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WO/2023/190419A1 |
The present invention provides a resin composition for molding, the resin composition containing a curable resin, and an inorganic filler that contains silica particles and/or alumina particles, and calcium titanate particles. The conten...
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WO/2023/190466A1 |
The present invention addresses the problem of providing a novel impact modifier for a polyacetal resin, capable of providing a polyacetal resin composition having low VOC emission. The modifier for a polyacetal resin contains a rubber-c...
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WO/2023/189610A1 |
A resin composition containing a thermosetting resin, an inorganic filler, a copolymer, and an inorganic ion scavenger, wherein the copolymer has a (meth)acrylic monomer unit A having an anionic group, a (meth)acrylic monomer unit B havi...
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WO/2023/190191A1 |
This epoxy resin composition comprises an epoxy resin, a styrene-based viscosity adjuster, polyisobutylene and a compatibilizer. The compatibilizer has a diblock structure containing a styrene-derived structure and an olefin-derived stru...
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WO/2023/190309A1 |
A surface-modifier resin composition which is for use in a process comprising a step in which the surface-modifier resin composition is adhered to a surface of a structure including a first region, which is made of a cured epoxy resin co...
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WO/2023/189996A1 |
This resin composition for molding is for collectively sealing: a substrate equipped with an electronic component; a stator core which is fixed onto the substrate and which has a plurality of slots formed in the circumferential direction...
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WO/2023/190456A1 |
Provided is a cured product that has a surface onto which a marking ink can be easily applied, exhibits excellent adhesiveness with the marking ink after curing, and can form a marker having excellent visibility of characters and symbols...
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WO/2023/182495A1 |
[Problem] To provide a curable resin composition for black light shielding for an inkjet, the curable resin composition having excellent surface curability in addition to high light-shielding properties, exhibiting stable adhesion under ...
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WO/2023/181831A1 |
The present invention addresses the problem of providing a low-temperature-curable resin composition and an adhesive which are able to be inhibited from suffering bleeding. Provided is a resin composition comprising (A) an epoxy compou...
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WO/2023/182141A1 |
Provided is a glycidyl amine-type fluorine-containing epoxy compound. The present disclosure relates to a fluorine-containing epoxy compound represented by general formula (1). In general formula (1), n each independently represents an i...
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WO/2023/179260A1 |
Disclosed in the present invention are a natural plant fiber/water-borne epoxy resin composite material and a manufacturing method therefor. The main components of the composite material are natural plant fibers, a water-borne epoxy resi...
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WO/2023/183272A1 |
Provided herein is a two-component thermally-conductive epoxy adhesive.
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WO/2023/182485A1 |
This resin composition for encapsulation is used to produce a single-sided-encapsulation-type structure by single-sided encapsulation of a mother board on which at least one electronic device is mounted. This resin composition for encaps...
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WO/2023/182492A1 |
The present invention provides a curable composition which can form cured objects having both a low degree of thermal expansion and a low modulus. The present invention relates to a curable composition comprising (A) an epoxy compound ...
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WO/2023/181953A1 |
A resin film is formed using a resin composition containing a carboxyl group-containing resin, a corrosion inhibitor having a solubility parameter (SP value) ranging from 17.0 (MPa)1/2 to 25.5 (MPa)1/2 inclusive, and a crosslinking agent.
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WO/2023/182470A1 |
This thermosetting resin composition contains a thermosetting resin, an inorganic filler and a polymer having a mass average molecular weight of 10,000 or more, and is characterized in that aggregated boron nitride particles are containe...
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WO/2023/180631A1 |
There is provided a method for producing an epoxy resin comprising mixing modified tall oil pitch with at least one epoxidized vegetable oil. Additionally, is provided an epoxy resin comprising modified tall oil pitch cross-linked with a...
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WO/2023/181964A1 |
The present invention provides a styrene resin molded body which contains a syndiotactic polystyrene resin, and has heat resistance, flame retardancy and a low transmission loss. The present invention provides a styrene resin molded bo...
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WO/2023/182085A1 |
The present disclosure addresses the problem of providing: a resin composition for sealing that can be used in order to produce a sealing part, the sealing part being capable of having high adhesion with a metal and a semiconductor eleme...
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WO/2023/182627A1 |
The present invention relates to an energy-saving thermal barrier coating composition which dissipates internal heat and reflects external solar energy, thereby lowering the inner temperature of a coated body.
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WO/2023/176397A1 |
Provided is a polycarbonate resin composition characterized by being obtained by blending, with respect to 100 parts by weight of (A) a polycarbonate resin (component A), 0.005-0.07 parts by weight of (B) an epoxy group-containing compou...
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WO/2023/176680A1 |
A composition containing a cationic polymerizable component and an antioxidant, wherein the cationic polymerizable component contains at least one selected from alicyclic epoxy compounds, aliphatic epoxy compounds, aromatic epoxy compoun...
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WO/2023/176703A1 |
The present invention provides a compound which is represented by formula (1). In the formula, R1 represents a hydrogen atom or a methyl group; each of R2 to R5 independently represents a hydrogen atom, an alkyl group having 1 to 10 carb...
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WO/2023/176314A1 |
Provided are: an epoxy resin composition for interlayer insulation, which has excellent adhesion heat resistance and is capable of maintaining good voltage resistance at a high level; a resin sheet for interlayer insulation; a laminate f...
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WO/2023/176768A1 |
The present disclosure provides: an epoxy resin composition that contains (A) an epoxy resin, (B) an aminosilane-based compound, (C) a crosslinking agent that is one or more types selected from the group consisting of a carbodiimide comp...
