2023/111782A1 |
The present disclosure relates to a curable precursor of an adhesive composition, the curable precursor comprising a maleimide-terminated polyamide-imide polymer. The present disclosure further relates to an adhesive composition comprisi...
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WO/2023/112849A1 |
The purpose of the present invention is to provide: a resin material that has a novel structure and can be suitably used in a printed wiring board; and a resin composition that contains the resin material, has excellent coatability onto ...
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WO/2023/112764A1 |
As a release layer-forming composition for forming a release layer which can be released without causing damage to a resin substrate of a flexible electronic device, provided is a release layer-forming composition that contains an organi...
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WO/2023/112443A1 |
A heat-curable composition comprising: a polyimide resin (A) which has a repeating unit of general formula (1), has a phenolic hydroxyl group, and has a storage modulus G' of 1.0×107 Pa at a temperature of 0-90°C, at least some of the ...
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WO/2023/112948A1 |
Compatibilizers are disclosed that enable the formation of stable alloys of fluoropolymers with cyclic olefin copolymers (COC). The alloys are useful for many purposes, such as high frequency electronics. Methods of making the compatibil...
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WO/2023/114158A1 |
Polyol compositions that contain imide groups are prepared by producing imide compounds from trimellitic anhydride and an aromatic aminoacid or an aromatic diamine, then esterifying the imide compounds with one or more polyols that have ...
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WO/2023/110819A1 |
The present invention relates to novel compositions comprising cyanate ester resins and substituted bisimides (citraconimides, bisitaconimide, citraconimido-itaconimide, bisnadicimide, bistetrahydroimide and mixtures thereof) as defined ...
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WO/2023/105969A1 |
The present invention provides: a polyimide resin composition which comprises a polyimide resin (A) that contains a repeating constituent unit represented by formula (1) and a repeating constituent unit represented by formula (2), with t...
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WO/2023/105487A1 |
A polyimide, comprising 1-100 mol% of repeating units of formula (1), based on 100 mol% of total repeating units of the polyimide, wherein each V is as defined herein; and each R1 is independently a divalent group of formula (3), wherein...
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WO/2023/106369A1 |
Provided are: a polyimide film which, when used as a spacecraft material, exhibits excellent resistance to atomic oxygen derived from oxygen molecules which are a residual atmosphere component, and produces few outgassing components when...
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WO/2023/106104A1 |
The present invention provides a photosensitive resin composition which contains: a polyimide that has a divalent aromatic group having a photopolymerizable group and a divalent aliphatic hydrocarbon group having 10 to 60 carbon atoms; a...
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WO/2023/105480A1 |
A self-branching polyetherimide comprising a first repeating unit derived from polymerization of the aromatic dianhydride and a first diamine, wherein the first diamine comprises a carboxyl-substituted C6-24 aromatic hydrocarbon group; a...
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WO/2023/106843A1 |
The present invention relates to a polyimide powder and a preparation method therefor, and according to the present invention, a diamine monomer and a dianhydride monomer are polymerized using a glass fiber powder, and thus a high-heat-r...
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WO/2023/106108A1 |
A photosensitive resin composition contains the following polyimide (1) or the like and a solvent. Polyimide (1): A polyimide having structural units represented by the following formulas (1-a), (1-b) and (1-c) below. [In formula (1-a)...
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WO/2023/106571A1 |
The present invention relates to: a polyimide-based resin film comprising a polyimide-based resin including a polyimide repeating unit represented by chemical formula 1 and a polyimide repeating unit represented by chemical formula 2; a ...
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WO/2023/106101A1 |
A resin composition comprising at least one resin selected from the group consisting of polyimides, polybenzoxazole, and precursors of these, a compound represented by formula (A), and a solvent. [In formula (A), Ra represents a hydrogen...
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WO/2023/101005A1 |
The present invention relates to a film which comprises a polyimide-based resin having a structural unit derived from an aliphatic diamine and a fluorine atom, wherein the content of an oligomer having a molecular weight of at most 10,00...
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WO/2023/099425A1 |
The present invention relates to a new class of dielectric polymer material, which is particularly suitable for the manufacturing of electronic devices. The dielectric polymer material is formed by reacting bismaleimide compounds and sho...
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WO/2023/101006A1 |
The present invention pertains to a method for producing a polyimide-based resin, the method comprising a step for reacting a 4,4'-(hexafluoroisopropylidene)diphthalic dianhydride (6FDA) raw material with an aliphatic diamine, wherein th...
