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WO/2022/210686A1 |
The present invention provides: a resin composition which has high thermal conductivity, high insulation properties and high heat resistance, while forming a sheet that has excellent handling properties; a cured product sheet; a composit...
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WO/2022/210785A1 |
The present invention provides a composition containing a polymerizable compound, inorganic microparticles, and a photopolymerization initiator, wherein the inorganic microparticle content is 30 vol% or more, and the curing depth is 100 ...
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WO/2022/206509A1 |
Embodiments of the present application provide a thermally-conductive material and a fabrication method therefor, a prepreg, a laminate, and a circuit board, which relate to the technical field of nanomaterials, and are used for providin...
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WO/2022/208165A1 |
A first epoxy resin composition is described that includes [A] at least one epoxy resin, [B] at least two hardeners comprising [B-l] at least a first hardener and [B-2] at least a second hardener different from the first hardener, and [C...
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WO/2022/210384A1 |
This resin composition for encapsulating comprises an epoxy resin, a curing agent, and an inorganic filler. The epoxy resin includes an epoxy resin having 2-6 epoxy groups per molecule, and the curing agent includes a compound having 2 o...
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WO/2022/210945A1 |
[Problem] To provide a curable resin composition that has good resolution in a resultant dried coating film and exhibits minimal adhesion even if cured products are stacked after heat curing and stored in a high temperature environment. ...
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WO/2022/212199A1 |
A thermoset composition includes an epoxy prepolymer, an amine hardener, a reactive diluent, and an accelerator for crosslinking reactions. A method for making the degradable and recyclable epoxy resin includes mixing an epoxy prepolymer...
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WO/2022/211653A1 |
The invention relates to a method for producing an aqueous epoxy dispersion. The method for producing an aqueous epoxy dispersion includes preparing a suspension of a nanomodifier in an epoxy resin or a mixture of epoxy resin and an orga...
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WO/2022/201985A1 |
The present invention addresses the problem of providing: a modified epoxy resin that has excellent flexibility and adhesiveness, has good reactivity to a curing agent, and is capable of exhibiting characteristics even when combined with...
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WO/2022/203042A1 |
[Problem] To provide an ultraviolet-ray-curable organopolysiloxane composition which contains a silicon atom, can be cured into a product having a small light transmittance in a specified ultraviolet ray wavelength range, and has excelle...
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WO/2022/202427A1 |
[Problem] To provide a thermosetting resin composition capable of easily individualizing chips by a step for individualizing chips one-by-one after batch sealing a plurality of chips using a thermosetting resin composition in production ...
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WO/2022/202792A1 |
A thermosetting resin composition according to the present invention contains (A) an epoxy resin, (B) a curing agent, and (C) a high-permittivity filler, wherein: the high-permittivity filler (C) contains 50 mass% or more calcium titanat...
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WO/2022/202394A1 |
The first problem addressed by the present invention is to provide a composition with which it is possible to form a cured product that is superior in terms of achieving high permeability and low magnetic loss, that has a superior hole f...
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WO/2022/202505A1 |
This electrically conductive resin composition contains (A) silver-containing particles, (B) a (meth)acrylic compound, and (C) at least one polyfunctional epoxy compound selected from compounds represented by general formula (1).
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WO/2022/202939A1 |
[Problem] To provide a curable resin composition that can be suitably used as a paste for coating or filling a printed wiring board having a high degree of wiring formation freedom, the curable resin composition making it possible to obt...
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WO/2022/201979A1 |
This resin composition contains a curable resin. When a cured product of the resin composition is subjected to thermogravimetric analysis from 30°C to 800°C at a heating rate of 90°C/min, the amount of outgas generated from the cured ...
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WO/2022/199134A1 |
The present invention relates to a lightweight organic composite material and a preparation method therefor. Specifically disclosed is an organic composite material based on thermally expandable microspheres. The organic composite materi...
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WO/2022/202886A1 |
The purpose of the present invention is to provide: a resin composition which has a small dielectric constant, a small dielectric loss tangent, high transparency, high solubility and high heat resistance and can be used suitably as a low...
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WO/2022/201890A1 |
The present invention addresses the problem of providing an epoxy resin composition excellent in terms of strength, elastic modulus, elastic modulus in wet-heat environments, and heat resistance after moisture absorption, the epoxy resin...
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WO/2022/202629A1 |
The present invention is a polyester elastomer resin composition that has superior strong acid resistance and thermal aging resistance and is suitable for extrusion molding, said polyester elastomer resin composition including: 50-90 par...
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WO/2022/202894A1 |
Provided are: a resin composition which has a low dielectric constant, a low dielectric loss tangent, high transparency, high solubility and high heat resistance and which can be advantageously used as a low dielectric material; a film f...
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WO/2022/202781A1 |
A thermosetting resin composition according to the present invention comprises: a thermosetting resin, a high dielectric constant filler having a specific dielectric constant at 25ºC and 25 GHz of 10 or higher; and an active ester compo...
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WO/2022/202683A1 |
The present disclosure addresses the problem of providing a thermosetting composition with which it is possible to achieve a long pot life, excellent thermosetting properties, and excellent photocuring properties that enables temporary b...
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WO/2022/202498A1 |
[Problem] To provide a silicon-atom-containing ultraviolet-curable composition which gives cured objects having excellent flexibility and which has excellent applicability to substrates. [Solution] This ultraviolet-curable composition is...
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WO/2022/202804A1 |
A thermosetting resin composition of the present invention comprises a thermosetting resin (A) and a high-dielectric constant filler (C). The high-dielectric constant filler (C) includes at least one selected from calcium titanate, stron...
