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WO/2023/056425A1 |
Methods of printing dental aligners with three-dimensional (3D) printing equipment and software include providing a thermoplastic material in powder form and forming the dental aligner from the powder form of the thermoplastic material, ...
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WO/2023/054221A1 |
Provided are a polyimide including a repeating unit represented by formula (1-1), a polyimide precursor for obtaining the polyimide, a composition including the polyimide, and a production method for the polyimide. In formula (1-1), RA1 ...
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WO/2023/052254A1 |
The present invention provides a copper electroplating composition comprising copper ions, an acid, and at least one polyaminoamide comprising a group of formula L1[B-A-B'-Z]n[Y-Z]m (L1)that is obtainable by reacting a diamine compound c...
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WO/2023/055186A1 |
The present invention relates to a polyimide powder and a preparation method therefor. With respect to the polyimide powder and the preparation method therefor, according to the present invention, a preparation process is simplified such...
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WO/2023/047783A1 |
Provided are; a novel resin composition having excellent dielectric properties; a prepreg; a metal foil-clad laminated sheet; a composite resin sheet; a printed wiring board; and a semiconductor device. This resin composition contains: a...
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WO/2023/048063A1 |
Provided is polyimide having a structural unit represented by general formula (1). In general formula (1), R1 is a divalent organic group represented by general formula (2) and R2 is a tetravalent organic group including an alicyclic ske...
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WO/2023/047782A1 |
Provided are: a resin composition having excellent hygroscopicity and heat resistance while maintaining excellent dielectric properties; a prepreg; a metal foil-clad laminate; a resin composite sheet; a printed wiring board; and a semico...
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WO/2023/048121A1 |
Provided are: a precursor composition from which a polyimide film having excellent light transmittance, excellent mechanical properties, an excellent coefficient of linear thermal expansion, and excellent resistance to thermal decomposit...
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WO/2023/048026A1 |
The present invention provides a novel resin composition which has excellent anti-crack properties while maintaining excellent low dielectric loss tangent, a prepreg, a metal-foil-clad laminate, a resin composite sheet, a printed circuit...
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WO/2023/042595A1 |
Provided is a polyimide that is a polycondensate of a monomer (A) formed from a tetracarboxylic dianhydride represented by general formula (1): [in formula (1), R1 each independently represent a hydrogen atom, etc., and R2 each independe...
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WO/2023/042608A1 |
A purpose of the present invention is to provide a polyimide resin which enables a photosensitive resin composition including the polyimide resin to satisfy the following: 1) to leave no residue causative of an obstacle to light emission...
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WO/2023/038426A1 |
The present disclosure relates to a multi-layer structure, a window cover film comprising same, and a use thereof, and a multi-layer structure, according to one embodiment, comprises: a polyimide-based base layer; and a hard coating laye...
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WO/2023/038321A1 |
The present invention relates to a polyamic acid composition, and a polyimide produced therefrom, the polyimide having excellent electrical conductivity while having high transparency.
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WO/2023/037774A1 |
This semiconductor apparatus has a substrate film and a semiconductor film formed on the substrate film, wherein the substrate film comprises a polyimide obtained by condensation polymerization of an aromatic diamine and an aromatic tetr...
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WO/2022/271202A9 |
Amine-substituted copolymers that may include an amine-substituted pyrrolidine-2,5-dione moiety. Polyamic acids and polyimides, which may be formed by contacting an amine substituted copolymer with a dianhydride, or a dianhydride and a d...
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WO/2023/038322A1 |
The present invention relates to a polyamic acid composition and a polyimide including same and exhibits excellent thermal properties such as dimensional stability and heat resistance while retaining high transparency.
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WO/2023/032545A1 |
Provided are: a cured product production method by which a cured product having excellent elongation at break is obtained; a laminate production method including said cured product production method; and a semiconductor device manufactur...
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WO/2023/032491A1 |
A reaction accelerator that is used for a polymerization reaction involving a condensation reaction, the reaction accelerator containing: at least one compound (A) selected from the group consisting of basic compounds having a 5-membered...
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WO/2023/032492A1 |
A reaction accelerator that is used for a polymerization reaction involving a condensation reaction, the reaction accelerator containing: an alicyclic carboxylic acid compound having a cycloalkane structure in the molecular structure, an...
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WO/2023/029341A1 |
The present invention relates to a colorless transparent polyimide resin film and a preparation method therefor, having a molecular structure general formula of (I). The present invention has excellent dimensional stability, low water ab...
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WO/2023/032648A1 |
A poly(amic acid) varnish which comprises a solvent and a poly(amic acid) obtained by reacting a tetracarboxylic acid and a diamine and which, when examined after having been introduced into a cell with an optical path length of 10 mm an...
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WO/2023/032821A1 |
The present invention provides: a resin composition which contains a resin A that is a cyclized resin or a precursor thereof and a resin B that is an addition polymerization type resin having at least one bond that is selected from the g...
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WO/2023/032784A1 |
A liquid crystal alignment agent comprising a polymer component, wherein the polymer component satisfies condition (i) and/or condition (ii). Condition (i): The polymer component contains at least one polymer selected from the group co...
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WO/2023/032475A1 |
A purpose of the present invention is to provide a method for producing a cured product whereby a cured product having excellent breaking elongation, a method for producing a multilayer body including said method for producing a cured pr...
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WO/2023/032820A1 |
Provided are: a resin composition including at least one resin selected from the group consisting of cyclized resins and precursors thereof, and a compound B, which has a ring opening-polymerizable group, also has at least one structure ...