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WO/2023/176610A1 |
The curable composition contains an infrared absorbing dye, a compound having an epoxy group, an epoxy curing agent having a phenol group, and a solvent. Also provided are a film, an optical filter, a solid-state imaging element, and an ...
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WO/2023/176396A1 |
This aromatic polycarbonate resin composition contains, relative to 100 parts by weight of (A) an aromatic polycarbonate resin (component A), 0.02-0.04 parts by weight of (B) an epoxy group-containing compound (component B), and 0.06-0.1...
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WO/2023/176934A1 |
The present invention addresses the problem of providing: an epoxy resin composition having excellent viscosity stability and attaining high compression characteristics under wet heat conditions and high fracture toughness; and a fiber-r...
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WO/2023/174788A1 |
The present invention relates to a rubber composition based on at least one diene elastomer, a reinforcing filler, a cross-linking system, and comprising an epoxy resin selected from tri(glycidoxyphenyl)methane, tetra(glycidoxyphenyl)eth...
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WO/2023/176284A1 |
According to the present invention, a resin composition includes (A) a nanocrystal magnetic powder that has a particle diameter of 5.5–20 μm, (B) a magnetic powder that has a particle diameter of no more than 2 μm, and (D) a thermose...
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WO/2023/176820A1 |
Provided are: a resin composition for optical-semiconductor encapsulation which has a black color for heightening the contrast of a display and has adequate light-transmitting properties; and a shaped resin object for optical-semiconduct...
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WO/2023/176935A1 |
[Problem] To provide an epoxy resin composition for resin transfer molding having low viscosity and volatility, a cured resin product of which will have excellent balance among elastic modulus under damp heat conditions, heat resistance ...
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WO/2023/176958A1 |
Provided is a resin composition characterized by containing an epoxy resin, a curing agent, a foaming agent, and a filler, the shape of the filler being a flake shape, a plate shape, a needle shape, a fiber shape, or a branch shape, and ...
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WO/2023/170891A1 |
Provided are: an insulating resin composition which contains a biomass material as a starting material and nevertheless can give cured objects having a better surface touch; a cured object obtained from the insulating resin composition; ...
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WO/2023/171028A1 |
Provided is a resin composition that is used as a capillary underfill (CUF) capable of further reducing filament cracking. Provided is a resin composition containing (A) an epoxy resin, (B) a curing agent, and (C) a filler. A cured pro...
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WO/2023/167513A1 |
The invention relates to an epoxy resin composition derived from a non-sugar alcohol composition and a preparation method therefor, and a curable epoxy resin composition including same and a cured product thereof. More specifically, the ...
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WO/2023/167152A1 |
The present invention provides a block copolymer which comprises a polymer block (B) that is mainly composed of a conjugated diene monomer unit, and a polymer block (A) that is mainly composed of a vinyl aromatic monomer unit and/or a po...
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WO/2023/167198A1 |
Provided is a wrap film having excellent barrier properties without external appearance defects such as white spots. In this wrap film, which is made of a resin composition containing a vinylidene chloride-vinyl chloride copolymer, the...
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WO/2023/167505A1 |
The present invention relates to an epoxy resin composition derived from an anhydrosugar alcohol-alkylene glycol composition and a method for preparing same, and a curable epoxy resin composition comprising same and a cured product there...
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WO/2023/167049A1 |
The present invention addresses the problem of providing an epoxy resin composition that contains a bifunctional epoxy resin, a bifunctional compound, and a polymerization catalyst, that has sufficiently long pre-reaction working life, t...
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WO/2023/166973A1 |
The purpose of the present invention is to provide a curable resin composition that cures rapidly and can reduce the occurrence of bleed. That is, this curable resin composition comprises an epoxy resin, a latent curing agent, and an i...
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WO/2023/167267A1 |
[Problem] To provide a curable resin composition from which a cured product having excellent insulation reliability can be formed and which has a suppressed amount of emission of halogen-containing substances during combustion. [Solution...
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WO/2023/162975A1 |
A sealing resin composition according to the present invention contains an epoxy resin (A) and a curing agent (B) that includes a phenolic curing agent obtained from a plant-derived starting material.
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WO/2023/163113A1 |
This encapsulant for an organic EL display element contains a cationic-polymerizable compound, a cationic polymerization initiator, a UV absorber, and a compound having phenolic hydroxyl groups. The mass ratio of the compound having phen...
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WO/2023/162489A1 |
Provided is a resin composition from which a resin film that can undergo EBR, that has high refractive index, transparency, heat resistance, light resistance, moisture resistance, and chemical resistance, and that has a dry etching rate ...
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WO/2023/162068A1 |
A sheet-type insulating varnish (1) to be arranged in a gap between members to be insulated is obtained by forming a thermosetting resin composition into a sheet shape in an uncured or semi-cured state, the thermosetting resin compositio...
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WO/2023/162785A1 |
The present disclosure addresses the problem of providing a resin composition which is capable of achieving a lower thermal expansion coefficient by suppressing the occurrence of ion migration. A resin composition according to the presen...
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WO/2023/163160A1 |
Provided is an electroconductive resin composition capable of forming a shield layer having exceptional adhesiveness to an object being coated even when exposed to high temperature and having exceptional shielding properties for the surf...
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WO/2023/162928A1 |
Provided is a resin composition that can enhance heat dissipating ability of an obtained cured product and that can enhance the flexibility of the obtained cured product. A resin composition according to the present invention contains ...
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WO/2023/162904A1 |
This solid electrolytic capacitor element comprises: a positive electrode foil having a porous portion on a surface layer thereof, and also including a first portion including a first end and a second portion including a second end oppos...
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