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Patent Searching and Data


Matches 1 - 50 out of 7,507

Document Document Title
WO/2021/193878A1
This novolac resin has a partial structure represented by -C(CF3)H-. This photosensitive resin composition contains the novolac resin and a photosensitizer. This epoxy resin has a partial structure represented by -C(CF3)H-. This curable ...  
WO/2021/186127A1
The present invention relates to an aqueous adhesive composition, comprising a thermosetting resin based on: - at least one aromatic compound A1 comprising at least one aromatic ring bearing at least two functions, one of said functions ...  
WO/2021/187599A1
Provided are: a composition capable of forming a resist underlayer film having excellent heat resistance and flatness; a method for forming a resist underlayer film; and a method for forming a resist pattern. The present invention is a c...  
WO/2021/177780A1
The present invention relates to a method for producing an alkoxylated resol-type phenol resin, and an alkoxylated resol-type phenol resin, wherein the method can produce an alkoxylated resol-type phenol resin from which a coating film h...  
WO/2021/173827A1
Compositions comprising R q SnO m (OH) x (HCO3) y (CO3) z are disclosed, where R is (i) C1-C10 hydrocarbyl or (ii) heteroaliphatic, heteroaryl, or heteroaryl-aliphatic including 1-10 carbon atoms and one or more heteroatoms; q = 0.1-1; x...  
WO/2021/157698A1
A phenol resin foam laminate in which a flexible surface material is arranged on at least the upper and lower surfaces of a phenol resin foam, wherein the phenol resin foam includes HCFO-1224yd (Z) and has a density of 20 kg/m3 to 55 kg/...  
WO/2021/153045A1
A thermosetting binder composition according to an aspect of the present invention contains a nonreducing sugar, a phenol, water, ammonium ions, and anions that are capable of forming a salt with the ammonium ions, and said binder compos...  
WO/2020/257293A9
The embodiments described herein generally relate to methods and chemical compositions of phenolic epoxy systems. In one embodiment, a composition comprising a phenolic epoxy resin system includes an epoxy resin component and an alkoxyla...  
WO/2021/141934A1
A solid phloroglucinolic resin comprises reacting a phloroglucinolic compound and a ketone in the presence of an acid catalyst. The solid phloroglucinolic resin formed includes multiple phloroglucinolic units defined by formula (I), wher...  
WO/2021/131746A1
The present invention is a positive photosensitive resin composition containing: (A) a novolac-type phenol resin having structural units (a1) derived from m-cresol, structural units (a2) derived from benzaldehyde, and structural units (a...  
WO/2021/123534A1
The invention relates to a method for preparing a resol-type phenolic resin, comprising the following steps: a) a step of condensing phenol and formaldehyde in a basic medium, the formaldehyde being in molar excess with respect to the ph...  
WO/2021/121487A1
The invention relates to: a method for the layered construction of bodies comprising refractory moulding base material and resol resins as binders, having, in addition to phenol, ortho- and/or para-substituted phenols as monomer structur...  
WO/2021/118235A1
The present invention relates to a method for preparing a multifunctional novolac resin, a method for preparing an epoxy resin, and a multifunctional novolac resin and epoxy resin prepared thereby. Particularly, the present invention rel...  
WO/2021/089392A1
The present invention relates to A method for the preparation of a rigid polyisocyanate based foam, comprising mixing (a) polyisocyanate, (b) at least one compound having at least two hydrogen atoms reactive towards isocyanates, (c) opti...  
WO/2021/079711A1
The present invention provides: a polyfunctional phenol resin and a polyfunctional epoxy resin, which have a low viscosity and which give cured products having excellent mechanical characteristics and heat resistance; a curable resin com...  
WO/2021/070727A1
Provided is a composition for forming a resist underlayer film that is insoluble in resist solvents, has good optical constants, and allows the etching rate to be adjusted suitably, wherein the composition has an excellent ability to fil...  
WO/2021/065982A1
[Problem] To provide a crosslinked polymer for high-sensitivity lithography. [Solution] This crosslinked polymer for resists, which changes in solubility in developing solutions by the action of an acid, contains phenolic hydroxyl groups...  
WO/2021/033129A1
The invention relates to a curable mixture comprising at least one organic compound having phenolic hydroxyl groups and at least one multifunctional cyclic organic carbonate as crosslinking agent, to a method of curing the said organic c...  
WO/2021/006084A1
A phenolic resin for rubber compositions which has a structure formed by modifying a phenolic resin containing an unsaturated bond with either a tetrazine compound represented by general formula (1) or a salt thereof. [In formula (1), X1...  
WO/2021/006423A1
The present invention relates to a polyurethane foam prepared by controlling, when manufacturing the polyurethane foam, an NCO index in a range of 450-550 and, simultaneously, mixing two types of flame retardants, and can implement excel...  
WO/2021/006085A1
This phenolic resin composition for a rubber composition contains a phenolic resin having an unsaturated bond, and a tetrazine compound represented by general formula (1) or a salt thereof. [In formula (1), X1 and X2 are the same as or d...  
WO/2021/002097A1
To provide a resin composition for manufacturing a phenolic foam, said resin composition enabling the profitable production of a phenolic foam that exerts an excellent heat insulation performance over a medium-to-long term from immediate...  
WO/2021/003363A1
An alkylphenol copolymer, such as for use in a petroleum composition, is provided. The alkylphenol copolymer has at least the following repeating unit (I), wherein: A is a direct bond or an alkylene; X is –C(O)O–, –OC(O)–, –C(O...  
WO/2020/257293A1
The embodiments described herein generally relate to methods and chemical compositions of phenolic epoxy systems. In one embodiment, a composition comprising a phenolic epoxy resin system includes an epoxy resin component and an alkoxyla...  
WO/2020/218600A1
A composition for forming optical components which contains a compound represented by formula (0). (In formula (0), X represents an oxygen or sulfur atom or represents a non-bridged state, the R0 moieties are each independently an option...  