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WO/2022/196696A1 |
The present invention addresses the problem of providing a resin sheet in which unevenness after lamination can be suppressed and warping after curing can be suppressed. The present invention provides a resin sheet which comprises a supp...
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WO/2022/190600A1 |
Provided is an insulating resin composition excelling in embeddability in metal wiring patterns, semiconductor IC, etc., even when highly filled with an inorganic filler. The insulating resin composition comprises an epoxy resin (A), a m...
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WO/2022/190745A1 |
A curable resin composition that contains (A) a cyanate ester resin, (B) an epoxy resin, (C) an active hydrogen–containing amine latent curing agent, and (D) an ion scavenger. The (A) cyanate ester resin is preferably one type of compo...
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WO/2022/190647A1 |
A magnetic paste which comprises an epoxy resin (A) having an aromatic ring, an epoxy compound (B), a soft-magnetic powder (C), and a hardener (D), wherein the (A), (B), and (D) components have 25°C viscosities which have relationships ...
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WO/2022/192294A1 |
An epoxy composition containing CNS-derived fragments provides conductivity and surface hardness. In one illustration, the epoxy composition includes carbon nanostructures, fragments of carbon nanostructures, fractured carbon nanotubes, ...
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WO/2022/191238A1 |
Provided is a thermally conductive resin composition which can have improved thermal conductivity while being inhibited from having an increased viscosity. The thermally conductive resin composition comprises a first resin phase, a secon...
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WO/2022/186203A1 |
The present invention provides an epoxy-based composition that has excellent fluidity, low heat generation during curing, cures in a short time at room temperature, and can be used to obtain a cured product having excellent mechanical st...
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WO/2022/186219A1 |
The present invention addresses the problem of providing a resin composition capable of giving cured objects which can have a lower dielectric dissipation factor, can be inhibited from having cracks after desmearing, and have an excellen...
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WO/2022/187580A1 |
Liquid epoxy-based adhesive compositions are provided, which upon curing result in crash durable and stress resistant cured bonds on both steel and other materials in particular metals such as aluminum; and in some embodiments are weldab...
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WO/2022/185832A1 |
The present invention relates to an epoxy resin composition having excellent low-temperature curability and excellent permeability through narrow clearances. This epoxy resin composition contains components (A) through (C). Component (A)...
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WO/2022/186361A1 |
Provided is a curable resin composition containing: an epoxy resin; a curing agent; and a linear polysiloxane compound that has a structural unit having an epoxy group and an alkoxy group, and that also has a polymerization degree of 3 o...
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WO/2022/186603A1 |
The present invention relates to a graft copolymer, and to a core-shell type graft copolymer, a curable resin composition comprising same, and methods for preparing same, the graft copolymer comprising: a core including a rubbery polymer...
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WO/2022/186191A1 |
[Problem] To provide hexagonal boron nitride agglomerated particles and a hexagonal boron nitride powder, each of which can impart extremely high dielectric strength and heat conductivity to a resin composition produced by filling the he...
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WO/2022/185344A1 |
The embodiments herein disclose a system and method for developing a low-cost composite sheet for EMI shielding applications. A composite sheet is developed comprising of a continuous matrix with randomly dispersed conductive particulate...
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WO/2022/186101A1 |
[Problem] To provide a fast-curing epoxy resin composition having a long pot life. [Solution] An epoxy resin composition containing a curing agent A, a curing agent B, a curing agent C, an epoxy resin D, an epoxy resin E, and resin parti...
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WO/2022/187451A1 |
Covalent network polymers that include one or more of a cure rate modifying (CRM) additive, a tack modifying additive, a flame retardant additive, a physical additive, and a viscosity modifying additive allow the viscosity, pot life, tac...
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WO/2022/186316A1 |
The present invention addresses the problem of providing a curable resin composition that achieves both vibration-damping properties and rigidity at high temperature. A curable resin composition according to the present invention contain...
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WO/2022/181387A1 |
Provided are: hollow particles with which the low dielectricity of an electrical material, which is obtained from a resin composition containing the hollow particles, can be achieved; a production method therefor; and a use of said hollo...
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WO/2022/179827A1 |
The present invention is directed to a photo-curable adhesive or sealant composition comprising, based on the weight of the composition: from 1 to 10 wt.% of a) at least one oxetane compound according to Formula (I) wherein: R1 and R2 ar...
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WO/2022/179826A1 |
The present invention is directed to a photo-curable adhesive or sealant composition comprising, based on the weight of the composition: from 1 to 10 wt.%, of a) at least one oxetane compound according to Formula (I) wherein: R1, R2, R3,...
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WO/2022/182342A1 |
An electrochemical oxygen sensor includes a sensing surface having a working electrode and a reference electrode, a hydrophilic layer formed from an oxygen diffusion-limiting layer emulsion overlaying the working electrode and a hydropho...
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WO/2022/178700A1 |
This invention relates to a photocurable adhesive composition comprising at least one first hydroxyl terminated epoxidized unsaturated polyolefin having an epoxide equivalent weight less than 250 g/eq; at least one second hydroxyl termin...
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WO/2022/177283A1 |
The present invention relates to a coating composition, for a metal, with improved oil resistance and adhesiveness and a preparation method therefor, and a metal article coated with the composition and, more specifically, to a compositio...
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WO/2022/177006A1 |
The present invention provides: a resin composition containing an elastomer, an epoxy compound and a thermal polymerization initiator; a cured material of the resin composition; a laminate comprising a substrate film and a transparent re...
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WO/2022/176324A1 |
Provided are an epoxy resin that can increase durability when used together with a rubber material, and a production method for the epoxy resin. The present invention is characterized in that a diene polymer is grafted to the main chai...
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