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WO/2024/043261A1 |
An azo compound represented by formula (1) or a salt thereof. (In formula (1), Ar indicates a benzene ring which may have a substituent, a naphthalene ring which may have a substituent, or a heterocycle which may have a substituent, and ...
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WO/2024/043326A1 |
Provided is a hydrophilic oil repellent polymer having excellent shape transferability during molding that exhibits a high antifouling property in humid environments due to having high oil repellency in water. The polymer comprises: a ...
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WO/2024/043327A1 |
Provided is a polymer that exhibits water repellency and oil repellency, has excellent functionality in suppressing the adhesion of slime, and exhibits excellent shape transferability when molded. Also provided are a resin composition, a...
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WO/2024/038884A1 |
The purpose of the present invention is to provide a resin composition for cleaning a molding machine. The resin composition has both high cleaning power for a molded material before cleaning and easy replaceability for a material to be ...
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WO/2024/038845A1 |
The present disclosure relates to a resin composition that contains a thermosetting resin and a modified styrene elastomer having an N-substituted succinimide group in a side chain.
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WO/2024/038900A1 |
[Problem] To provide: an organic solvent-dispersed silica sol which contains a silicone compound; a composition using the organic solvent-dispersed silica sol; and an insulated covered conductive wire. [Solution] A silicone compound-cont...
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WO/2024/038887A1 |
As a polymer composition which makes it possible to fabricate, via a simple process, a single-layer retardation material which has an NZ coefficient in the range of -0.05≤NZ≤0.6 and a high phase difference value as a thin-film, the p...
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WO/2024/035116A1 |
The present invention relates to a composition for a coating protecting film comprising: an acrylic emulsion resin; a polyurethane dispersion; and a polyolefin resin, wherein the acrylic emulsion resin has a weight average molecular weig...
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WO/2024/034650A1 |
The present invention provides a viral infection inhibitor mostly capable of preventing yellowing of the inhibitor even when placed in a high-temperature environment. This viral infection inhibitor contains: a carrier which has a specifi...
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WO/2024/034345A1 |
The purpose of the present invention is to provide: a protective film formation agent that is used, in dicing of a semiconductor wafer, in order to form a protective film on the surface of the semiconductor wafer, and that is capable of ...
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WO/2024/034604A1 |
The present invention provides a novel method for producing boron nitride. A method for producing a boron nitride composition that contains granular boron nitride according to the present invention is characterized by heating an iron bor...
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WO/2024/034647A1 |
The present invention provides an antibacterial and antiviral agent that can generally prevent yellowing of a molded article obtained by kneading the same into a synthetic resin and molding the mixture. An antibacterial and antiviral age...
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WO/2024/034445A1 |
Provided are: a resin composition containing a compound represented by formula (1), particles, a resin, a polymerizable monomer having an ethylenically unsaturated bond-containing group, and a solvent; a film using said resin composition...
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WO/2024/033713A1 |
Hyperbranched polyester polyols having 40 to 60% linear carbons, based on the total number of linear, dendritic, and terminal carbons are used as polymer processing additives. Compositions containing a thermoplastic polymer and such poly...
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WO/2024/033348A1 |
A curable composition comprising component a) comprising at least one alkali or alkaline earth metal carboxylate, component b) comprising at least one amidine and/or guanidine and component c) comprising at least one silane functionalize...
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WO/2024/029602A1 |
The present invention provides: a cured molded product having excellent moldability and reliability, and having high thermal conductivity, low water absorption, low thermal expansion, high heat resistance, and flame retardancy; in additi...
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WO/2024/029463A1 |
The present invention provides a ceramic powder wherein: the circularity C50 at a cumulative volume of 50% from the lowest circularity side in the number-based cumulative circularity distribution is 0.83 or more; and the circularity C10 ...
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WO/2024/029491A1 |
The present invention provides a copolyester comprising 3-hydroxybutyric acid and exhibiting high biodegradability, and a method for producing said copolyester. A copolyester according to the present invention is a copolyester of 3-hydro...
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WO/2024/029492A1 |
The present invention provides a copolyester comprising 3-hydroxybutyric acid which, while exhibiting high biodegradability, can suppress hydrolysis properties and bad odor by controlling the acid value derived from a degradation product...
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WO/2024/029220A1 |
The purpose of the present invention is to provide a method for producing a PHA having a low moisture content. The above is addressed by providing a method for producing a PHA that comprises a filter press filtration step for filtering a...
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WO/2024/029312A1 |
One embodiment of the present invention relates to a thermoplastic resin composition for an electromagnetic wave absorber, said composition comprising a thermoplastic resin (A), carbon nanotubes (B) having an average diameter of 1-15 nm,...
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WO/2024/029464A1 |
The present invention provides an alumina powder which comprises alumina particles having a circle-equivalent diameter of less than 0.3 µm, wherein: the particle diameter D10 at a cumulative percentage of 10% from the finest particle si...
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WO/2024/029514A1 |
The present invention addresses the problem of providing a PHA having good heat stability even in a pH range where it is not necessary to use corrosion resistant devices. The aforesaid problem is solved by a method for producing a PHA th...
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WO/2024/029615A1 |
The present invention provides a curable composition which contains: (A) an organic polymer which has a reactive silicon group; and (B) a curing catalyst which contains, as constituent components, (b1) an ammonium hydroxide compound, (b2...
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WO/2024/029475A1 |
Provided is a wavelength conversion film forming composition that has excellent curability in air and that provides a wavelength conversion film having good light resistance. The wavelength conversion film forming composition contains (A...
