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Matches 401 - 450 out of 25,620

Document Document Title
WO/2022/239746A1
This bisiminoacenaphthene crosslinked polymer including a bisiminoacenaphthene crosslinked polymer in which a repeating unit represented by formula (I) (X- represents a monovalent anion, Y represents a linking group, and Z represents a...  
WO/2022/237827A1
The present invention relates to the technical field of polymer materials, and in particular to an aromatic polyoxadiazole, and an aromatic polyoxadiazole film and a preparation method therefor. The aromatic polyoxadiazole comprises a re...  
WO/2022/239534A1
[Abstract] [Problem] The purpose of the present invention is to provide novel meta-ester aromatic diamines, a method for producing the same, and polyimide synthesis. [Solution] Provided are compounds represented by formula (1). In formul...  
WO/2022/234904A1
The present invention relates to a cross-linked copolymer, a gas separation membrane comprising same, a method for preparing the cross-linked copolymer, and a method for manufacturing the gas separation membrane, and, more specifically, ...  
WO/2022/234820A1
Provided is a liquid crystal alignment agent whereby a liquid crystal display element having a low incidence of display defects (line burn-in) is obtained even when negative-type liquid crystal is used as the liquid crystal material. T...  
WO/2022/076286A9
The present disclosure provides compositions, articles thereof, and methods of forming compositions. In at least one aspect, a composition includes (1) an epoxy, (2) an amino or amido hardener, (3) a polyaniline, (4) a dopant selected fr...  
WO/2022/233905A1
The present invention pertains to a two-phase composite comprising an inorganic mesoporous material embedded in a polyimide aerogel matrix, wherein particles of the inorganic mesoporous material in the composite have a diameter larger th...  
WO/2022/228449A1
The present disclosure relates to the field of polyimide, and in particular to a preparation method for a polyimide resin and a thin film thereof. The method comprises the following steps: S1, upon dissolving a first batch of polydiamine...  
WO/2022/230546A1
Provided is a porous polyimide film having an excellent gas permeation rate. The porous film is constituted from a porous material comprising either a polyimide resin or a polyimide resin composition including a polyimide resin and has...  
WO/2022/230821A1
The present invention relates to a method for manufacturing an organic semiconductor element, the method comprising a step for applying and heating a first composition to provide a first functional film, and a step for applying a second ...  
WO/2022/223295A1
The invention relates to asymmetrical methylene bisimides having the formula (I), a method for their preparation and their use for the preparation of resins.  
WO/2022/225003A1
A film-forming composition characterized by comprising a triazine ring-containing polymer, which contains a repeating unit structure represented by formula (1) and has at least one terminal triazine ring, a crosslinking agent, inorganic ...  
WO/2022/225012A1
A film-forming composition that comprises a triazine ring-containing polymer, which contains a repeating unit structure represented by formula (1) and has at least one terminal triazine ring and in which at least a part of the terminal t...  
WO/2022/225381A1
The present application relates to a polyamic acid composition, a binder resin composition for an electrode, an electrode active material composition comprising the binder resin composition, and an electrode comprising same, and provides...  
WO/2022/224899A1
A low-dielectric substrate material (1) comprises a metal layer (2) and a porous resin layer (3) disposed on one surface, along the thickness direction, of the metal layer (2). The porous resin layer (3) can be equally divided in the thi...  
WO/2022/225005A1
A solvent-free composition containing no organic solvent and comprising: a triazine-ring-containing polymer which includes a repeating unit structure represented by formula (1) and has at least one triazine ring terminal, at least some o...  
WO/2022/224486A1
Provided is an insulated wire comprising a conductor and an insulating layer covering the conductor, wherein the insulating layer includes a first resin, the first resin is a polyimide, the glass transition temperature of the polyimide i...  
WO/2022/225002A1
A triazine ring-containing polymer that contains a repeating unit structure represented by formula (1). [In the formula: R and R' independently represent a hydrogen atom, an alkyl group, an alkoxy group, an aryl group or an aralkyl group...  
WO/2022/225017A1
The present invention provides a solventless composition characterized by comprising: a triazine-ring-containing polymer having a repeating unit structure represented by formula (1), having at least one triazine ring terminal, at least a...  
WO/2022/224838A1
Provided are: a resin composition that yields a cured product having exceptional elongation at break; a cured product obtained by curing the resin composition; a laminate containing the cured product; a method for producing the cured pro...  
WO/2022/225014A1
A composition for pattern formation which comprises: a triazine-ring-containing polymer that includes a repeating unit structure represented by formula (1) and has at least one triazine ring terminal, at least some of the triazine ring t...  
WO/2022/225001A1
The present invention provides a triazine-ring-containing polymer characterized by comprising a repeating unit structure represented by formula (1), said triazine-ring-containing polymer having at least one triazine ring terminal, wherei...  
WO/2022/225015A1
Provided is a triazine ring-containing polymer characterized by containing a repeating unit structure represented by formula (1) and having at least one triazine ring terminal, and in that at least a portion of the triazine ring terminal...  
WO/2022/225020A1
A triazine ring-containing polymer characterized by containing a repeating unit structure represented by formula (1) and having at least one terminal triazine ring wherein at least a part of the terminal triazine ring is blocked with an ...  
WO/2022/220286A1
The present invention provides: an imide-amic acid copolymer which is a precursor of a polyimide resin and enables a film to be obtained, said film having a low linear expansion coefficient, excellent thermostability, and undergoing mini...  
WO/2022/220484A1
The present invention relates to a molded article for a semiconductor device test socket comprising a polyimide resin and a method for manufacturing same, characterized in that excellent mechanical properties, surface resistance stabilit...  
