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WO/2023/100654A1 |
A composition according to the present invention contains a thermoplastic resin A, a polymer B and a powder C. The polymer B has a constituent unit that is represented by formula (1) or formula (2); the moisture content in the powder C t...
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WO/2023/100655A1 |
The composition includes a thermoplastic resin A, a polymer B, and a powder C including a metal element Q. The polymer B has a structural unit represented by formula (1) or formula (2). The value of the standard electrode potential E at ...
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WO/2023/100809A1 |
A wavelength conversion film forming composition comprising (A) a phosphor represented by formula (1) and (B) a binder is provided as a wavelength conversion film forming composition capable of providing a wavelength conversion film havi...
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WO/2023/100903A1 |
Core/shell type graft copolymer particles comprising core particles (A) and a shell layer (B) covering each core particle (A). The core particles (A) each comprise a polyorganosiloxane rubber particle (a1) and a poly(alkyl (meth)acrylate...
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WO/2023/100258A1 |
Provided is a marine biodegradation promoter that is a hydrophobic powder composed of a compound in which ionic bonds bond a metal cation having a valence of 2 or higher and two or more monovalent organic anions that have different struc...
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WO/2023/100715A1 |
The present invention pertains to a resin composition containing a resin and a compound represented by formula (1). In formula (1), Q1 represents a group represented by formula (Q-1). Q2 represents =O, =S, =NRq1, or =CRq2Rq3, Rq1-Rq3 eac...
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WO/2023/100843A1 |
[Problem] To provide a curable resin composition capable of forming solder resists which combine long-lasting low glossiness and resultant long-term freedom from solder adhesion with withstand voltage on a high level. [Solution] A curabl...
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WO/2023/100676A1 |
The present invention provides novel hollow silica particles which have sufficiently low relative dielectric constant and sufficiently low dielectric loss, while exhibiting excellent dispersibility in a resin. The hollow silica particles...
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WO/2023/100818A1 |
Provided is a thermally conductive sheet that has favorable thermal conductivity and that also has high transparency. The thermally conductive sheet comprises a resin layer containing a resin and a thermally conductive filler, wherein:...
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WO/2023/100478A1 |
One aspect of the present invention relates to a method for producing a coated resin particle, the method comprising a step of bringing water-absorbing resin particles into contact with a coating material so as to form a coating layer on...
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WO/2023/102462A1 |
A stent for a respiratory organ includes a bioabsorbable polyester copolymer. The bioabsorbable polyester copolymer is a polyester copolymer having residues of two kinds of ester bond forming monomers as main constituent units, and where...
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WO/2023/100257A1 |
Provided is a marine biodegradation promoter that is a hydrophobic, thermoplastic powder composed of a compound in which ionic bonds bond a metal cation having a valence of two or higher and a monovalent organic anion derived from a subs...
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WO/2023/100806A1 |
The present invention relates to a film containing a polyimide and an acrylic resin, wherein, within the plane of the film, the refractive index n1 in a first direction in which the refractive index is at a maximum and the refractive ind...
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WO/2023/092227A1 |
A low emissivity material and associated methods are provided. Provided is a low emissivity material comprising a low emissivity pigment, the pigment comprising a conductive nanomaterial and a resin. The pigment is dispersed into the res...
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WO/2023/095828A1 |
Provided is a colored resin composition that can be used as a color filter for a solid-state imaging element that is capable of advanced imaging by not only spectrally splitting light in the visible region into three colors, but also by ...
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WO/2023/095493A1 |
The present invention addresses the problem of providing a coating rubber composition for a tire-reinforcing material, which exhibits excellent resistance to thermal degradation. In order to solve the foregoing, this coating rubber compo...
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WO/2023/095480A1 |
The present invention addresses the problem of providing a coating rubber composition for tire-reinforcing materials which attains excellent crack resistance after thermal deterioration. This coating rubber composition for tire-reinforci...
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WO/2023/095783A1 |
Provided is a novel modified vinyl ester resin that, when combined with a crosslinkable resin, can produce a cured product that exhibits exceptional dielectric properties. Also provided is a resin composition that contains this modified ...
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WO/2023/095494A1 |
The present invention addresses the problem of providing a coating rubber composition for reinforcement materials for tires, the coating rubber composition having excellent thermal deterioration resistance and excellent cracking resistan...
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WO/2023/095826A1 |
A graft copolymer (A) obtained by graft polymerizing 20-70 mass parts of a monomer composition including an aromatic vinyl monomer (b) in the presence of 30-80 mass parts of an ethylene polymer (a) (where the total of the ethylene polyme...
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WO/2023/095813A1 |
Provided is a resin composition including a conjugated polyene and a modified ethylene-vinyl alcohol resin having 1-16.5 mol% of a primary hydroxyl group structural unit in a side chain as a modified ethylene-vinyl alcohol resin composit...
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WO/2023/095593A1 |
This molded body contains a liquid crystal polymer powder and optionally contains a resin, wherein the liquid crystal polymer powder contains fibrous particles formed from a liquid crystal polymer, the average diameter of the fibrous par...
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WO/2023/090990A1 |
Disclosed herein is a composition comprising a resin material, a filler material, and graphene flakes. Also disclosed herein is a composition comprising a resin material, a filler material, graphene flakes, and a curing agent. The materi...
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WO/2023/090457A1 |
Provided are adhesive particles capable of sufficiently enhancing adhesiveness, suppressing peeling from base materials, and highly accurately controlling a gap between the base materials. Adhesive particles (1) according to the presen...
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WO/2023/090403A1 |
The purpose of the present invention is to provide a carbon nanotube dispersion capable of forming a molded body having excellent conductivity. A carbon nanotube dispersion according to the present invention contains carbon nanotubes and...