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WO/2023/102360A1 |
A coating composition comprising: (a) a polyurethane imide (PUI) resin, and (b) optionally a crosslinking material; wherein the coating composition is substantially free of pyrrolidone solvents. The invention extends to a package coated ...
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WO/2023/100951A1 |
Provided is a polyimide film comprising a polyimide obtained by reacting a tetracarboxylic acid ingredient with a diamine ingredient including 4,4"-diamino-p-terphenyl, the polyimide film having a glass transition temperature higher than...
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WO/2023/102361A1 |
A package coating on at least a portion thereof with a coating, the coating being derived from a coating composition, the coating composition comprising: a) a polyamide imide (PAI) resin, and b) a crosslinking agent comprising an isocyan...
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WO/2023/101433A1 |
The present invention relates to a polyimide powder and a manufacturing method therefor. Being polymerized from diamine monomers and dianhydride monomers using graphene, the polyimide powder according to the present invention exhibits el...
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WO/2023/101329A1 |
The present disclosure relates to a polyamic acid composition comprising: a polyamic acid comprising, as a polymerization unit, at least one selected from a dianhydride monomer represented by Chemical Formula 1 and a diamine monomer repr...
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WO/2023/100986A1 |
The present invention provides a carbon dioxide adsorbent which has excellent carbon dioxide adsorption ability and excellent carbon dioxide desorption ability. The present invention provides a carbon dioxide adsorbent that contains a po...
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WO/2023/102024A1 |
Provided herein are compounds, such as compounds of Formulae (I) and (III), and compositions, methods, uses, and kits thereof. The compounds provided herein are poly(β- amino esters) useful for delivery of agents, such as vitamins and m...
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WO/2023/098424A1 |
The present application provides a polyimide resin, which is prepared by first complexing an aromatic diamine with crown ether and then copolymerizing same with an alicyclic dianhydride and an aromatic dianhydride, wherein the aromatic d...
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WO/2023/096348A1 |
The present invention provides a multilayer polyimide film and a method for manufacturing same, the multilayer polyimide film comprising at least one skin layer, which is formed on at least one outer surface of a core layer, and having a...
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WO/2023/094840A1 |
Disclosed is a method of treating a polyimide, comprising: providing a polyimide to be treated; and contacting the polyimide to be treated with a fluid to obtain a treated polyimide; wherein the polyimide comprises a first repeat unit de...
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WO/2023/096440A1 |
The present invention provides a multilayer polyimide film and a manufacturing method therefor, wherein the multilayer polyimide film comprises a first skin layer and a second skin layer that are disposed on one outer surface and an oppo...
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WO/2023/096467A1 |
The present invention relates to a perovskite solar cell comprising a polymer compound having triarylamine as a repeating unit and a method for preparing the polymer compound. The perovskite solar cell according to the present invention ...
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WO/2023/095613A1 |
The purpose of the present invention is to provide: a cyclic organosiloxane which contains an imide bond and a polymerizable unsaturated bond, and which provides a cured product having excellent hardness and bending resistance; and a cur...
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WO/2023/096344A1 |
The present invention provides low-dielectric polyamic acid and a polyimide film, the low-dielectric polyamic acid comprising: a dianhydride acid component including two or more selected from the group consisting of biphenyltetracarboxyl...
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WO/2023/096340A1 |
The present invention provides a multi-layered polyimide film comprising at least one skin layer formed on at least one outer surface of a core layer, wherein the multi-layered polyimide film has a dielectric loss factor of 0.003 or less...
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WO/2023/094632A1 |
Aqueous based compositions having high solids content and stable viscosity over time containing polyamideimide polymers of high acid number and methylethanolamine.
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WO/2023/090969A1 |
The present invention provides a polyimide film comprising a block copolymer, the block copolymer comprising: a first block obtained by imidizing polyamic acid derived from a polymer consisting of a dianhydrous acid component including b...
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WO/2023/090348A1 |
The purpose of the present invention is to provide: a resin material that has a novel structure and that can be suitably used in a printed wiring board; and a resin composition which contains this resin material and which yields a cured ...
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WO/2023/090968A1 |
The present invention provides a polyamic acid, polyimide film and a flexible metal clad laminate using same, the polyamic acid comprising the following components copolymerized: an acid dianhydride component comprising biphenyl-tetracar...
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