WO/2022/220253A1
The purpose of the present invention is to provide a curable resin composition that has excellent heat resistance, thermal conductivity, and adhesiveness. Another purpose of the present invention is to provide a cured product of said cur...  
WO/2022/221577A1
Polyimide binders and their polyamic precursors to be used for forming electrode structures are provided. The designed polyamic binder precursors are water-soluble, and the resulting polyimide binders are mechanically strong, electrochem...  
WO/2022/221026A1
The invention provides novel compounds and polymers with pendant aspirin, and degradable and biocompatible compositions, medical devices and implants, and methods of making and use thereof.  
WO/2022/220199A1
Provided are: a liquid crystal aligning agent which forms a liquid crystal alignment film that exhibits a high voltage retention ratio, suppresses the occurrence of after-images, and exhibits low liquid crystal pretilt angle characterist...  
WO/2022/220007A1
The present invention provides: a thermoplastic polyimide resin composition comprising 30-60 mass% of a thermoplastic polyimide resin (A), 5-50 mass% of carbon fibers (B), 5-20 mass% of a fluororesin (C), and 1-40 mass% of an inorganic f...  
WO/2022/215406A1
Provided is a bisimide phenol compound represented by general formula (1). (In general formula (1), R1 and R2 independently represent a hydrogen atom, a hydroxyl group, or a C1-10 organic group, at least two among R1 and R2 are hydroxyl ...  
WO/2022/210433A1
A maleimide resin mixture including a maleimide resin (A) represented by formula (1) and a maleimide resin (B) obtained by reacting a diamine (b) with maleic anhydride. (In formula (1), the multiple R each independently represent a hydro...  
WO/2022/210095A1
One embodiment of the present invention relates to a polymer, a composition, a cured product, a multilayer body or an electronic component; and the polymer has a repeating structural unit that is represented by formula (1), while having ...  
WO/2022/210825A1
A polyaniline composite body which is obtained by doping a substituted or unsubstituted polyaniline with a dopant, wherein: the weight average molecular weight Mw is not less than 20,000 but less than 39,000 and the molecular weight dist...  
WO/2022/210442A1
A curable resin composition comprising a maleimide resin (A) having a cyclic imide bond and obtained by reacting a diamine (a-1) derived from a dimer acid, a tetracarboxylic dianhydride (a-2), and maleic anhydride, a maleimide resin (B) ...  
WO/2022/210324A1
Provided are: a resin composition including a precursor of a cyclized resin and a base generator, wherein the base generated by the base generator is a base that cyclizes within the same molecule and becomes a tertiary amine, and the bas...  
WO/2022/210321A1
This poly(amic acid) composition contains a poly(amic acid). Aromatic monomers account for 95 mol% or more of all monomers that constitute the poly(amic acid). The aromatic monomers include 40-95 mol% of a monomer (A) having a prescribed...  
WO/2022/207439A1
The invention is directed to a solution comprising from 0.05 to 7.5 parts by weight of a polyhydroxyamide and from 99.95 to 92.55 parts by weight of one or more alcohols, selected from isopropanol, n-propanol, and ethanol, wherein the po...  
WO/2022/210096A1
A radiation-sensitive composition for insulation film formation use, which comprises at least one polyfunctional compound (A) selected from a polyfunctional maleimide compound (A-1) and a polyfunctional styryl compound (A-2), a polymer (...  
WO/2022/210154A1
Provided is a laminate that can be implemented with a wide processing margin and without adhesive residue or damage to a semiconductor element in the transfer of the semiconductor element using laser light of various wavelengths. The lam...  
WO/2022/210945A1
[Problem] To provide a curable resin composition that has good resolution in a resultant dried coating film and exhibits minimal adhesion even if cured products are stacked after heat curing and stored in a high temperature environment. ...  
WO/2022/210274A1
Provided is a tetracarboxylic dianhydride represented by general formula (1): [in formula (1), R1-R5 each independently represent one selected from the group consisting of hydrogen atoms and C1-20 hydrocarbon groups].  
WO/2022/211086A1
Provided is a resin composition comprising: a poly(amic acid)/imide copolymer including a structural unit L represented by formula (1) and having a structure represented by general formula (A-1) as the X2 in general formula (1); an organ...  
WO/2022/210109A1
A polyimide resin composition containing: a polyimide having a repeating unit represented by formula (1); and at least one compound selected from the group consisting of compounds represented by general formulas (2-1), (2-2), (2-3) and (...  
WO/2022/210466A1
Provided are: a resin composition comprising a polyimide precursor containing a repeating unit represented by formula (1); a cured product obtained by curing the resin composition; a laminated body comprising the cured product; a method ...  
WO/2022/210532A1
The present invention pertains to a resin composition containing a polyimide precursor including a structure represented by formula (1-1) and a repeat unit represented by formula (2), a cured product obtained by curing the resin composit...  
WO/2022/207135A1
The invention relates to a two-component aqueous coating composition comprising: A an aqueous resin component comprising a carboxyl-functional resin; and B a substantially water-free hardener component comprising: - a carbodiimide compri...  
WO/2022/210788A1
The present invention provides: a photosensitive resin composition which enables the achievement of a cured product that has excellent limiting resolution and dielectric characteristics; a photosensitive resin composition which enables t...  
WO/2022/202486A1
The present invention addresses the problem of providing: a negative photosensitive resin composition, from which high aspect ratio pattern processability, good storage stability, and curability are obtained; and a cured product having e...  

Matches 401 - 450 out of 25,620