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WO/2023/089998A1 |
Provided are a curable composition which has high compatibility even when containing a hydrocarbon resin (hydrocarbon plasticizer) having extremely low polarity and a cured product of which has a low dielectric loss tangent, a cured prod...
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WO/2023/090538A1 |
The present invention relates to a category 6 (C6) unshielded twisted pair (UTP) cable satisfying plenum-rated high flame retardancy. Specifically, the present invention relates to a highly flame-retardant UTP cable, which satisfies NFPA...
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WO/2023/090022A1 |
Provided is a pneumatic tire configured to reduce rolling resistance due to gauge thinning of a belt, and also to suppress a reduction in durability at the ends of a belt layer and deterioration of moist heat resistive adhesiveness of th...
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WO/2023/089840A1 |
The present invention provides: a molded body containing a cellulose-based nanomaterial and a thermoplastic resin, and having improved mechanical strength and thermal properties; and a method for manufacturing same. The present inventi...
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WO/2023/091578A1 |
Thermosetting resin compositions in a flowable state useful for liquid compression molding ("LCM") or stencil printing application are provided, reaction products of which become non-flowable after exposure to an elevated temperature and...
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WO/2023/090374A1 |
This resin composition obtained using a crystalline thermoplastic resin and regenerated carbon fibers, ensures sufficient mechanical strength and exhibits excellent productivity and flame resistance. A molded article and pellets formed f...
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WO/2023/090456A1 |
Provided are adhesive particles capable of sufficiently increasing the adhesiveness. Adhesive particles according to the present invention contain a compound having a structure represented by formula (1). (1): R1-(SiOpR3R4q)n-R2 In f...
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WO/2023/088844A2 |
The invention relates to a line carrier (4) with a line (110), comprising a main part (5) on which the line (110) is arranged. The main part (5) has a first section which consists of a polymer composition or has such a polymer compositio...
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WO/2023/085060A1 |
Provided is a resin composition including semiconductor particles (A) and a resin (B), wherein the content of a polymerizable compound (C) and the content of a polymerization initiator (D) with respect to the total solid content of the r...
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WO/2023/085280A1 |
A curable resin composition containing a prepolymer (A) having a reactive silyl group, an epoxy compound (B), and a photoacid generator (C).
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WO/2023/084906A1 |
Provided is a composition for forming a wavelength conversion film for a display which yields a wavelength conversion film having excellent wavelength conversion efficiency and has excellent storage stability. The composition for forming...
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WO/2023/085002A1 |
The present invention relates to a method for producing a resin composition containing chlorine atoms, said method comprising the following steps 1-3, wherein step 1 is carried out first. Step 1: a step for mixing an anionic polymer an...
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WO/2023/085441A1 |
The present invention provides: a mixture which contains a polysaccharide and a block copolymer of a hydrophilic polymer and a polymer having a lower critical solution temperature; a structure which is obtained by removing the block copo...
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WO/2023/085061A1 |
The present invention provides a resin film that contains semiconductor particles (A), and a display device that contains said resin film. When the resin film is subjected to a first exposure test involving exposure to light at a radiant...
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WO/2023/085034A1 |
Provided are surface-treated inorganic particles from which a curable composition having good handling and storage stability, and a cured product having good thermal conductivity can be formed. Surface-treated inorganic particles (D) hav...
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WO/2023/085808A1 |
The present embodiment provides a composite film in which a plurality of composite inorganic particles, which are inorganic particles having a fluoropolymer coating film formed therein, are sintered to form a plane shape. Therefore, the ...
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WO/2023/085225A1 |
Provided is a method for manufacturing a recycled resin composition, the method enabling horizontal recycling. The method for manufacturing a recycled resin composition includes: a step for melting and kneading a molded body containing...
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WO/2023/085421A1 |
Provided are: a resin composition which can be reduced in HF gas evolution when molded with heating, has excellent heat resistance, and does not take a color; a molded object obtained by molding the resin composition with heating; and a ...
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WO/2023/085059A1 |
Provided is a resin composition including semiconductor particles (A) and a resin (B), wherein the content of a polymerizable compound (C) and the content of a polymerization initiator (D) with respect to the total solid content of the r...
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WO/2023/085058A1 |
Provided is a resin composition including semiconductor particles (A) and a resin (B), wherein the content of a polymerizable compound (C) and the content of a polymerization initiator (D) with respect to the total solid content of the r...
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WO/2023/084951A1 |
An additive according to the present invention is configured so as to be used in chemical-mechanical polishing and contains a polymer (P). The polymer (P) has a structural unit (A) derived from a vinyl monomer having a -(LO)n-R group; th...
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WO/2023/085003A1 |
The present invention relates to a halogenated resin composition comprising a plasticizer, a polymeric dispersant, a basic inorganic filler, and a halogenated resin, wherein the polymeric dispersant contains a structural unit having a ca...
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WO/2023/085680A1 |
A thermoplastic resin composition of the present invention comprises: approximately 100 parts by weight of polycarbonate resin including approximately 70-95 wt% of linear polycarbonate resin and approximately 5-30 wt% of branched polycar...
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WO/2023/084961A1 |
Provided is a protective film-forming composition that can form a protective film having excellent resistance to a wet etchant for semiconductors, and that can also be effectively used as a composition for forming a resist underlayer fil...
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WO/2023/080202A1 |
A thermally conductive composition according to the present invention comprises a liquid polymer, a thermally conductive filler, and a structural viscosity-imparting agent, wherein the viscosity ratio (η1/η3) of a viscosity η1 measure...
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