WO/2020/213559A1
[Problem] To provide a highly cost-effective method for producing an activated carbon adsorbent, wherein, in activated carbon derived from a phenolic resin, an activated carbon adsorbent capable of quickly adsorbing nitrogen-containing l...  
WO/2020/213992A1
The present invention provides amorphous fluorene-based epoxy resin and a method for effectively preparing same, wherein the amorphous fluorene-based epoxy resin has improved workability, storage stability, flow, and leveling while secur...  
WO/2020/195496A1
Provided is a composition for forming a heat conducting material, said composition being capable of providing a heat conducting material having excellent heat conduction properties. Also provided is a heat conducting material. The compos...  
WO/2020/186188A1
Described herein are polyoxymethylene (POM) compositions comprising polyoxymethylene and styrene maleic anhydride (SMA) copolymers or modified SMA copolymers, said POM compositions exhibiting improved physical properties such as heat def...  
WO/2020/183336A1
The present relates to organic compound(s) [i.e. compound of formula I] and/or a composition comprising said organic compound(s) useful for utilization of non-coking coal in a blend comprising coking coal without deterioration of propert...  
WO/2020/184642A1
Provided is a composition for forming a resist underlayer film that is insoluble in resist solvents, has favorable optical constants, and has a high etching rate. The composition has excellent ability to fill and flatten stepped substrat...  
WO/2020/169702A1
The present invention relates to a composition comprising; components a) b) and d); wherein, component a) is a metal compound having the structure (I), component b) is a spin on high carbon polymer, having a polymer backbone comprising m...  
WO/2020/162621A1
Provided are: a method for producing a polyphenol derivative, the method having a step for reacting a polyphenol-containing composition and an aromatic compound having an ortho-para aligning group in a solvent; a polyphenol derivative pr...  
WO/2020/158931A1
The purpose of the present invention is to provide: a novel compound which is useful as a film forming material for lithography or as a material for forming an optical component; a resin which contains a constituent unit that is derived ...  
WO/2020/153048A1
The present invention addresses the problem of providing a phenolic hydroxyl group-containing resin having superior heat resistance and, when being used as a resist material, exhibits excellent alkali developing properties. Provided is a...  
WO/2020/137309A1
The purpose of the present invention is to provide a resist composition which exhibits high heat resistance and can be used in types of lithography that use electron beams and extreme ultraviolet radiation. Specifically, the present inve...  
WO/2020/137310A1
The purpose of the present invention is to provide a thermosetting resin composition from which it is possible to obtain a cured product having high heat resistance and high stress relaxation properties. Specifically, this thermosetting ...  
WO/2020/132738A1
The present invention relates to processes of synthesis of resole phenolic resins using lignin, to resole phenolic resins comprising an aldehyde, lignin, a base, urea and, optionally, phenol, and also to the use of said phenolic resins a...  
WO/2020/138147A1
The present invention provides a compound which has a condensed skeleton of an aromatic compound represented by formula (1-1) and an aromatic aldehyde represented by formula (2-1). (In formula (1-1), A represents an aromatic ring; each R...  
WO/2020/121005A1
The present invention relates to an improved phenolic furan resin composition with reduced flammability and to a pre-impregnated fiber-reinforced composite material. The invention also relates to the use of pre-impregnated fiber-reinforc...  
WO/2020/103505A1
The present invention provides a 4-tert-alkylphenol-(morpholinyl)formaldehyde resin, a preparation method therefor and use thereof. The 4-tert-alkylphenol-(morpholinyl)formaldehyde resin is prepared by means of condensation and polyconde...  
WO/2020/085282A1
[Problem] To provide a method for producing a phenolic resin, said phenolic resin being to be used for the formation of an activated carbon adsorbent, whereby the ratio of macropores in pores formed in a resin carbide is increased by imp...  
WO/2020/077882A1
The purpose of the present invention is to provide a binder used for sand casting 3D printing and a preparation method therefor, the binding used for sand casting 3D printing being composed of the following components in part by weight: ...  
WO/2020/070531A1
Provided is a curable resin composition which has excellent reactivity that makes low-temperature curing possible and which has excellent flowability during molding and, upon curing, can give cured objects having excellent heat resistanc...  
WO/2020/069999A1
The invention relates to a composition comprising: a) at least one supramolecular polymer obtained by reacting a first polymer comprising a polyoxyalkylene chain and having two chain ends, each end comprising at least two ionisable acid ...  
WO/2020/071326A1
Provided is a novel fluorescent polymer that can be in the form of fluorescent fine particles or the like. A fluorescent polymer having structural units derived from a first monomer and structural units derived from a crosslinking agent,...  
WO/2020/041954A1
Disclosed is a process for preparing a resorcinol formaldehyde resin with a high adhesive strength. The process comprises preparing a resin by using resorcinol and formaldehyde as raw materials and ethylvinyl benzene as a modifying agent...  
WO/2020/040161A1
Provided is a composition containing a polyphenol compound (B), wherein the polyphenol compound (B) is one or more resins selected from the group consisting of resins having the structure represented by formula (1) and resins having the ...  
WO/2020/040162A1
Provided is a composition containing a polyphenol compound (B), wherein the polyphenol compound (B) is one or more substances selected from the group consisting of compounds having the structure represented by formula (1) and resins havi...  
WO/2020/027206A1
This composition includes a polyphenol compound (B) and a solvent, wherein the polyphenol compound (B) is at least one selected from among a compound represented by formula (1) and a resin having a structure represented by formula (2). (...  

Matches 1 - 50 out of 7,507