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WO/2024/029996A1 |
The present invention relates to a polymer compound composition with a low caloric value and a product utilizing same. Specifically, the present invention relates to a composition that satisfies the criteria of "Gas Toxicity Test" accord...
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WO/2024/029543A1 |
Provided are: a resinous liquid suitable for producing shaped objects including three-dimensional metallic structures; and a method for forming a shaped object. The resinous liquid comprises a radical photocurable resin, a heat-curable r...
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WO/2024/024883A1 |
A sheet for molding/underfill encapsulation of a printed circuit board comprising a plurality of electronic components and a substrate and having spaces between the electronic components and the substrate, the sheet being made of a heat-...
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WO/2024/024508A1 |
This composition contains a colorant, a curable compound and a solvent. The solvent contains an aromatic compound having 8 or more carbon atoms and having a molecular weight of 500 or less. The content of the aromatic compound in the com...
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WO/2024/024846A1 |
The present invention relates to a recycled polyamide resin composition obtained by melt kneading a polyamide resin (a) or a polyamide resin composition (A) containing a polyamide resin (a) as the main component, polyamide resin waste (B...
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WO/2024/024162A1 |
Provided is a carbon material dispersion capable of forming a coating film that has improved conductivity compared to when a single carbon material is used. The carbon material dispersion contains: at least two types of carbon materials ...
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WO/2024/024361A1 |
The present invention provides a plasticizing agent for biodegradable resins, the plasticizing agent being characterized by containing a biodegradable component and an inorganic material powder at a mass ratio of 50:50 to 10:90, while co...
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WO/2024/024362A1 |
The present invention provides a resin composition that contains a biodegradable resin, an inorganic powder, and additives, wherein the mass ratio of the biodegradable resin and the inorganic powder is 10:90 to 70:30, the additives compr...
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WO/2024/024950A1 |
The present invention pertains to: a secondary battery binder composition, an electrode composition, an electrode sheet, and a secondary battery, all of which include a water-soluble polymer (X) formed through polymerization using an azo...
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WO/2024/024657A1 |
A first problem addressed by the present invention is to provide a curable composition with which a cured film that is obtained by curing same exhibits excellent adhesiveness and exhibits excellent low-reflectivity with respect to infrar...
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WO/2024/024833A1 |
Provided are: a resin composition containing a cyclized resin precursor and a compound B in which the thermal decomposition start temperature at which an amine is generated is equal to or less than 200°C, as measured by means of the sim...
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WO/2024/024438A1 |
A clathrate compound containing a host molecule and a guest molecule in which the host molecule is a compound represented by formula (1) or a cyclic oligosaccharide and the guest molecule is a squarylium compound represented by formula (...
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WO/2024/024667A1 |
Provided is a resin composition that exhibits excellent moldability while containing a relatively large amount of cellulose. This resin composition contains (A) an aliphatic polyester-based resin and (B) cellulose. The content of the c...
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WO/2024/024363A1 |
The present invention provides a resin composition. The resin composition comprises a biodegradable resin, an inorganic powder, and borax. The mass ratio between the biodegradable resin and the inorganic powder is 10:90 to 70:30. The bio...
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WO/2024/024662A1 |
Provided are a resin composition and a molded object. A resin composition comprising, with respect to 100 parts by mass of resin components including a polybutylene terephthalate resin, 2-15 parts by mass of an elastomer, 3-20 parts by m...
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WO/2024/024604A1 |
The purpose of the present invention is to provide: a highly pure metal composite oxide having excellent thermal conductivity and dielectric characteristics; and a method for efficiently producing said metal composite oxide. Specifically...
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WO/2024/024784A1 |
A structure 100 is provided with a fiber substrate 35 and a resin matrix 30 impregnated in the fiber substrate 35. The fibers of the fiber substrate 35: comprise an organic material core and an organic material modified layer which cover...
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WO/2024/024951A1 |
The present invention provides: a binder composition for a secondary battery, the binder composition containing a water-soluble polymer (X) and a water-soluble polymer (Y), wherein the water-soluble polymer (X) is a polymer containing 20...
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WO/2024/024831A1 |
The present invention relates to a recycled polyamide resin composition obtained by melt kneading: a polyamide resin (a) or a polyamide resin composition (A) containing the polyamide resin (a) as a primary component; and a polyamide-base...
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WO/2024/024603A1 |
The purpose of the present invention is to provide a metal complex oxide having excellent thermal conductivity and dielectric property; a resin composition that contains the metal complex oxide and that can express excellent thermal cond...
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WO/2024/024494A1 |
The present invention provides a photosensitive composition that suppresses development residue and makes it possible to form a cured film that has excellent substrate adhesion. This photosensitive composition includes a resin, a coloran...
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WO/2024/024213A1 |
A thermosetting resin composition containing (A) a thermosetting resin, (B) an ethylenically unsaturated monomer, (C) an ethylenically unsaturated group-containing phosphoric acid ester compound, (D) a low shrinkage agent, (E) an inorgan...
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WO/2024/024850A1 |
Provided is a prepreg capable of developing dimensional stability of a substrate (laminated plate). Also provided are a laminated plate, a printed wiring board, and a semiconductor package obtained using the prepreg. Specifically, provid...
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WO/2024/024429A1 |
The present invention provides a water absorbent resin composition which contains a crosslinked polymer (A) that has a structure wherein the surface is crosslinked by means of a surface crosslinking agent (c), anionic water-insoluble sil...
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WO/2024/024818A1 |
[Problem] To provide a simpler method for producing a high-quality metal-organic structure. [Solution] The method for producing a metal-organic structure according to the present invention comprises: providing a stirrer equipped with a...
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