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WO/2023/032923A1 |
The present invention is a composition for forming a film for a semiconductor and an application thereof, said composition including a linear siloxane compound (A) having a specific structure including an amino group selected from a prim...
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WO/2023/032924A1 |
A composition for forming a film for a semiconductor, the composition comprising: an aliphatic diamine (A) which includes a main chain containing carbon atoms, and a primary amino group and a secondary amino group, and in which the total...
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WO/2023/032998A1 |
This spin-on-carbon film-forming composition comprises a dendritic polymer and is a composition for forming a spin-on-carbon film that functions as a lithographic underlayer film.
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WO/2023/027031A1 |
The present invention addresses the problem of providing a polyimide material that has superior heat resistance as well as superior optical characteristics and dielectric characteristics, while having a resource of biological origin used...
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WO/2023/025775A1 |
Soluble liquid crystalline polyesters (LCPs) exhibiting low dielectric constant and dissipation factors, articles containing the said LCPs, such articles being suitable for mobile electronic device components, for example films or struct...
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WO/2023/025720A1 |
Compositions based on low toxicity solvents, in particular coating formulations, having reduced viscosity are disclosed. The compositions contain polyamideimide polymers having well-defined molecular weight distribution.
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WO/2023/026982A1 |
This resin composition contains a polyimide and an acrylic resin. The polyimide contains, as a tetracarboxylic dianhydride component, an alicyclic tetracarboxylic dianhydride such as 1,2,3,4-cyclobutane tetracarboxylic dianhydride, and c...
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WO/2023/021961A1 |
This polyimide precursor resin composition contains polyamic acid, a photosensitizer, and a nitrogen-free ester compound. The polyimide resin is formed from the polyimide precursor composition. The circuit substrate comprises a metal bas...
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WO/2023/021104A1 |
The present invention relates to novel modified alkoxylated polyalkylene imines or modified alkoxylated polyamines obtainable by a process comprising the steps a) to d). According to step a), a polyalkylene imine or a polyamine as such i...
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WO/2023/022472A1 |
The present invention pertains to a photosensitive resin composition and a display device including same. More specifically, the present invention pertains to: a photosensitive resin composition containing an alkali-soluble polymer resin...
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WO/2023/021101A1 |
The present invention relates to novel modified alkoxylated polyalkylene imines obtainable by a process comprising the steps a) to b). According to step a), a polyalkylene imine comprising at least one tertiary amino moiety bearing a C1-...
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WO/2023/021105A1 |
The present invention relates to novel modified alkoxylated polyalkylene imines or modified alkoxylated polyamines obtainable by a process comprising the steps a) to c). According to step a), a polyalkylene imine or a polyamine as such i...
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WO/2023/022123A1 |
The present invention provides: a fluorine-containing polyamide compound which has specific repeating units; and a fluorine-containing polybenzoxazole which has specific repeating units.
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WO/2023/021987A1 |
It was found that a polybenzoxazole powder having excellent dispersibility while retaining excellent properties inherent in polybenzoxazole resins could be obtained by subjecting polybenzoxazole to a pretreatment represented by a heat tr...
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WO/2023/021103A1 |
The present invention relates to novel modified alkoxylated oligoalkylene imines and modified alkoxylated oligoamines obtainable by a process comprising the steps a) to b). According to step a), an oligoalkylene imine with a weight avera...
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WO/2023/022155A1 |
The present invention provides a polymer-dispersed liquid crystal element which is provided with a liquid crystal alignment film that achieves high adhesion between a polymer liquid crystal layer and a base material, while having a high ...
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WO/2023/022750A1 |
Compositions comprising fused aromatic systems and associated electrodes, electrochemical cells, and charge storage devices are generally described. Preferably, the aromatic comprising a bis-tetraamino-benzoquinone molecule and/or a taut...
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WO/2023/018606A1 |
A composition comprising 5-30 weight percent of a polyimide and a solvent having boiling point of less than 150°C, and optionally further comprising a pigment, where the polyimide is soluble in the solvent and is the dehydrated reaction...
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WO/2023/018609A1 |
A method comprises providing a substrate, coating onto the substrate a composition comprising 3-30 weight percent based on total weight of the composition of a polyimide; a solvent comprising cyclopentanone in an amount of at least 70, p...
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WO/2023/014050A1 |
The present invention relates to a method for efficiently recovering dimethylformamide at high purity from a waste solution resulting from the production of a polyimide. The method according to the present invention is directed to a meth...
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WO/2023/013401A1 |
A polyamic acid composition according to the present disclosure contains a polyamic acid. A tetracarboxylic acid dianhydride constituting the polyamic acid contains a compound represented by formula (a1) and a compound represented by for...
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WO/2023/013224A1 |
The present invention addresses the problem of providing: a resin material which has a novel structure and can be suitably used in a printed wiring board; and a resin composition comprising this resin material, a cured product of which h...
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WO/2023/013622A1 |
Provided are a liquid crystal alignment agent and the like, said liquid crystal alignment agent being one that forms a liquid crystal alignment film having high light transmittance and a high voltage holding ratio. This liquid crystal ...
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WO/2023/011580A1 |
Disclosed are an ultra-high-modulus, high-light transmittance polyimide film and a preparation method and use thereof. The ultra-high-modulus, high-light transmittance polyimide film is prepared by mixing and dissolving a mixture of poly...
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WO/2023/010800A1 |
Disclosed in the present a remodelable and degradable biomass benzoxazine resin and a preparation method therefor. Biomass decanediamine and isoeugenol are used as raw materials, and an all-biomass benzoxazine monomer is synthesized by m...
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