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WO/2022/091732A1 |
The present invention provides an aqueous epoxy resin composition which contains (A) an epoxy resin, (B) a polyester resin that has a sulfonate group, (C) an aromatic nonionic surfactant, and an aqueous medium, and which is characterized...
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WO/2022/088247A1 |
A magnetic dielectric resin composition, and a prepreg and a copper clad laminate comprising same. The magnetic dielectric resin composition comprises a resin and a magnetic filler. The absolute value of the temperature drift coefficient...
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WO/2022/088239A1 |
Provided are a maleimide-modified active ester, a preparation method therefor and the use thereof. Raw materials for preparing the active ester comprise: a diphenol compound having the structure as shown in formula A1, a diacyl compound ...
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WO/2022/089460A1 |
The present invention provides a reactive fluorosilicone resin, a preparation method therefor and an application thereof. The reactive fluorosilicone resin is used as an additive, such that an added material has a low dielectric constant...
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WO/2022/088219A1 |
A 4D-printed electrically responsive folding/unfolding composite material, a fabricating method therefor, and a shape memory behavior regulating method thereof. In a layer-by-layer printing process, an electrically conductive layer is em...
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WO/2022/090821A1 |
A method of making a coated abrasive article includes disposing a precursor make layer on a major surface of the backing, optionally partially curing the precursor make layer to provide a partially cured precursor make layer, disposing a...
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WO/2022/089459A1 |
Disclosed are a reactive phosphorus-silicon synergistic flame retardant, a polymeric phosphorus-silicon synergistic flame retardant, preparation methods therefor and applications thereof. The reactive phosphorus-silicon synergistic flame...
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WO/2022/088248A1 |
Provided are a magnetic dielectric resin composition and an application thereof, the magnetic dielectric resin composition comprising resin and a magnetic filler, the magnetic filler being a composition of a positive temperature drift co...
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WO/2022/089468A1 |
A polymeric flame retardant, a preparation method therefor and the use thereof. The polymeric flame retardant has excellent compatibility with an added polymer system and has excellent flame retardancy. The preparation process thereof is...
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WO/2022/088597A1 |
Disclosed are a low-smoke high-toughness halogen-free flame-retardant PBT/PTT composite, a preparation method therefor and the use thereof. The low-smoke high-toughness halogen-free flame-retardant PBT/PTT composite comprises the followi...
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WO/2022/085522A1 |
Provided is a liquid resin composition which retains low-warpage characteristics and is excellent in terms of heat resistance, chemical resistance, and the property of wetting heat-resistant insulating coats. The liquid resin composition...
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WO/2022/085517A1 |
The purpose of the present invention is to provide a boron nitride material that is suitable as an insulation material that can be applied to a high-frequency circuit board. The present invention relates to a boron nitride material hav...
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WO/2022/085563A1 |
A resin composition comprising a polyester-polyurethane resin (A) and an epoxy resin (B), in which an isocyante component constituting the polyester-polyurethane resin (A) comprises an isocynate compound that has a hydrocarbon group havi...
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WO/2022/085270A1 |
Provided is a rubber composition containing: 100 parts by mass of a chloroprene polymer; more than 0 part by mass and 25 parts by mass or less of a diene polymer having an epoxy group; 0.2 to 2.5 parts by mass of at least one selected fr...
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WO/2022/083134A1 |
A rock-like similar material and a preparation method therefor. The preparation method comprises: acquiring an aggregate composition of a target rock and a volume ratio of an aggregate cement; mixing, stirring and curing a corresponding ...
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WO/2022/085763A1 |
Provided is a resin composition that is used as a laser-transmitting resin member during laser welding and that is capable of laser marking. Also provided are a molded article using the aforementioned resin composition, use of a resin co...
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WO/2022/085532A1 |
Provided are: an encapsulation resin composition that enables a reduction in the elastic modulus of a cured article and makes it less likely for there to be an increase in viscosity during molding; and an electronic device. This encapsul...
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WO/2022/084601A1 |
The invention relates to a reinforced product comprising at least one metal reinforcing element embedded in a rubber composition including at least one epoxidized diene elastomer, a reinforcing filler, and a crosslinking system containin...
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WO/2022/085593A1 |
The present invention provides a thermoplastic polyester elastomer resin composition that is suitable for foam molded bodies that have excellent light-weightedness, rebound resilience, and surface smoothness. A thermoplastic polyester el...
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WO/2022/080129A1 |
A cooling system component for vehicles, said cooling system component being capable of coming into contact with a fluid that contains water. This cooling system component for vehicles is obtained by injection molding a resin composition...
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WO/2022/080078A1 |
The present invention provides a curable composition giving thermally conductive materials excellent in terms of thermal conductivity and heat resistance, a thermally conductive material, a thermally conductive sheet, and a device with a...
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WO/2022/075191A1 |
This resin molding material contains (A) soft magnetic particles, (B) a fine silica powder that has an average particle diameter of from 0.1 μm to 2.0 μm, and (C) a thermosetting resin. The content of the soft magnetic particles (A) is...
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WO/2022/075186A1 |
The resin molding material of the present invention is used in transfer molding or compression molding, contains (A) soft magnetic particles, (B) a silicone compound that is liquid at normal temperature (25°C), and (C) a thermosetting r...
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WO/2022/073314A1 |
Disclosed in the present invention are a durable super-hydrophobic composite coating and a preparation method therefor. An ACNTB-SiO2-coupling agent suspension is applied, in parts by weight, onto the surface of a gel of a mixture of an ...
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WO/2022/075213A1 |
A two-part curing composition set which is equipped with: a first agent which contains an epoxy-modified organopolysiloxane A1 having an epoxy group-containing group and also contains a thermally conductive filler B1; and a second agent ...
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WO/2022/075214A1 |
A two-part curable composition set that comprises a first agent and a second agent, the first agent including an epoxy-modified organopolysiloxane formed by replacing a portion of the methyl groups of dimethyl silicone with a substituent...
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WO/2022/074945A1 |
Provided is a metal particle-containing resin composition which exhibits excellent electrical conductivity, heat-dissipating properties and adhesion to a smooth surface such as a glass substrate. This metal particle-containing resin co...
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WO/2022/075221A1 |
Provided is a resin composition containing a polyphenylene ether derivative (A) and a fluorine resin filler (B). Also provided are a metal foil with a resin, a prepreg, a layered board, a multilayered printed circuit board, and a semicon...
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WO/2022/075453A1 |
A curable resin composition comprising a curable resin and a compound represented by general formula (A). In general formula (A), R11 to R16 each independently represent a hydrogen atom, -CH2OH, or -CH2OR17, R17 representing an alkyl gro...
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WO/2022/069947A1 |
A self-healing resin composition of a polymer formed from the reaction between a thermoplastic polymer having terminal functional groups and a benzoxazine compound is provided. Also provided is a method of forming such a self-healing res...
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WO/2022/070718A1 |
The present invention provides surface-modified boron nitride particles: that have excellent effects in improving the thermal conductivity of a thermally conductive material to be formed; and that can be used to manufacture a thermally c...
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WO/2022/071406A1 |
Provided is a latex that has low environmental impact, has excellent polymer microparticle dispersibility, enables efficient recovery of polymer microparticles from latex, and is useful in novel technologies. Specifically, the present in...
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WO/2022/071645A1 |
The present invention provides a sizing composition and glass fibers using same, the sizing composition enhancing tensile strength, impact resistance and flexural strength of thermoplastic composite material.
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WO/2022/069532A1 |
The present application is directed to pumpable thermally foaming filler compositions based on combinations of a liquid epoxy resin and a polyvinyl chloride resin and/or an acrylic resin powder and at least one alkali metal salt of a fat...
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WO/2022/071150A1 |
Disclosed is a film for temporary fixation which is for use in temporarily fixing a semiconductor member to a support member. The film for temporary fixation includes a curable resin ingredient. The film for temporary fixation, after hav...
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WO/2022/071384A1 |
A dispersion solution according to the present invention satisfies formula (1) when the transmission spectrum in the wavenumber range of 800 cm-1 to 3800 cm-1 of metal oxide particles, the surfaces of which have been modified by means of...
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WO/2022/070695A1 |
Provided are: a liquid crystalline resin composition for a ball bearing anti-sliding wear member, said liquid crystalline resin composition being for use in the production of a ball bearing anti-sliding wear member in which sliding wear ...
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WO/2022/065183A1 |
The first problem addressed by the present invention is to provide a composition which has excellent fluidity and is capable of forming a cured product that has excellent magnetic characteristics and excellent filling adequacy. The secon...
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WO/2022/065029A1 |
A curable composition according to the present invention comprises an infrared light-absorbing pigment, an ultraviolet light-absorbing agent, and a curable compound, wherein 100-5000 parts by mass of the ultraviolet light-absorbing agent...
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WO/2022/062370A1 |
Disclosed in the present invention are a dielectricity and thermal conductivity enhanced bio-based high-temperature-resistant epoxy resin, a preparation method therefor, and an application thereof. The dielectric constant of the epoxy re...
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WO/2022/062306A1 |
Disclosed is an epoxy resin composition with non-matching molar amounts of an epoxy group and active hydrogen. The epoxy resin composition comprises an epoxy resin component and a curing agent component. The Tg of cured products of the e...
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WO/2022/065491A1 |
This composition for dip molding contains at least a nitrile rubber elastomer containing a carboxylic group and an amido group, wherein: the elastomer contains 50-78 wt% of a structural unit derived from a conjugate diene monomer, 17-35 ...
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WO/2022/064972A1 |
An epoxy resin composition is provided which has excellent adhesiveness to dissimilar materials. This epoxy resin composition contains (A) to (E) below: (A) a compound which is liquid at 25°C, has two or more epoxy groups in one mol...
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WO/2022/056668A1 |
Provided are an epoxy resin suitable for sealing a semiconductor, an epoxy resin composition containing the epoxy resin, a cured product prepared by using the epoxy resin composition, a semiconductor sealing material, and a semiconductor...
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WO/2022/059395A1 |
The purpose of the present disclosure is to provide a composition having an excellent balance of continuous discharge and light shielding properties. The present disclosure achieves the above purpose by providing a composition containing...
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WO/2022/058901A1 |
Described is an aggregate (1) for the paving of an outdoor environment, comprising: a plurality of bodies (10), made of wooden material and having a predetermined size; a binding material (11) mixed with the plurality of bodies (10) to b...
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WO/2022/054817A1 |
Provided is a sealing resin composition having favorable curing properties and filling properties and excellent continuous productivity when performing molding for sealing at a low temperature. The present invention pertains to a sealing...
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WO/2022/054874A1 |
The present invention provides a curable resin composition capable of giving a thermally conductive material having excellent peel strength. Also provided are a thermally conductive material, a thermally conductive sheet, and a device wi...
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WO/2022/052106A1 |
A halogen-free thermosetting resin composition and the use thereof. The halogen-free thermosetting resin composition comprises a halogen-free epoxy resin, a styrene-maleic anhydride copolymer, a cyanate ester resin, a maleimide resin, an...
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WO/2022/054747A1 |
The purposes of the present invention are to provide an epoxy resin composition in which an additive contained therein can exhibit its effect efficiently even at high temperatures and to provide a molding material having reduced unevenne...
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